Abstract: An apparatus for dispensing solder onto a substrate for mounting a semiconductor chip on the substrate comprises a dispensing body and first and second dispensing channels extending through the dispensing body. Each dispensing channel is operative to receive a separate solder wire to feed the solder wire to an end of the dispensing body facing the substrate. The dispensing channels are further operative to introduce the solder wires in a solid state simultaneously from the end of the dispensing body to be melted upon contact with the substrate which is heated.

Abstract: An apparatus 200 for delivering semiconductor components 212 to a substrate 206a; 206b; 500a; 500b; 500c during semiconductor package manufacturing is disclosed. The apparatus 200 comprises a platform 216 and a plurality of delivery modules 202a, 202b affixed to the platform 216. Each of the plurality of delivery modules 202a, 202b has a support device 204a; 204b for supporting the substrate 206a; 206b; 500a; 500b; 500c, as well as a delivery device 208a; 208b for delivering the semiconductor components 212 to the substrate 206a; 206b; 500a; 500b; 500c. In particular, heights of the support devices 204a, 204 are mutually levelled for conveying the substrate 206a; 206b; 500a; 500b; 500c between the plurality of delivery modules 202a, 202b.

Abstract: A die bonding apparatus and method is provided to automatically adjust a level of a die bonder to compensate for any physical changes occurring in the die bonder during bonding. A bond arm support is drivable to a bonding level to position a die onto a bonding surface, and a bond arm is slidably mounted to the bond arm support for holding and bonding the die. The bond arm is configured to be urged by the bonding surface to move relative to the bond arm support upon contact of the die onto the bonding surface. A measuring device is provided for determining a distance moved by the bond arm relative to the bond arm support during bonding, and a controller is responsive to the distance determined by the measuring device to change the bonding level to which the bond arm support is driven.

Abstract: A method of bonding semiconductor dice onto a substrate first uses an optical assembly to perform pattern recognition of a die bonding section of the substrate in which multiple die pads are located so as to identify positions of the multiple die pads simultaneously during such pattern recognition step. After pattern recognition of the said die bonding section, an adhesive is dispensed with an adhesive dispenser onto at least one of the die pads located in the die bonding section. While the adhesive dispenser is dispensing the adhesive to further die pads located in the die bonding section, a pick-and-place arm concurrently bonds a die onto each die pad where the adhesive has already been dispensed.

Abstract: An apparatus for dispensing solder onto a substrate for mounting a semiconductor chip on the substrate comprises a dispensing body and first and second dispensing channels extending through the dispensing body. Each dispensing channel is operative to receive a separate solder wire to feed the solder wire to an end of the dispensing body facing the substrate. The dispensing channels are further operative to introduce the solder wires in a solid state simultaneously from the end of the dispensing body to be melted upon contact with the substrate which is heated.

Abstract: Adhesive is dispensed for conducting die bonding onto a substrate including rows of bond pads aligned along a first axis and columns of bond pads aligned along a second axis transverse to the first axis where target dispensing positions are located. A first dispensing head incorporating a first nozzle and a second dispensing head incorporating a second nozzle are provided and the substrate is fed along the first axis to a position where the first and second dispensing heads are located. Pattern recognition of a columnar section of the substrate comprising one or more consecutive columns of bond pads with an optical system may be conducted by moving the optical system along the second axis relative to the substrate. Thereafter, the first nozzle and the second nozzle are driven concurrently to dispense adhesive from the first and second nozzles onto the target dispensing positions in the same columnar section of the substrate.

Abstract: A method for mounting a semiconductor chip onto a substrate comprises the steps of positioning a solder dispenser over the substrate and passing a length of solder wire through the solder dispenser to the substrate. The feeding of the wire to the substrate in a feeding direction is controlled with a wire feeder. The solder dispenser is moved relative to the substrate with a positioning device along at least one of two orthogonal axes that are substantially perpendicular to the feeding direction contemporaneously with feeding the solder wire to the surface of the substrate to dispense a line of molten solder onto the substrate. The semiconductor chip is then mounted onto the molten solder that has been dispensed onto the substrate.

Abstract: A manufacturing process and apparatus therefore are provided for processing an electronic device comprising oxidizable material during processing. The electronic device is located inside a chamber and is heated a processing temperature with a heater. A reductive atmosphere is created in the chamber by supplying a gas comprising glycolic acid vapor while processing the electronic device at the processing temperature.

Abstract: A method for mounting a semiconductor chip onto a substrate comprises the steps of positioning a solder dispenser over the substrate and passing a length of solder wire through the solder dispenser to the substrate. The feeding of the wire to the substrate in a feeding direction is controlled with a wire feeder. The solder dispenser is moved relative to the substrate with a positioning device along at least one of two orthogonal axes that are substantially perpendicular to the feeding direction contemporaneously with feeding the solder wire to the surface of the substrate to dispense a line of molten solder onto the substrate. The semiconductor chip is then mounted onto the molten solder that has been dispensed onto the substrate.

Abstract: A manufacturing process and apparatus therefore are provided for processing an electronic device comprising oxidizable material during processing. The electronic device is located inside a chamber and is heated a processing temperature with a heater. A reductive atmosphere is created in the chamber by supplying a gas comprising glycolic acid vapor while processing the electronic device at the processing temperature.

Abstract: A die bonding apparatus and method is provided to automatically adjust a level of a die bonder to compensate for any physical changes occurring in the die bonder during bonding. A bond arm support is drivable to a bonding level to position a die onto a bonding surface, and a bond arm is slidably mounted to the bond arm support for holding and bonding the die. The bond arm is configured to be urged by the bonding surface to move relative to the bond arm support upon contact of the die onto the bonding surface. A measuring device is provided for determining a distance moved by the bond arm relative to the bond arm support during bonding, and a controller is responsive to the distance determined by the measuring device to change the bonding level to which the bond arm support is driven.

Abstract: An apparatus is provided for transferring components from a pick-up position amongst a supply of components to a placement position on a receptor, such as a die pad, during semiconductor processing. It includes a first delivery device and a second delivery device operative to alternatively transfer the components from the pick-up position to the placement position. The second delivery device is arranged opposite the first delivery device about a line passing through the pick-up position and the placement position.

Abstract: The invention provides an apparatus for die attachment onto a substrate including non-metallic material, and metallic material that is adapted to receive a die having a eutectic coating. A heating conduit is provided through which the substrate is movable for heating the metallic material to a eutectic bonding temperature to facilitate bonding between the die and the metallic material at a die-attach position. An induction heating device at the die-attach position heats the metallic material of the substrate to the eutectic bonding temperature prior to attaching a die onto the metallic material.

Abstract: An apparatus is provided for transferring components from a pick-up position amongst a supply of components to a placement position on a receptor, such as a die pad, during semiconductor processing. It includes a first delivery device and a second delivery device operative to alternatively transfer the components from the pick-up position to the placement position. The second delivery device is arranged opposite the first delivery device about a line passing through the pick-up position and the placement position.