Abstract: The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a membrane with low permeability; a two-component paste formed on the upper surface of the membrane with low permeability for adhering the base material to the membrane with low permeability; and a polyurethane paste formed on the lower surface of the membrane with low permeability. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. The polishing pad as mentioned above prevents the polishing pad from detaching from the polishing platen or head. The polishing pad is easy to be replaced without leaving residues on the polishing platen or head.

Abstract: The present invention relates to a polishing pad having a surface texture. The surface texture is disposed on the polishing surface of the polishing pad. The surface texture comprises at least one first groove, at least one second groove, and a plurality of holes. The second groove extends from a central portion of the polishing pad to the edge of the polishing pad, and the first groove(s) is intersected with the second groove(s) to form a plurality of intersection points. The holes are disposed at the intersection points, and the depth of the holes is larger than that of the first groove. Thus, the second groove(s) enables impurities suspended in the polishing slurry to be quickly removed from the polishing pad, and the holes can store the polishing slurry to delay the polishing particles in the polishing slurry from departing from the polishing pad.

Abstract: The present invention relates to a polishing pad having a surface texture. The surface texture is disposed on the polishing surface of the polishing pad. The surface texture comprises at least one first groove, at least one second groove, and a plurality of holes. The second groove extends from a central portion of the polishing pad to the edge of the polishing pad, and the first groove(s) is intersected with the second groove(s) to form a plurality of intersection points. The holes are disposed at the intersection points, and the depth of the holes is larger than that of the first groove. Thus, the second groove(s) enables impurities suspended in the polishing slurry to be quickly removed from the polishing pad, and the holes can store the polishing slurry to delay the polishing particles in the polishing slurry from departing from the polishing pad.