Polishing pad having surface texture
The present invention relates to a polishing pad having a surface texture. The surface texture is disposed on the polishing surface of the polishing pad. The surface texture comprises at least one first groove, at least one second groove, and a plurality of holes. The second groove extends from a central portion of the polishing pad to the edge of the polishing pad, and the first groove(s) is intersected with the second groove(s) to form a plurality of intersection points. The holes are disposed at the intersection points, and the depth of the holes is larger than that of the first groove. Thus, the second groove(s) enables impurities suspended in the polishing slurry to be quickly removed from the polishing pad, and the holes can store the polishing slurry to delay the polishing particles in the polishing slurry from departing from the polishing pad.
1. Field of the Invention
The present invention relates to a polishing pad having a surface texture, and more particularly, to a polishing pad with holes to store polishing slurry.
2. Description of the Related Art
Polishing generally refers to a wear control for a preliminary coarse surface in the process of chemical mechanical polishing (CMP), which makes the slurry containing fine particles evenly dispersed on the upper surface of a polishing pad, and at the same time places a polishing workpiece against the polishing pad and then rubs the workpiece repeatedly with a regular motion. The polishing workpiece may be objects such as a semiconductor, a storage medium substrate, an integrated circuit, an LCD flat-panel glass, an optical glass and a photoelectric panel. In order to maintain the distribution and flow of the polishing slurry and the planarization and polishing efficiency after the chemical mechanical polishing, the upper surface of the polishing pad is usually cut with a plurality of grooves or formed with a surface texture. Therefore, the polishing effect of the polishing pad on the workpiece to be polished is easily affected by the grooves and the surface texture.
Referring to
Referring to
Consequently, there is an existing need for a polishing pad having a surface texture to solve the above-mentioned problems.
SUMMARY OF THE INVENTIONThe objective of the present invention is to provide a polishing pad having a surface texture. The polishing pad comprises a surface texture disposed on a polishing surface of the polishing pad. The surface texture comprises at least one first groove, at least one second groove, and a plurality of holes. The second groove is connected to the edge of the polishing pad, and the first groove(s) is intersected with the second groove(s) to form a plurality of intersection points. The holes are disposed at the intersection points, and the depth of the holes is larger than that of the first groove.
Thus, the second groove(s) enables the impurities suspended in the polishing slurry to be quickly removed, and the holes then store the polishing slurry to delay the polishing particles in the polishing slurry from departing from the polishing pad.
The present invention provides a polishing pad having a surface texture. The polishing pad is suitable for polishing an object to be polished in the chemical mechanical polishing (CMP) process. The object to be polished comprises, but is not limited to, objects such as semiconductors, storage medium substrates, integrated circuits, LCD flat glass, optical glass, and photoelectric panels.
According to the present invention, the polishing pad comprises a surface texture disposed on a polishing surface of the polishing pad. The surface texture comprises at least one first groove, at least one second groove, and a plurality of holes. That is, the first groove, the second groove and the holes are on the same surface (polishing surface).In a preferred embodiment, the first grooves are a plurality of circular grooves with different radii from the top view and the circular grooves are concentric grooves. However, the first grooves can also be a plurality of rectangular grooves with different side lengths and the rectangular grooves are concentric grooves. Alternatively, the first groove(s) may be a spiral groove, or grooves of other shapes.
The second groove(s) extends from a central portion of the polishing pad to an edge of the polishing pad, and the first groove(s) is intersected with the second groove(s) to form a plurality of intersection points. Preferably, the second groove(s) is a plurality of radial grooves from the top view, each of which is a linear or arced groove. The holes are disposed at the intersection points. The holes are blind holes and the depth of the holes is larger than that of the first groove(s) and the second groove(s). Thus, the second groove enables the impurities suspended in the polishing slurry to be quickly removed, and the holes then store the polishing slurry to delay the polishing particles in the polishing slurry from departing from the polishing pad.
The present invention will be described in detail with the following examples, but it does not mean that the present invention is limited to the content disclosed by the examples.
EXAMPLE 1Referring to
Referring to
Referring to
Referring to
Referring to
Referring to
While several embodiments of the present invention have been illustrated and described, various modifications and improvements can be made by those skilled in the art. The embodiments of the present invention are therefore described in an illustrative but not restrictive sense. It is intended that the present invention may not be limited to the particular forms as illustrated, and that all modifications which maintain the spirit and scope of the present invention are within the scope as defined in the appended claims.
Claims
1. A polishing pad comprising:
- a textured polishing surface;
- at least one first groove exposed at and formed in the textured polishing surface;
- at least one second groove exposed at and formed in the textured polishing surface, the at least one second groove extending from a central portion of the polishing surface to an edge of the polishing surface, wherein the at least one first groove intersects with the at least one second groove to form a plurality of intersection points; and
- a plurality of holes exposed at and formed in the textured polishing surface, the plurality of holes disposed at the intersection points, wherein the depth of the holes is larger than that of the at least one first groove.
2. The polishing pad as claimed in claim 1, wherein the at least one first groove comprises a plurality of concentric circular grooves surrounding a center of the textured polishing surface.
3. The polishing pad as claimed in claim 1, wherein the at least one first groove comprises a plurality of concentric rectangular grooves surrounding a center of the textured polishing surface.
4. The polishing pad as claimed in claim 1, wherein the at least one first groove is a spiral groove.
5. The polishing pad as claimed in claim 1, wherein the at least one second groove comprises a plurality of radial grooves.
6. The polishing pad as claimed in claim 5, wherein each of the radial grooves is a linear groove.
7. The polishing pad as claimed in claim 5, wherein each of the radial grooves is an arced groove.
8. A polishing pad comprising:
- a textured polishing surface;
- a plurality of concentric circular grooves exposed at and located in the textured polishing surface;
- a plurality of radial grooves exposed at and located in the textured polishing surface, the plurality of radial groove extending from a central portion of the polishing surface to an edge of the polishing surface, wherein the circular grooves intersect with the radial grooves to form a plurality of intersection points; and
- a plurality of the first holes exposed at and located in the textured polishing surface, wherein the plurality of first holes are disposed at the intersection points, and wherein the depth of the holes is larger than that of the circular grooves.
9. The polishing pad as claimed in claim 8, wherein each of the radial grooves is a linear groove.
10. The polishing pad as claimed in claim 8, wherein each of the radial grooves is an arced groove.
11. The polishing pad as claimed in claim 8, further comprising a plurality of the second holes disposed on the circular grooves and spaced from the intersection points.
12. The polishing pad as claimed in claim 1, wherein the holes are blind holes.
13. The polishing pad as claimed in claim 1, wherein a diameter of the holes is larger than a width of the at least one first groove and a width of the at least one second groove.
14. The polishing pad as claimed in claim 8, wherein a diameter of the first holes is larger than a width of the circular grooves and a width of the radials grooves.
15. The polishing pad as claimed in claim 11, wherein a diameter of the second holes is larger than a width of the circular grooves.
Type: Application
Filed: Jul 3, 2006
Publication Date: Jan 3, 2008
Inventors: Chung-Chih Feng (Kaohsiung), I-Peng Yao (Kaohsiung), Chen-Hsiang Chao (Kaohsiung), Kun-Cheng Sung (Kaohsiung)
Application Number: 11/478,605
International Classification: B24D 11/00 (20060101);