Abstract: A method includes removing a first dummy gate structure to form a recess around a first nanostructure and a second nanostructure; depositing a sacrificial layer in the recess with a flowable chemical vapor deposition (CVD); and patterning the sacrificial layer to leave a portion of the sacrificial layer between the first nanostructure and the second nanostructure. The method further include depositing a first work function metal in first recess; removing the first work function metal and the portion of the sacrificial layer from the recess; depositing a second work function metal in the recess, wherein the second work function metal is of an opposite type than the first work function metal; and depositing a fill metal over the second work function metal in the recess.

Abstract: A semiconductor device includes a substrate, a pair of semiconductor fins, a dummy fin structure, a gate structure, a plurality of source/drain structures, a crystalline hard mask layer, and an amorphous hard mask layer. The pair of semiconductor fins extend upwardly from the substrate. The dummy fin structure extends upwardly above the substrate and is laterally between the pair of semiconductor fins. The gate structure extends across the pair of semiconductor fins and the dummy fin structure. The source/drain structures are above the pair of semiconductor fins and on either side of the gate structure. The crystalline hard mask layer extends upwardly from the dummy fin and has an U-shaped cross section. The amorphous hard mask layer is in the first hard mask layer, wherein the amorphous hard mask layer having an U-shaped cross section conformal to the U-shaped cross section of the crystalline hard mask layer.

Abstract: The present invention relates to a light-emitting diode (LED) structure, comprising a flexible substrate and one or a plurality of chip-scale package (CSP) LED chips. The flexible substrate includes a metal layer as the core, and the metal layer is coated with a ceramic insulating layer. The flexible substrate is provided with a plurality of electrodes. The CSP LED chips are provided on the flexible substrate, with the electrical connection units of each CSP LED chip electrically connected to the corresponding electrodes on the flexible substrate respectively.

Abstract: An assembly device for a sidelight light source module and liquid crystal panel, comprising: a liquid crystal panel; a light guide panel; a light reflecting plate; a light source module installed at a side of the light guide panel; wherein the light source module comprises: a circuit board, on top of is soldered blue light chips and red light chips; a luminescence fluorescent layer positioned on top of the blue light chips and the red light chips. Mixed light consisting of the excited light, the blue light and the red light is transmitted out the fluorescent layer and forms a white light that passes through the light guide panel, the light reflecting plate, and is finally transmitted out the liquid crystal panel.

Abstract: An assembled device of a light module and a liquid crystal panel is composed of a liquid crystal panel whose bottom surface is provided with a light module which includes a circuit board on which are welded at least more than one blue light chip, which is next to a red light chip, as a blue light emitting source, and more than one red light chip as a red light emitting source. A light emitting illumination layer, which is made by uniformly mixing an illumination powder with a transparent glue, is located above the blue light chip and the red light chip, so as to develop into a white light as a back light source whose rendering effect and uniformity are of a good quality and can be easily controlled.

Abstract: A light emitting device including three light emitting sources and a phosphor, with the three light sources consisted of following light emitting diodes (LED) emitting lights having different wavelengths. Wherein, two light sources are used to excite the phosphor to produce a distinct wavelength different from those of the two light sources. The distinct wavelength is blended with portions of the two light sources and a light source from another independent light source, and a blended light is released to obtain a white light.

Abstract: A white light emitting device includes a device having at least one light emitting diode (LED) serving as a light source and being capable of emitting a light between blue and green in color; and a phosphor consisted of first and second phosphors each made of a compound from different materials. The phosphor is excited by the light from the light source to emit a first-color light and a second-color light, which are both blended with a portion of the light and altogether release to obtain a white light having enhanced color rendering effects, thereby offering the white light with illuminant contrast.

Abstract: A light emitting device includes at least three light emitting source and a phosphor, with the three light sources consisted of following light emitting diodes (LED) emitting lights having different wavelengths. Wherein, two light sources are used to excite the phosphor to produce a distinct wavelength different from those of the two light sources. The distinct wavelength is blended with portions of the two light sources and a light source from another independent light source, and a blended light is released to obtain a white light having an excellent color rendering index.

Abstract: A light-emitting device comprises at least one blue light emitting diode as a blue light source; at least one red light emitting diode as a red light source; and a fluorescent layer formed by mixing fluorescent powders with transparent resin; the fluorescent layer being glued to the blue light emitting diode and the red light emitting diode; the blue light emitting diode and the red light emitting diode emitting lights of different colors which are then mixed; the blue light being used to excite the fluorescent layer to emit light with wavelengths different from the blue light and red light. In another structure, a fluorescent layer is formed by mixing fluorescent powders with transparent resin; and the fluorescent layer encloses the blue light emitting diode. A transparent resin layer encloses the fluorescent layer and red light emitting diode.