Assembly device for a sidelight light source module and liquid crystal panel

An assembly device for a sidelight light source module and liquid crystal panel, comprising: a liquid crystal panel; a light guide panel; a light reflecting plate; a light source module installed at a side of the light guide panel; wherein the light source module comprises: a circuit board, on top of is soldered blue light chips and red light chips; a luminescence fluorescent layer positioned on top of the blue light chips and the red light chips. Mixed light consisting of the excited light, the blue light and the red light is transmitted out the fluorescent layer and forms a white light that passes through the light guide panel, the light reflecting plate, and is finally transmitted out the liquid crystal panel.

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Description

BACKGROUND OF THE INVENTION

(a) Field of the Invention

The present invention relates to an assembly device for a sidelight light source module and liquid crystal panel, which particularly provides a white light backlight source having superior color rendering for a liquid crystal panel.

(b) Description of the Prior Art

Conventional structures for assembly of a liquid crystal panel and backlight source module include Taiwan Utility Model Reg. No. M245448, entitled “Light source module for a liquid crystal display”, which uses a light source structured from an ultraviolet (UV) LED and red, blue and green (R, B, G) fluorescent substances. However, a shortcoming of such a structure is that the ultraviolet light damages current, extensively used epoxy resin structures, causing a problem of final white light attenuation, thereby resulting in a relatively dull white light. More particularly, a covering layer used in the above cited patent is compounded from red, green and blue color fluorescent substances, which causes another shortcoming in that the ratio of the three colors and the manufacturing process are difficult to control.

Furthermore, claim 5 of the above cited patent discloses that the light-emitting diode is a blue light LED, and that the fluorescent powders are red and green fluorescent substances. However, ratio of the red fluorescent powder and the green fluorescent powder and the manufacturing process are difficult to control, thereby making uniformity of the mixed light (that is, white light) also difficult to control, thereby finally producing poor color rendering of the white light displayed by the liquid crystal panel.

Taiwan Utility Model Reg. No. M251143, entitled “Light source device for a liquid crystal screen”, uses a light source that is blue light or UV light of wavelength between 202 mm and 500 mm, which serves as a single light source. However, the light source lacks a red light spectrum portion, which results in poor color rendering and uniformity of the mixed white light (that is, mixed light) emitted by the fluorescent screen, and is seen by the human eye as impure white light.

Taiwan patent publication No. I228837, entitled “Light-emitting Device”, issued to the inventor of the present invention, is a white light light-emitting diode that uses blue light light-emitting chips and red light light-emitting chips as two light sources, and a fluorescent layer veneers the blue light light-emitting chips and the red light emitting-emitting chips. The blue light source excites the fluorescent layer to emit a green light, which is then mixed with blue and red light to form white light. The above cited patent effectively overcomes the problem produced by the difficult control of the ratio and manufacturing process of mixing different color fluorescent powders of the aforementioned patent by replacing the conventional red fluorescent powder with a red light-emitting diode, which further enables the induced luminescent fluorescent layer material to be a single color material.

Such a design resolves the problem of difficult control of the ratio and manufacturing process of mixing different colors, and can further control an induced luminescent single excited light wavelength (that is, green light wavelength). Furthermore, the above patent uses a mixture of three colored lights including red light, excited light emitted by the red light-emitting diode and blue light, thereby obtaining white light having better color rendering. However, embodiments of the cited patent are limited to new designs of white light light-emitting diodes, and with regard to application in devices assembled with a liquid crystal panel and backlight module, the cited patent has no extended assembled embodiments.

SUMMARY OF THE INVENTION

A primary objective of the present invention is to provide an assembly device for a sidelight light source module and liquid crystal panel that enables easy control of and achieves superior color rendering and uniformity of a transmitted backlight white light.

Another objective of the present invention is to provide the assembly device for a sidelight light source module and liquid crystal panel with a fluorescent layer used by a backlight source module that is fabricated from induced luminescent material, which enables easy control of the excited light wavelengths, thereby achieving easy control of the color rendering and uniformity of the backlight white light source.

Yet another objective of the present invention is to provide the assembly device for a sidelight light source module and liquid crystal panel with an easily replaceable light diffuser plate coated with the fluorescent layer, thereby providing renewable functionality.

To enable a further understanding of said objectives and the technological methods of the invention herein, brief description of the drawings is provided below followed by detailed description of the preferred embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a cross-sectional schematic view according to the present invention.

FIG. 2 shows a cross-sectional schematic view of another embodiment according to the present invention.

FIG. 3 shows a cross-sectional schematic view of another embodiment according to the present invention.

FIG. 4 shows a cross-sectional schematic view of another embodiment according to the present invention.

FIG. 5 shows a cross-sectional schematic view of another embodiment according to the present invention.

FIG. 6 shows a cross-sectional schematic view of another embodiment according to the present invention.

FIG. 7 shows a partial cross-sectional view of a light source module according to the present invention.

FIG. 8 shows a partial cross-sectional view of an embodiment of a light source module according to the present invention.

FIG. 9 shows a partial cross-sectional view of an embodiment of a light source module according to the present invention.

FIG. 10 shows a partial cross-sectional view of an embodiment of a light source module according to the present invention.

FIG. 11 shows a partial cross-sectional view of an embodiment of a light source module according to the present invention.

FIG. 12 shows an elevational view of the light source module according to the present invention.

FIG. 13 shows an elevational view of another embodiment of the light source module according to the present invention.

FIG. 14 shows an elevational view of another embodiment of the light source module according to the present invention.

FIG. 15 shows a cross-sectional view of an embodiment of a light diffuser plate according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIGS. 1 and 9, the assembly device for a sidelight light source module and liquid crystal panel of the present invention comprises:

a liquid crystal panel 10;

a light guide panel 20 positioned below the liquid crystal panel 10;

a light reflecting plate 30 positioned below the light guide panel 20;

a light source module 40 installed at a side of the light guide panel 20; wherein the light source module comprises:

a circuit board 42, on top of which is soldered at least more than one blue light chip 55 that serves as a blue light B light-emitting source and at least more than one red light chip 65 that serves as a red light R light-emitting source, wherein the blue light chips 55 and the red light chips 65 are reciprocally adjacent;

a luminescence fluorescent layer 70 is positioned on top of the blue light chip 55 and the red light chip 65, wherein the blue light B is primarily used to excite the fluorescent layer 70 and emit excited light G having wavelength between 500 and 570 mm; mixed light consisting of the excited light G, the blue light B and the red light R is transmitted out the fluorescent layer 70 and forms a white light W light source that is guided by the light guide panel 20 into the light reflecting plate 30, where it undergoes refraction and then transmitted out the liquid crystal panel 10.

Referring again to FIGS. 1 and 9, the fluorescent layer 70 encapsulates the adjacent blue light chip 55 and red light chip 65.

Referring to FIGS. 2 and 8, wherein a light diffuser plate 15 is disposed on a top portion of the light guide panel 20. A uniform coating of the fluorescent layer 70 is coated on a surface of the light diffuser plate 15. The blue light chips 55 and the red light chips 65 soldered to the circuit board 42 are covered with transparent rubber layers 75.

Referring again to FIG. 8, wherein the blue light chips 55 and the red light chips 65 are independently disposed in grooves 61, (61) of light reflecting covers 60, (60) respectively. Electrode leads 62, 64 of the two light reflecting covers 60, (60) are respectively soldered to the circuit board 42. A separation distance L between the two reflecting covers 60, (60) is controlled to be within 1 mm. The grooves 61, (61) of the two light reflecting covers 60, (60) are respectively filled with the transparent rubber layer 75 and a surface of the circuit board 42 is coated with the transparent rubber layer 75.

Referring to FIGS. 1, 2, 3, 4, 5, 7 and 9, fluorescent powder of the fluorescent layer 70 can be composed of substances including yttrium aluminum garnet or silicates (SmOn4−) or borates (BxOy3−).

Referring again to FIG. 9, wherein the blue light chip 55 and the red light chip 65 are connected in the groove 61 of the same light reflecting cover 60. The groove 61 can be filled with the fluorescent layer 70, and the two electrode leads 62, 64 are soldered to the circuit board 42.

Referring again to FIGS. 1, 2, 3, 4, 5, 7 and 9, wherein the substances constituting the fluorescent powder 70 can be compounded from one or two or three of the following compounds:

    • cerium activator containing Y and Al yttrium aluminum garnet (YAG:Ce3+);
    • europium activated garnet (YAG:Eu2+/3+);
    • terbium activated garnet (YAG:Tb3+).

Referring to FIG. 6, wherein a transparent light intensifying film 125 or a light intensifying prism plate is additionally disposed between the liquid crystal panel 10 and the light diffuser plate 15.

Referring to FIGS. 12 and 13, wherein a plurality of the paired blue light chips 55 and the red light chips 65 are arranged to form at least one row on the circuit board 42, and are soldered on the circuit board 42 using a one-dimensional straight line array arrangement.

Referring to FIG. 15, wherein a bottom surface of the light diffuser plate 15 is formed with a prism surface 156 consisting of adjoining ridges and valleys having included angle θ smaller than 90°.

Referring to FIG. 12, which shows a liquid crystal panel 10, a light diffuser plate 15 and a light source module 40 having rectangular shapes of relatively small area that are applicable for use in small-scale liquid crystal screens. Referring to FIG. 13, which shows the liquid crystal panel 10, the light diffuser plate 15 and the light source module 40 having rectangular square shapes of relatively large area that are applicable for use in liquid crystal screens of relatively large dimensions.

Referring to FIGS. 1 and 9, which shows a blue light chip 55 and a red light chip 65 encapsulated on a light source module 40 with a fluorescent layer 70. Moreover, the blue light chip 55 and the red light chip 65 are arranged in pairs, each of which are soldered in a groove 61 of a light reflecting cover 60. When electricity is supplied to electrode leads 62, 64, the blue light chips 55 and the red light chips 65 are actuated and simultaneously emit blue light B and red light R respectively. The blue light B primarily excites the fluorescent layer 70, thereby causing the fluorescent layer 70 to emit excited light G having wavelength between 500 and 570 mm, which is defined to be green light. Hence, the mixed light of blue light B, red light R and excited light G defined as white light W is guided by a light guide panel 20 to a light reflecting plate 30, as depicted in FIG. 1, where it undergoes reflection and is transmitted through a light diffuser plate 15 and out the liquid crystal panel 10, thereby forming a backlight source for the liquid crystal panel 10. This embodiment primarily describes a configuration whereby the fluorescent layer 70 directly covers the blue light chip 55 and the red light chip 65.

Referring to FIGS. 2 and 12, which shows an embodiment that primarily depicts a configuration whereby the fluorescent layer 70 is attached to different positions, and is not limited to being attached on top of the blue and red light chips 55, 65. The fluorescent layer 70 is coated on a top surface of the light diffuser plate 15, and the blue and red light chips 55, 65 on the light source module 40 are not covered by the fluorescent layer 70. The blue and red light chips 55, 65 are actuated by a circuit of the circuit board 42 and simultaneously emit the blue light B and the red light R respectively, which are guided by the light guide panel 20 into the light reflecting plate 30, where the blue light B and the red light R are reflected toward the light diffuser plate 15 and undergo uniform diffusion thereat, whereafter the blue light B excites the fluorescent layer 70, which emits excited light G that is then mixed with the blue light B and the red light R to form the white light W that is transmitted out the liquid crystal panel 10.

Referring to FIG. 3, which shows the fluorescent layer 70 coated on a bottom surface of the light diffuser plate 15, and the blue and red light chips 55, 65 within the light source module 40 are similarly not covered by the fluorescent layer 70. The blue light B excites the fluorescent layer 70 to produce the excited light G, which is transmitted through the light diffuser plate 15, and the white light W formed from mixing the blue light B and the red light R and the excited light G is transmitted out the liquid crystal panel 10.

Referring to FIG. 4, which shows the fluorescent layer 70 coated on both the top surface and the bottom surface of the light diffuser plate 15, which is a preferred practicable embodiment of the present invention.

Referring to FIG. 5, fluorescent powder is uniformly mixed into material of the light diffuser plate 15, thereby enabling the light diffuser plate 15 to simultaneously serve as the luminescence fluorescent layer 70. With such a configuration, the light source module 40 is not covered by the fluorescent layer 70, thus, the light source module 40 transmits the blue light B and the red light R, which the light guide panel 20 guides into the light reflecting plate 30, where they are reflected towards the light diffuser plate 15. The light diffuser plate 15 serves as the fluorescent layer 70 and is excited by the blue light B and emits the excited light G, and the white light W formed from mixing the blue light B and the red light R and the excited light G is transmitted out the liquid crystal panel 10.

Referring to FIG. 6, which shows a light intensifying film 125 or a prism plate attached to the top surface of the light diffuser plate 15, thereby achieving the objective of intensifying the light. Such an embodiment has the fluorescent layer 70 fabricated into the light source module 40

Referring to FIG. 7, wherein the blue light chip 55 is installed in the groove 61 of the independent light reflecting cover 60, and the red light chip 65 is installed in the groove 61 of the other independent light reflecting cover 60. A distance L between the two reflecting covers 60 is best controlled to be between 1 and 2 mm. The groove 61 with the blue light chip 55 disposed therein can be further filled with the fluorescent layer 70, and the groove 61 with the red light chip 65 disposed therein is filled with a transparent rubber layer 75, and the light diffuser plate 15 is not coated with the fluorescent layer 70, as depicted in FIG. 1. Hence, the mixed light (that is, the white light W) emitted, consisting of the blue, red and excited lights (B, R and G respectively), is transmitted out the liquid crystal panel 10.

Referring to FIG. 8, which shows the blue light chip 55 and the red light chip 65 installed into the grooves 61, (61) of the two independent light reflecting covers 60, (60) respectively. The two grooves 61, (61) are respectively filled with the transparent rubber layer 75, (75). This embodiment describes a configuration whereby the light source module 40 is not coated by the fluorescent layer 70, and the fluorescent layer 70 is coated onto the surface of the light diffuser plate 15, as depicted in FIGS. 2, 3, 4 and 5. Hence, the light source modules 40 emits the blue light B and the red light R, wherein the blue light B excites the fluorescent layer 70 coated on the surface of the light diffuser plates 15, as depicted in FIGS. 2, 3, 4 and 5, and the excited light G excited therefrom enables the white light W to be transmitted out the liquid crystal panel 10.

Referring to FIG. 9, which shows the blue light chip 55 and the red light chip 65 installed in the same groove 61 of the light reflecting cover 60. The fluorescent layer 70 is filled in the groove 61 and covers the blue light chip 55 and the red light chip 65. The light diffuser plate 15 is not coated with the fluorescent layer 70, as depicted in FIG. 1, thus, the mixed white light W, consisting of the blue, red and excited lights (B, R and G respectively), emitted by the light source module 40 forms a backlight source for the liquid crystal panel 10.

Referring to FIG. 10, which shows the blue and red light chips 55, 65 directly soldered to the circuit board 42. The fluorescent layer 70 directly encapsulates the blue and red light chips 55, 65, or the transparent rubber layer 75 can encapsulate the blue and red light chips 55,65. When the blue and red light chips 55, 65 have been encapsulated by the fluorescent layer 70, then the light diffuser plate 15 does not have a coating of the fluorescent layer 70, as depicted in FIG. 1. However, when the blue and red light chips 55, 65 have been encapsulated by the transparent rubber layer 75, then the light diffuser plate 15 is coated with the fluorescent layer 70 (as depicted in FIGS. 2, 3, 4 and 5).

Referring to FIG. 11, which shows the blue light chip 55 and the red light chip 65 installed in the groove 61 of the light reflecting cover 60, and the transparent rubber layer 75 encapsulates the groove 61. The light source module 40 is not covered by the fluorescent layer 70; instead, the fluorescent layer 70 is disposed on the surface of the light diffuser plate 15 (as depicted in FIGS. 2, 3, 4 and 5).

Referring to FIG. 15, the light diffuser plate 15 is formed with a concavo-convex prism surface 156 consisting of adjoining ridges and valleys that achieve the objective of intensifying light.

The present invention is characterized in that the light source module 40 uses light-emitting diodes including the blue light chips 55 and the red light chips 65, which function in coordination with the fluorescent layers 70 coated at different locations, thereby producing a mixed light consisting of the blue light B, the red light R and the excited light G having superior uniformity and color rendering. The fluorescent layer 70 is fabricated as a single luminescence colored material, eliminating the need for mixing with other different colored fluorescent substances, and further eliminates the concern arising from the problem of ratio control of different fluorescent powders. Moreover, the manufacturing process is easy to control, and more particularly the red light chips 65 in the light source are light-emitting diodes, enabling easy control of wavelength and intensity of the red light R emitted therefrom.

In conclusion, the sidelight light source of the present invention used in the field of liquid crystal panels achieves a backlight light source—white light W having superior color rendering and uniformity. Moreover, considerable originality and advancement and commercial utility value of the present invention clearly comply with essential elements as required for a new patent application. Accordingly, a new patent application is proposed herein.

It is of course to be understood that the embodiments described herein are merely illustrative of the principles of the invention and that a wide variety of modifications thereto may be effected by persons skilled in the art without departing from the spirit and scope of the invention as set forth in the following claims.

Claims

1. An assembly device for a sidelight light source module and liquid crystal panel, comprising:

a liquid crystal panel;
a light guide panel positioned below the liquid crystal panel;
a light reflecting plate positioned below the light guide panel;
a light source module installed at a side of the light guide panel;
wherein the light source module comprises:
a circuit board, on top of which is soldered at least more than one blue light chip that serves as a blue light light-emitting source and at least more than one red light chip that serves as a red light light-emitting source, wherein the blue light chips and the red light chips are reciprocally adjacent;
a luminescence fluorescent layer positioned on top of the blue light chips and the red light chips, wherein blue light primarily excites the fluorescent layer and emits excited light having wavelength between 500 and 570 mm; mixed light consisting of the excited light, the blue light and the red light is transmitted out the fluorescent layer and forms a white light light source that is guided by the light guide panel into the light reflecting plate, where it undergoes refraction and then transmitted out the liquid crystal panel.

2. The side light source type module and liquid crystal panel assembly device according to claim 1, wherein the fluorescent layer encapsulates the adjacent blue light chips and red light chips.

3. The side light source type module and liquid crystal panel assembly device according to claim 1, wherein a light diffuser plate is disposed on top of the light guide panel, and the fluorescent layer is uniformly coated on a surface of the light diffuser plate;

the blue light chips and the red light chips soldered on the circuit board are covered with a transparent rubber layer.

4. The side light source type module and liquid crystal panel assembly device according to claim 1, wherein the blue light chips and the red light chips are independently respectively disposed in grooves of light reflecting covers, and electrode leads of the two light reflecting covers are respectively soldered to a circuit board; a separation distance between the two reflecting covers is controlled to be within 1 mm;

the grooves of the two light reflecting covers are filled with the transparent rubber layer and a surface of the circuit board is coated with the transparent rubber layer.

5. The side light source type module and liquid crystal panel assembly device according to claim 1, wherein fluorescent powder of the fluorescent layer is composed of substances including yttrium aluminum garnet or silicates (SmOn4−) or borates (BxOy3−).

6. The side light source type module and liquid crystal panel assembly device according to claim 1, wherein the blue light chip and the red light chip are connected in the groove of the same light reflecting cover, the groove is filled with the fluorescent layer, and the two electrode leads are soldered to the circuit board.

7. The side light source type module and liquid crystal panel assembly device according to claim 1, wherein the substances constituting the fluorescent powder is compounded from one or two or three of the following compounds:

cerium activator containing Y and Al yttrium aluminum garnet (YAG:Ce3+);
europium activated garnet (YAG:Eu2+/3+);
terbium activated garnet (YAG:Tb3+).

8. The side light source type module and liquid crystal panel assembly device according to claim 1, wherein a transparent light intensifying film or a light intensifying prism plate is additionally disposed between the liquid crystal panel and the light diffuser plate.

9. The side light source type module and liquid crystal panel assembly device according to claim 1, wherein a plurality of the paired blue light chips and the red light chips are arranged to form at least one row on the circuit board, and are soldered on the circuit board using a one-dimensional straight line array arrangement.

10. The side light source type module and liquid crystal panel assembly device according to claim 1, wherein a bottom surface of the light diffuser plate is formed with a prism surface consisting of adjoining ridges and valleys having included angle smaller than 90°.

Patent History

Publication number: 20070103931
Type: Application
Filed: Nov 9, 2005
Publication Date: May 10, 2007
Inventors: Kun-Chui Lee (Taipei City), Tzu-Chi Cheng (Baoshan Township)
Application Number: 11/269,658

Classifications

Current U.S. Class: 362/561.000
International Classification: A47F 3/00 (20060101);