Abstract: A high voltage device includes: a semiconductor layer, a well, a bulk region, a gate, a source, and a drain. The bulk region is formed in the semiconductor layer and contacts the well region along a channel direction. A portion of the bulk region is vertically below and in contact with the gate, to provide an inversion region of the high voltage device when the high voltage device is in conductive operation. A portion of the well lies between the bulk region and the drain, to separate the bulk region from the drain. A first concentration peak region of an impurities doping profile of the bulk region is vertically below and in contact with the source. A concentration of a second conductivity type impurities of the first concentration peak region is higher than that of other regions in the bulk region.

Abstract: A high voltage device includes: a semiconductor layer, a well, a bulk region, a gate, a source, and a drain. The bulk region is formed in the semiconductor layer and contacts the well region along a channel direction. A portion of the bulk region is vertically below and in contact with the gate, to provide an inversion region of the high voltage device when the high voltage device is in conductive operation. A portion of the well lies between the bulk region and the drain, to separate the bulk region from the drain. A first concentration peak region of an impurities doping profile of the bulk region is vertically below and in contact with the source. A concentration of a second conductivity type impurities of the first concentration peak region is higher than that of other regions in the bulk region.

Abstract: The instant disclosure relates to a method for making solid electrolytic capacitor package structure with improved conductive terminals. The first step is to provide at least one conductive terminal having an electrical contact portion and a lead-out portion. The next step is to remove a portion of mantle layer from the surface of the core layer of at least one conductive terminal by a dry-type process. The next step is to sequentially stack together a plurality of stacked-type capacitors to form a capacitor unit and then electrically connect the capacitor unit to at least one conductive terminal. The next step is to form a package body to encapsulate the capacitor unit and the electrical contact portion of at least one conductive terminal. The last step is to bend the lead-out portion of at least one conductive terminal to an axis that extends along the surface of the package body.

Abstract: A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit, and a conductive unit. The capacitor unit includes a plurality of first stacked-type capacitors sequentially stacked on top of one another, and each first stacked-type capacitor has a first positive portion and a first negative portion. The package unit includes a package resin body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal. The first conductive terminal has a first embedded portion and a first exposed portion, and the second conductive terminal has a second embedded portion and a second exposed portion. An outermost one of first stacked-type capacitors has a plurality of first exposed soldering microgrooves formed on an outer surface thereof for contacting the package resin body. The instant disclosure further provides a method of manufacturing a stacked-type solid electrolytic capacitor package structure.

Abstract: A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit, and a conductive unit. The capacitor unit includes a plurality of first stacked-type capacitors sequentially stacked on top of one another, and each first stacked-type capacitor has a first positive portion and a first negative portion. The package unit includes a package resin body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal. The first conductive terminal has a first embedded portion and a first exposed portion, and the second conductive terminal has a second embedded portion and a second exposed portion. An outermost one of first stacked-type capacitors has a plurality of first exposed soldering microgrooves formed on an outer surface thereof for contacting the package resin body. The instant disclosure further provides a method of manufacturing a stacked-type solid electrolytic capacitor package structure.

Abstract: A matrix arrangement stacked-type solid electrolytic capacitor package structure includes a lead frame component, a plurality of capacitor units, and a package unit. The lead frame component includes a plurality of conductive holders arranged in matrix arrangement and a connection frame connected to the conductive holders. Each conductive holder includes a first conductive terminal and a second conductive terminal. The capacitor units are respectively disposed on the conductive holders. Each capacitor unit includes a plurality of first stacked-type capacitors sequentially stacked on top of one another and electrically connected with each other. Each first stacked-type capacitor has a first positive portion electrically connected to the first conductive terminal of the corresponding conductive holder and a first negative portion electrically connected to the second conductive terminal of the corresponding conductive holder.

Abstract: The instant disclosure relates to a method for making solid electrolytic capacitor package structure with improved conductive terminals. The first step is to provide at least one conductive terminal having an electrical contact portion and a lead-out portion. The next step is to remove a portion of mantle layer from the surface of the core layer of at least one conductive terminal by a dry-type process. The next step is to sequentially stack together a plurality of stacked-type capacitors to form a capacitor unit and then electrically connect the capacitor unit to at least one conductive terminal. The next step is to form a package body to encapsulate the capacitor unit and the electrical contact portion of at least one conductive terminal. The last step is to bend the lead-out portion of at least one conductive terminal to an axis that extends along the surface of the package body.

Abstract: A solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes at least one first conductive terminal and at least one second conductive terminal. The first conductive terminal includes a first core layer and a first enclosing layer. The first core layer has a first top exposed surface exposed from the first enclosing layer, and the first top exposed surface has a first top covering area covered by the package body. The second conductive terminal includes a second core layer and a second enclosing layer. The second core layer has a second top exposed surface exposed from the second enclosing layer, and the second top exposed surface has a second top covering area covered by the package body.

Abstract: A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a plurality of stacked-type capacitors stacked on top of one another and electrically connected with each other, and each stacked-type capacitor has a positive portion and a negative portion. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal. The first conductive terminal has a first embedded portion electrically connected to the positive portion and enclosed by the package body and a first lateral exposed portion connected to the first embedded portion. The second conductive terminal has a second lateral exposed portion, a second front exposed portion, a second rear exposed portion, and a second embedded portion electrically connected to the negative portion and enclosed by the package body.

Abstract: A solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes at least one first conductive terminal and at least one second conductive terminal. The first conductive terminal includes a first core layer and a first enclosing layer. The first core layer has a first top exposed surface exposed from the first enclosing layer, and the first top exposed surface has a first top covering area covered by the package body. The second conductive terminal includes a second core layer and a second enclosing layer. The second core layer has a second top exposed surface exposed from the second enclosing layer, and the second top exposed surface has a second top covering area covered by the package body.

Abstract: A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a plurality of stacked-type capacitors stacked on top of one another and electrically connected with each other, and each stacked-type capacitor has a positive portion and a negative portion. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal. The first conductive terminal has a first embedded portion electrically connected to the positive portion and enclosed by the package body and a first lateral exposed portion connected to the first embedded portion. The second conductive terminal has a second lateral exposed portion, a second front exposed portion, a second rear exposed portion, and a second embedded portion electrically connected to the negative portion and enclosed by the package body.

Abstract: A solid electrolytic capacitor package structure for decreasing equivalent series resistance (ESR), includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of first stacked-type capacitors sequentially stacked on top of one another and electrically connected with each other. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal having a through hole, and the stacked-type capacitors are electrically connected between the first and the second conductive terminals. The bottommost first stacked-type capacitor is positioned on the top surface of the second conductive terminal through conductive paste that has a first conductive portion disposed between the bottommost first stacked-type capacitors and the top surface of the second conductive terminal and a second conductive portion filling in the through groove to connect with the first conductive portion.

Abstract: A winding-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a winding-type capacitor having a first conductive pin and a second conductive pin. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal electrically connected to the first conductive pin and a second conductive terminal electrically connected to the second conductive pin. The first conductive terminal has a first embedded portion contacting the first conductive pin and enclosed by the package body and a first exposed portion connected to the first embedded portion and exposed from the package body. The second conductive terminal has a second embedded portion contacting the second conductive pin and enclosed by the package body and a second exposed portion connected to the second embedded portion and exposed from the package body.

Abstract: A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of capacitors stacked on top of one another. The package unit includes a package body enclosing the capacitors. The package body has a top surface defining a package length, a package width and an effective package, and the package width is substantially between 85% and 95% of the package length. The conductive unit includes a first conductive terminal electrically connected to the positive portion of the capacitor and a second conductive terminal electrically connected to the negative portion of the capacitor. One part of the first conductive terminal and one part of the second conductive terminal are enclosed by the package body, and another part of the first conductive terminal and another part of the second conductive terminal are exposed from the package body.

Abstract: A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a plurality of stacked-type capacitors stacked on top of one another and electrically connected with each other, and each stacked-type capacitor has a positive portion and a negative portion. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal. The first conductive terminal has a first embedded portion electrically connected to the positive portion and enclosed by the package body and a first lateral exposed portion connected to the first embedded portion. The second conductive terminal has a second lateral exposed portion, a second front exposed portion, a second rear exposed portion, and a second embedded portion electrically connected to the negative portion and enclosed by the package body.

Abstract: A winding-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a winding-type capacitor having a first conductive pin and a second conductive pin. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal electrically connected to the first conductive pin and a second conductive terminal electrically connected to the second conductive pin. The first conductive terminal has a first embedded portion contacting the first conductive pin and enclosed by the package body and a first exposed portion connected to the first embedded portion and exposed from the package body. The second conductive terminal has a second embedded portion contacting the second conductive pin and enclosed by the package body and a second exposed portion connected to the second embedded portion and exposed from the package body.

Abstract: A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of capacitors stacked on top of one another. The package unit includes a package body enclosing the capacitors. The package body has a top surface defining a package length, a package width and an effective package, and the package width is substantially between 85% and 95% of the package length. The conductive unit includes a first conductive terminal electrically connected to the positive portion of the capacitor and a second conductive terminal electrically connected to the negative portion of the capacitor. One part of the first conductive terminal and one part of the second conductive terminal are enclosed by the package body, and another part of the first conductive terminal and another part of the second conductive terminal are exposed from the package body.

Abstract: A capacitance unit includes an anode portion, an insulating portion, a cathode portion and a colloid portion. The front end of the anode portion extends to from an anode terminal. The insulating portion surrounds the anode portion and covers a first partial surface of the anode portion. The cathode portion is disposed next to the insulating portion, and the cathode portion covers a second partial surface of the anode portion. The colloid portion is disposed next to the insulating portion, and the colloid portion surrounds the cathode portion and covers a partial surface of the cathode portion.

Abstract: The present invention relates to a capacitor unit, which includes an anode portion, a cathode portion, and an insulating portion. The insulating portion is provided for in a form of a headband to partially cover the surface of the anode portion to divide the anode and the cathode portions. The cathode portion partially covers the anode portion and is located behind the insulating portion. The cathode portion has at least one conductive layer which is made of a conductive polymer having copper, copper alloy, or a mixture thereof.

Abstract: A capacitance unit includes an anode portion, an insulating portion, a cathode portion and a colloid portion. The front end of the anode portion extends to from an anode terminal. The insulating portion surrounds the anode portion and covers a first partial surface of the anode portion. The cathode portion is disposed next to the insulating portion, and the cathode portion covers a second partial surface of the anode portion. The colloid portion is disposed next to the insulating portion, and the colloid portion surrounds the cathode portion and covers a partial surface of the cathode portion.