Abstract: The present invention is an electrostatic discharge protection device having a low trigger voltage. The device can utilize a process of manufacturing a PCB to minimize costs and manufacturing time. The device comprises: a discharge area, which is essentially a space within the device and can be filled by a material having a desired breakdown voltage, and at least two electrode areas, wherein the two electrode areas are substantially electrically isolated from each other and simultaneously adjacent to or within the discharge area. When an electric potential difference between the electrode areas exceeds a predetermined value, a conductive path between the electrode areas will be created by discharging through the discharge area. The device is characterized in that each of the two electrodes is a part of a conductive plate, and the two conductive plates become a part of the device by pressing or adhering so that a gap for electric isolation exists between the two electrode areas.

Abstract: The invention relates to resettable chip-type over-current protection devices and methods of making the same, characterized by directly forming upper and lower electrode conductor and connection electrode conductor on a PPTC substrate so as to constitute a simplified three-layer structure of “electrode conductor-PPTC substrate-electrode conductor.

Abstract: An over-current protective device is characterized by comprising: a fuse cover, a fusible body disposed therein, and a first electrode and a second electrode respectively extending from the two ends of the fusible body. A method for fabricating the over-current protective device comprises the following steps: stamping a conductive metal sheet to form a frame with a base having two ends respectively extending as a supporting plate, and soldering a fusible unit containing the fusible body between the supporting plates; disposing the frame having the soldered fusible unit into a mold, putting a polymeric material into the mold for covering the fusible body and the supporting plates, and molding the fusible body into a required shape; taking out the frame covered by the polymeric material and cutting the base off so as to obtain an over-current protective device having two electrode plates extending from two ends thereof.

Abstract: This invention is novel structure of an over-current protection device and manufacturing method thereof. The over-current protection device is formed with a main body with a lead frame and a ceramic fiber lead wound by a metal wire exteriorly, by coating the exterior of the whole lead with a thermally-insulating material, and then cladding the lead with a flame retardation material having an electrical insulation characteristic.

Abstract: The invention relates to resettable chip-type over-current protection devices and methods of making the same, characterized by directly forming upper and lower electrode conductor and connection electrode conductor on a PPTC substrate so as to constitute a simplified three-layer structure of “electrode conductor-PPTC substrate-electrode conductor.

Abstract: A method for processing polymeric positive temperature coefficient conductive material comprising the steps of placing a polymer material inside a plasma processor and then evacuating air therein to form a vacuum state, supplying a reactive gas to the plasma processor; and utilizing a radio frequency power generator for generating a plasma state inside the plasma processor, wherein the reactive gas is being excited to a high-level energy state, and the excited gas will attack the surface of the material to generate active sites. After that, the plasma-treated polymer material is exposed to air, and the radicals resided on the surface of the material will absorb moisture to form peroxide. The material is ground into powder before being placed inside the plasma processor, so that the contact surface can be increased to generate more radicals.

Abstract: This invention provides a method for making an electrode film for a composite polymer material. A composite plating method is used to form a conductive plate film with microrough surface of 0.01 to 100 microns which will be adhered to a composite polymer material, enhances the adhering performance and reduces the interface electrical resistance.

Abstract: The present invention provides a porous electrode used for a conductive material-filled polymer composite. At least one surface of the porous electrode is an open porous structure, which includes a plurality of macropores and micropores randomly distributed and interconnected with each other. The conductive material-filled polymer composite includes a polymer substrate and conductive particles filled therein. When the surface of the open porous structure of the porous electrode is bonded with the conductive material-filled polymer composite, the conductive particles in the conductive material-filled polymer composite can be trapped in the macropores of the porous structure, and the polymer substrate in the conductive material-filled polymer composite can be immersed into the micropores of the porous structure. This enables a better direct contact between the conductive particles and the porous electrode.

Abstract: A method of making foam material includes a process of impregnating comminuted particles of a previously formed foam material with a first foaming reaction solution made up of polyol, catalyst and additives and with a second foaming reaction solution containing diisocyanate. The comminuted particles are also subjected to a rolling pressure when they are being impregnated with the first foaming reaction solution. The impregnated particles are transferred to a forming area provided with steam serving to accelerate the foaming reaction of the impregnated particles. The foam material so produced is provided with excellent properties.