Abstract: A multilayer ceramic capacitor (MLCC) includes a body including first dielectric layers and second dielectric layers, the body including first to sixth surfaces, a second surface, a third surface, a fourth surface, a fifth surface and a sixth surface; first internal electrodes disposed on the first dielectric layers, exposed to the third surface, the fifth surface, and the sixth surface, and spaced apart from the fourth surface by first spaces; second internal electrodes disposed on the second dielectric layers to oppose the first internal electrodes with the first dielectric layers or the second dielectric layers interposed therebetween, exposed to the fourth surface, the fifth surface, and the sixth surface, and spaced apart from the third surface by second spaces; first dielectric patterns disposed in at least a portion of the first spaces, and second dielectric patterns disposed in at least a portion of the second spaces; and lateral insulating layers.

Abstract: A multilayer ceramic capacitor (MLCC) includes a body including first dielectric layers and second dielectric layers, the body including first to sixth surfaces, a second surface, a third surface, a fourth surface, a fifth surface and a sixth surface; first internal electrodes disposed on the first dielectric layers, exposed to the third surface, the fifth surface, and the sixth surface, and spaced apart from the fourth surface by first spaces; second internal electrodes disposed on the second dielectric layers to oppose the first internal electrodes with the first dielectric layers or the second dielectric layers interposed therebetween, exposed to the fourth surface, the fifth surface, and the sixth surface, and spaced apart from the third surface by second spaces; first dielectric patterns disposed in at least a portion of the first spaces, and second dielectric patterns disposed in at least a portion of the second spaces; and lateral insulating layers.

Abstract: The present invention relates to a positive electrode for a secondary battery in which a maximum diameter of internal pores is controlled to be less than 1 ?m, a method of preparing the same, and a secondary battery including the positive electrode.

Abstract: Provided is a method of manufacturing high strength synthetic fibers, and high strength synthetic fibers manufactured using the same. More particularly, the method involves a localized heating process by raising the temperature of a molten spinning fiber to a temperature higher than that of a pack body during a short period of time with no degradation through a heating zone located in the immediate vicinity of capillary in the spinning nozzle, so as to effectively control the molecular entanglement structure in the molten polymer without reducing the molecular weight and thus to enhance the drawability of the as-spun fibers, thereby improving the mechanical properties of the as-spun fibers, such as strength, elongation, etc., using the existing processes of melt spinning and drawing and thus enabling a mass production of a high-performance fiber at low cost.

Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.

Abstract: A multilayer ceramic capacitor (MLCC) includes a body including first dielectric layers and second dielectric layers, the body including first to sixth surfaces, a second surface, a third surface, a fourth surface, a fifth surface and a sixth surface; first internal electrodes disposed on the first dielectric layers, exposed to the third surface, the fifth surface, and the sixth surface, and spaced apart from the fourth surface by first spaces; second internal electrodes disposed on the second dielectric layers to oppose the first internal electrodes with the first dielectric layers or the second dielectric layers interposed therebetween, exposed to the fourth surface, the fifth surface, and the sixth surface, and spaced apart from the third surface by second spaces; first dielectric patterns disposed in at least a portion of the first spaces, and second dielectric patterns disposed in at least a portion of the second spaces; and lateral insulating layers.

Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.

Abstract: Provided is a technology for recognizing vehicle license plate information which includes detecting a position of a license plate from a vehicle image obtained by imaging a vehicle, extracting individual character images by separating a plurality of characters from a region of the detected license plate in the vehicle image and extracting a license plate type of the license plate according to a predetermined criterion, recognizing a license plate character string on the basis of the extracted individual character images and the license plate type and outputting the recognized license plate character string.

Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.

Abstract: Disclosed is a method providing voice recognition by an electronic device, including receiving a first signal including a request for triggering voice recognition from one or more external devices, triggering a program supporting the voice recognition in response to the first signal, receiving a second signal including voice data corresponding to a user's voice, performing voice recognition on the received voice data, determining an operation corresponding to the recognized voice, determining one or more performing devices which perform the determined operation, and enabling the one or more determined performing devices to perform the determined operation.

Abstract: An apparatus and method for providing one or more protocols for one or more electronic devices are provided. The method includes establishing, by an electronic device configured to provide a framework interface by executing instructions stored in a memory, one or more physical channels with an external electronic device, using one or more communication modules, executing, by the electronic device, two or more application programs to interface with the framework interface, and communicating, via the framework interface, data from the two or more application programs through the one or more physical channels to the external electronic device, using at least one logical channel or session for a respective one of the two or more application programs.

Abstract: A light emitting device package and a method of manufacturing the light emitting device package are provided. The light emitting package includes a light emitting stack including a first conductivity-type semiconductor layer, an active layer, a second conductivity-type semiconductor layer sequentially stacked, and having a first surface provided by the first conductivity-type semiconductor layer and a second surface provided by the second conductivity-type semiconductor layer and opposing the first surface; a first electrode structure disposed on a portion of the first surface and connected to the first conductivity-type semiconductor layer; a sealing portion disposed adjacent to the light emitting stack; an insulating layer disposed between the light emitting stack and the sealing portion; and a first metal pad disposed on the second surface and passing through the insulating layer at a side of the light emitting stack to connect to the first electrode structure.

Abstract: Related are a chemical warfare agent (CWA) decontaminant, a method of decontaminating a CWA using the CWA decontaminant, and a product including the CWA decontaminant. The CWA decontaminant may include a metal-organic framework (MOF) including at least one metallic compound among metal hydroxide, metal hydride, metal acetate, metal methoxide, and metal oxide, and the at least one metallic compound may be dispersed either on a surface of the MOF or in pores of the MOF, or both.

Abstract: A multilayer ceramic capacitor includes a body including first and second dielectric layers and having first to sixth surfaces; a second internal electrode disposed on the second dielectric layer to face the first internal electrode with the first or second dielectric layer interposed therebetween, exposed to the fourth, fifth, and sixth surfaces, and disposed to be spaced apart from the third surface by a second space; a first dielectric pattern disposed in at least a portion of the first space; a second dielectric pattern disposed in at least a portion of the second space; a side insulating layer disposed on the fifth and sixth surfaces; a first external electrode disposed on the third surface; and a second external electrode disposed on the fourth surface, in which the first and second dielectric patterns have a color different from the first and second dielectric layers.

Abstract: A multilayer ceramic capacitor (MLCC) includes a body including first dielectric layers and second dielectric layers, the body including first to sixth surfaces, a second surface, a third surface, a fourth surface, a fifth surface and a sixth surface; first internal electrodes disposed on the first dielectric layers, exposed to the third surface, the fifth surface, and the sixth surface, and spaced apart from the fourth surface by first spaces; second internal electrodes disposed on the second dielectric layers to oppose the first internal electrodes with the first dielectric layers or the second dielectric layers interposed therebetween, exposed to the fourth surface, the fifth surface, and the sixth surface, and spaced apart from the third surface by second spaces; first dielectric patterns disposed in at least a portion of the first spaces, and second dielectric patterns disposed in at least a portion of the second spaces; and lateral insulating layers.

Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.

Abstract: The present disclosure relates to an electron generation apparatus including a discharge pin module provided with a support plate, discharge pins coupled to the support plate, and an elastic connection element electrically connecting a group of discharge pins, a discharge plate placed facing the discharge pins, a support structure positioned at an opposite side to the discharge plate with the support plate interposed between, and provided with a coupling plate to which the discharge pin module and the discharge plate are detachably coupled, and a circuit module provided with a main board positioned apart from the coupling plate at an opposite side to the discharge pin module with the coupling plate interposed between and distribution processing boards connected to the main board to apply individual high-voltage high-frequency pulsed power to the group of discharge pins.

Abstract: A semiconductor light emitting device package includes a light emitting structure having a first conductive semiconductor layer, an active layer, a second conductive semiconductor layer, a first surface, and a second surface, a first electrode and a second electrode disposed on the second surface of the light emitting structure; an insulating layer, a first metal pad and a second metal pad disposed on the insulating layer, and each having a surface with a first fine uneven pattern so as to have a first surface roughness, a first bonding pad and a second bonding pad disposed on the first metal pad and the second metal pad, respectively, and each having a surface with a second fine uneven pattern so as to have a second surface roughness, and an encapsulant encapsulating the first bonding pad, the second bonding pad, the first metal pad, and the second metal pad.

Abstract: The present invention relates to a positive electrode for a secondary battery in which a maximum diameter of internal pores is controlled to be less than 1 ?m, a method of preparing the same, and a secondary battery including the positive electrode.