Patents by Inventor Kun PEI

Kun PEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12293856
    Abstract: The present disclosure provides a copper nanowire composition. The copper nanowire composition includes copper nanowire having associated ligands with the structure HNR1R2, where R1 is hydrogen, alkyl group, or arylalkyl group, R2 is alkyl group or arylalkyl group, wherein the associated ligand has an amount of 100 wt % to 10000 wt % versus a weight of the copper nanowire.
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: May 6, 2025
    Assignees: THE TEXAS A&M UNIVERSITY SYSTEM, FORMOSA PLASTICS CORPORATION
    Inventors: Hung-Jue Sue, Chia-Ying Tsai, Kwang-Ming Chen, Kun-Pei Hsieh, Chao-Shun Chang, Ssu-Ping Huang
  • Publication number: 20250043045
    Abstract: A method for preparing a long-chain branched polypropylene includes subjecting a T-reagent to a polymerization reaction with propylene in the presence of a catalyst composition. The catalyst composition includes an alkylaluminoxane and a metallocene-based catalyst. The metallocene-based catalyst contains a metal selected from the group consisting of titanium (Ti), zirconium (Zr), and hafnium (Hf). The T-reagent having an alkenyl silyl functional group is selected from the group consisting of 1,2-bis[dimethyl(vinyl)silyl]ethane, dimethyldivinylsilane, 7-octenyldimethyl(vinyl)silane, 7-octenyldimethyl(allyl)silane, 4-(but-3-enyl)phenyldimethyl(vinyl)silane, 4-(but-3-enyl)phenyldimethyl(allyl)silane, and combinations thereof.
    Type: Application
    Filed: July 30, 2024
    Publication date: February 6, 2025
    Inventors: Jing-Cherng Tsai, Kwang-Ming Chen, Jung-Hung Kao, Kun-Pei Hsieh, Chao-Shun Chang, Hsing-Chun Chen, Chun-Wei Chiu, Cheng-Hung Chiang, Yu-Chuan Sung, Shang-Lin Tsai, Yu-Sheng Lin
  • Publication number: 20240400730
    Abstract: The present application relates to a polypropylene with high melt flow index and a method for producing the same, and meltblown fiber fabrics. A reacting mixture is firstly provided, and a polymerization process is performed to the reacting mixture in a slurry reaction system to obtain the polypropylene. The reacting mixture includes propylene monomers, Ziegler-Natta catalysts, organoaluminum compounds and electron donor. The polypropylene has high melt flow index and adjustable melting point and molecular weight distribution, such that it is used to produce the meltblown fiber fabrics.
    Type: Application
    Filed: August 15, 2024
    Publication date: December 5, 2024
    Inventors: Kwang-Ming CHEN, Kun-Pei HSIEH, Jung-Hung KAO, Chao-Shun CHANG, Hsing-Chun CHEN
  • Publication number: 20240360251
    Abstract: The present disclosure relates to a catalyst composition for polymerizing propylene and a method for producing polypropylene. The catalyst composition for polymerizing the propylene includes a modifying agent. The modifying agent is an ester compound having hydrophilic groups and hydrophobic groups. In the method for producing the polypropylene, a reverse microcellular structure is formed by the modifying agent during a propylene polymerization, in which the hydrophilic groups are inside the reverse microcellular structure, and the hydrophobic groups are outside the reverse microcellular structure, such that polar substances in a raw material are retained inside the reverse microcellular structure. Thus, poisoning of the catalyst is reduced. Besides, the modifying agent can maintain a valence state of titanium in an active site of the catalyst at positive trivalent, such that the propylene polymerization between the titanium and the monomer is facilitated, thereby enhancing an activity of the catalyst.
    Type: Application
    Filed: September 1, 2023
    Publication date: October 31, 2024
    Inventors: Jung-Hung KAO, Chao-Shun CHANG, Kun-Pei HSIEH, Chun-Wei CHIU
  • Patent number: 12103986
    Abstract: The present application relates to a polypropylene with high melt flow index and a method for producing the same, and meltblown fiber fabrics. A reacting mixture is firstly provided, and a polymerization process is performed to the reacting mixture in a slurry reaction system to obtain the polypropylene. The reacting mixture includes propylene monomers, Ziegler-Natta catalysts, organoaluminum compounds and electron donor. The polypropylene has high melt flow index and adjustable melting point and molecular weight distribution, such that it is used to produce the meltblown fiber fabrics.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: October 1, 2024
    Assignee: FORMOSA PLASTICS CORPORATION
    Inventors: Kwang-Ming Chen, Kun-Pei Hsieh, Jung-Hung Kao, Chao-Shun Chang, Hsing-Chun Chen
  • Publication number: 20240237296
    Abstract: A cooling assembly for liquid cooling of a heat-generating component such as a dual in-line memory module (DIMM) in a computer device is disclosed. The cooling assembly includes a bracket holding a micro-pipe assembly. The micro-pipe assembly has a cold manifold, a hot manifold and a series of micro-pipes. The micro-pipes are fluidly coupled between the cold manifold and hot manifold to allow coolant flow between the cold manifold and the hot manifold. The bracket positions the micro-pipe assembly such that micro-pipes are positioned proximate to opposite sides of the heat-generating component. A coolant inlet supplies coolant to the cold manifold and a coolant outlet collecting coolant from the hot manifold.
    Type: Application
    Filed: March 8, 2023
    Publication date: July 11, 2024
    Inventors: Chao-Jung CHEN, Kun-Pei LIU, Yu-Nien HUANG
  • Publication number: 20240191411
    Abstract: A polypropylene fabric structure, a manufacturing method thereof, and a protective clothing including the polypropylene fabric structure are provided. The polypropylene fabric structure includes a polypropylene spunbond nonwoven fabric and a polypropylene meltblown nonwoven fabric. The polypropylene meltblown nonwoven fabric is directly bonded to the polypropylene spunbond nonwoven fabric. The polypropylene meltblown nonwoven fabric is made of a material including polypropylene having a melt flow index between 1700 g/10 min and 2000 g/10 min and a melting point between 155° C. and 165° C.
    Type: Application
    Filed: March 9, 2023
    Publication date: June 13, 2024
    Inventors: Kwang-Ming CHEN, Jung-Hung KAO, Kun-Pei HSIEH, Han-Chung LIAO, Chun-Tsung CHEN, Chao-Shun CHANG, Yao-Tsung HSIEH, Chia-Yi WEI
  • Patent number: 11937394
    Abstract: A module comprises a tray, a mechanical switch, and a linkage system. The tray is configured to receive a circuit board thereon. The mechanical switch is mounted to the tray and movable between an unsecured position and a secured position. The linkage system is mechanically coupled to the mechanical switch, and moves between an unsecured configuration and a secured configuration in response to the mechanical switch moving between the unsecured position and the secured position. When the module is coupled to a computing device and the linkage system is in the secured configuration, the linkage system engages the computing device, such that the module is locked to the computing device. When the module is coupled to the computing device and the linkage system is in the unsecured configuration, the linkage system is disengaged from the computing device, such that the module is unlocked from the computing device.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Kun-Pei Liu, Te-Hao Hu
  • Patent number: 11910556
    Abstract: An example computing system includes an I/O module that is securable to the computer chassis. The I/O module includes a gear rack. In additional implementations, the computing system includes a fastening assembly which has a fastener configured to receive an external rotational force from a user. In other implementations, the fastening assembly includes a thread mechanism having first and second portions. The first portion of the thread mechanism are rotatably fixed to the fastener. In other implementations, the fastening assembly includes a gear rotatably fixed to the second portion of the thread mechanism, the gear being configured to engage a gear rack coupled to the I/O module. Upon receiving the external rotational force, the thread mechanism also causes (a) the gear to rotate and (b), in turn, linear movement of the gear rack to (c) secure or unsecure the I/O module relative to the computer chassis.
    Type: Grant
    Filed: October 27, 2022
    Date of Patent: February 20, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Kun-Pei Liu, Ming-Lun Ku
  • Publication number: 20240057278
    Abstract: An example computing system includes an I/O module that is securable to the computer chassis. The I/O module includes a gear rack. In additional implementations, the computing system includes a fastening assembly which has a fastener configured to receive an external rotational force from a user. In other implementations, the fastening assembly includes a thread mechanism having first and second portions. The first portion of the thread mechanism are rotatably fixed to the fastener. In other implementations, the fastening assembly includes a gear rotatably fixed to the second portion of the thread mechanism, the gear being configured to engage a gear rack coupled to the I/O module. Upon receiving the external rotational force, the thread mechanism also causes (a) the gear to rotate and (b), in turn, linear movement of the gear rack to (c) secure or unsecure the I/O module relative to the computer chassis.
    Type: Application
    Filed: October 27, 2022
    Publication date: February 15, 2024
    Inventors: Chao-Jung CHEN, Kun-Pei LIU, Ming-Lun KU
  • Patent number: 11836017
    Abstract: An expansion bay for a computer device for easy insertion and extension of an expansion component is disclosed. The expansion bay has two facing side walls, a bottom panel joining the facing side walls, and a closed end. A front cross member joins the side walls to define a front open end. A pair of springs are located the closed end that force the expansion component away from the closed end. A pair of rotating levers are mounted on the front cross member near each of the side walls. Each of the rotating levers has a pin that engages a groove on the expansion component that is inserted through the open front end. The levers are rotated via the pins engaging the grooves when the expansion component is moved into and out of open front end.
    Type: Grant
    Filed: June 6, 2022
    Date of Patent: December 5, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Kun-Pei Liu, Ming-Lun Ku
  • Patent number: 11832417
    Abstract: A computing system includes a chassis, a circuit board including at least one electronic component, a mounting bracket secured to the chassis, a support bracket pivotably coupled to the mounting bracket, and a cold plate coupled to the support bracket. The support bracket is pivotable between a first configuration and a second configuration. The cold plate is in contact with the at least one electronic component in the first configuration, and the cold plate is removed from contact with the at least one electronic component in the second configuration.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: November 28, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Kun-Pei Liu
  • Publication number: 20230345661
    Abstract: A module comprises a tray, a mechanical switch, and a linkage system. The tray is configured to receive a circuit board thereon. The mechanical switch is mounted to the tray and movable between an unsecured position and a secured position. The linkage system is mechanically coupled to the mechanical switch, and moves between an unsecured configuration and a secured configuration in response to the mechanical switch moving between the unsecured position and the secured position. When the module is coupled to a computing device and the linkage system is in the secured configuration, the linkage system engages the computing device, such that the module is locked to the computing device. When the module is coupled to the computing device and the linkage system is in the unsecured configuration, the linkage system is disengaged from the computing device, such that the module is unlocked from the computing device.
    Type: Application
    Filed: June 21, 2022
    Publication date: October 26, 2023
    Inventors: Chao-Jung CHEN, Kun-Pei LIU, Te-Hao HU
  • Publication number: 20230305606
    Abstract: An expansion bay for a computer device for easy insertion and extension of an expansion component is disclosed. The expansion bay has two facing side walls, a bottom panel joining the facing side walls, and a closed end. A front cross member joins the side walls to define a front open end. A pair of springs are located the closed end that force the expansion component away from the closed end. A pair of rotating levers are mounted on the front cross member near each of the side walls. Each of the rotating levers has a pin that engages a groove on the expansion component that is inserted through the open front end. The levers are rotated via the pins engaging the grooves when the expansion component is moved into and out of open front end.
    Type: Application
    Filed: June 6, 2022
    Publication date: September 28, 2023
    Inventors: Chao-Jung Chen, Kun-Pei Liu, Ming-Lun Ku
  • Patent number: 11716828
    Abstract: An expansion bay for a computer system having a rotatable fastening mechanism is disclosed. The expansion bay includes a bay housing having two facing side walls, a front open end and a bottom panel. A front tab and a rear tab extend from the interior of one of the side walls. A tray supporting an expansion component has a guide block with a threaded aperture. The tray may be positioned between an open position and a closed position. The rotatable fastener mechanism moves the tray into and out of the bay housing. A rod is inserted through apertures of the first tab and the second tab, allowing free rotation of the rod. The rod includes a threaded exterior section to rotationally engage the threaded aperture of the guide block. A knob is attached to an end of the rod to allow a user to rotate the rod and move the tray.
    Type: Grant
    Filed: June 6, 2022
    Date of Patent: August 1, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Kun-Pei Liu, Ming-Lun Ku
  • Publication number: 20230174784
    Abstract: The present invention relates to a thermoplastic composition, a thermoplastic composite, and a method for producing the thermoplastic composite. In the method for producing the thermoplastic composite, a polymer, an acid-modified lignin with a specific element content and a compatibilizer with a specific melt flow index and a specific maleic anhydride content are used to produce the thermoplastic composite. Hydroxy groups of the acid-modified lignin react with maleic anhydride groups of the compatibilizer to generate ester bonds via an in-situ reaction catalyzed by acidic groups of the acid-modified lignin to enhance compatibility between the polymer and the lignin, thereby increasing a mechanical strength of the resulted thermoplastic composite.
    Type: Application
    Filed: November 29, 2022
    Publication date: June 8, 2023
    Inventors: Kwang-Ming CHEN, Jung-Hung KAO, Kun-Pei HSIEH, Chao-Shun CHANG, Yen-Ting LIN, Hung-Jue SUE
  • Publication number: 20220377938
    Abstract: A computing system includes a chassis, a circuit board including at least one electronic component, a mounting bracket secured to the chassis, a support bracket pivotably coupled to the mounting bracket, and a cold plate coupled to the support bracket. The support bracket is pivotable between a first configuration and a second configuration. The cold plate is in contact with the at least one electronic component in the first configuration, and the cold plate is removed from contact with the at least one electronic component in the second configuration.
    Type: Application
    Filed: September 1, 2021
    Publication date: November 24, 2022
    Inventors: Chao-Jung CHEN, Kun-Pei LIU
  • Publication number: 20220204661
    Abstract: The present application relates to a polypropylene with high melt flow index and a method for producing the same, and meltblown fiber fabrics. A reacting mixture is firstly provided, and a polymerization process is performed to the reacting mixture in a slurry reaction system to obtain the polypropylene. The reacting mixture includes propylene monomers, Ziegler-Natta catalysts, organoaluminum compounds and electron donor. The polypropylene has high melt flow index and adjustable melting point and molecular weight distribution, such that it is used to produce the meltblown fiber fabrics.
    Type: Application
    Filed: October 18, 2021
    Publication date: June 30, 2022
    Inventors: Kwang-Ming CHEN, Kun-Pei HSIEH, Jung-Hung KAO, Chao-Shun CHANG, Hsing-Chun CHEN
  • Patent number: 11262812
    Abstract: A locking mechanism for securing different expansion cards in a slot of a chassis of a computing device is disclosed. The locking mechanism includes a base and a main body. The base is coupled to the chassis and movable between an open position and a closed position. The main body is coupled to the base and movable between a first orientation and a second orientation. When the base is in the closed position and the main body is in the first orientation, a first mating feature of the main body engages an expansion card having a first form factor inserted into the slot. When the base is in the closed position and the main body is in the second orientation, the second mating feature engages an expansion card having a second form factor inserted into the slot of the chassis.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: March 1, 2022
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Kun-Pei Liu, Chih-Kai Chang
  • Publication number: 20210388180
    Abstract: The present disclosure provides a copper nanowire composition. The a copper nanowire composition includes copper nanowire having associated alkylamine ligands with the structure HNR1R2. where R1 and R2 are independently hydrogen, alkyl or arylalkyl groups. The copper nanowire has an aspect ratio of at least 10. The associated alkylamine ligand is NR1R2 which contains at least 12 carbon atoms.
    Type: Application
    Filed: June 15, 2021
    Publication date: December 16, 2021
    Inventors: Hung-Jue SUE, Chia-Ying TSAI, Kwang-Ming CHEN, Kun-Pei HSIEH, Chao-Shun CHANG, Ssu-Ping HUANG