Patents by Inventor Kun-Yu Kuo

Kun-Yu Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation module and fastening structure thereof
    Patent number: 8251653
    Abstract: A heat dissipation module is disclosed, including a fan and a fastening structure. The fastening structure includes housing and at least one fixing element. The fixing element is disposed on the sidewall of the housing and has a first protruding part extruding from the inner side of the sidewall. When the fan is assembled with the fastening structure, the first protruding part partially enters into at least one molding hole of the frame of the fan and the first protruding part is placed against the edge of the molding hole.
    Type: Grant
    Filed: September 12, 2008
    Date of Patent: August 28, 2012
    Assignee: Delta Electronics, Inc.
    Inventors: Yu-Hsien Lin, Kun-Yu Kuo, Yu-Hung Huang
  • HEAT DISSIPATION MODULE AND FASTENING STRUCTURE THEREOF
    Publication number: 20090145578
    Abstract: A heat dissipation module is disclosed, including a fan and a fastening structure. The fastening structure includes housing and at least one fixing element. The fixing element is disposed on the sidewall of the housing and has a first protruding part extruding from the inner side of the sidewall. When the fan is assembled with the fastening structure, the first protruding part partially enters into at least one molding hole of the frame of the fan and the first protruding part is placed against the edge of the molding hole.
    Type: Application
    Filed: September 12, 2008
    Publication date: June 11, 2009
    Inventors: Yu-Hsien LIN, Kun-Yu KUO, Yu-Hung HUANG
  • HEAT DISSIPATING APPARATUS, HEAT DISSIPATING BASE AND ITS MANUFACTURING METHOD
    Publication number: 20080170369
    Abstract: A heat dissipating apparatus includes a heat dissipating base and a heat dissipating element. The heat dissipating base includes a heat conducting plate and a heat dissipating plate having a hole. The heat conducting plate is disposed in the hole by a way of fitting with the hole and the outer edge of the heat conducting plate is tightly contacted with the inner wall of the hole. The heat dissipating element is disposed on and connected to the heat dissipating base.
    Type: Application
    Filed: January 2, 2008
    Publication date: July 17, 2008
    Inventors: Chin-Ming Chen, Yu-Hung Huang, Kun-Yu Kuo, Sung-Ching Ho
  • Heat dissipating module
    Patent number: D632266
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: February 8, 2011
    Assignee: Delta Electronics, Inc.
    Inventors: Yu-Hung Huang, Kun-Yu Kuo, Chun-Yang Hung