Heat dissipating module

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Description

FIG. 1 is a top, front perspective view from the front and left side of a heat dissipating module showing our new design:

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plane view thereof; and,

FIG. 7 is a bottom plane view thereof.

Claims

The ornamental design for a heat dissipating module, as shown and described herein.

Referenced Cited
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Patent History
Patent number: D632266
Type: Grant
Filed: Sep 18, 2009
Date of Patent: Feb 8, 2011
Assignee: Delta Electronics, Inc. (Taoyuan Hsien)
Inventors: Yu-Hung Huang (Taoyuan Hsien), Kun-Yu Kuo (Taoyuan Hsien), Chun-Yang Hung (Taoyuan Hsien)
Primary Examiner: Selina Sikder
Attorney: Muncy, Geissler, Olds & Lowe, PLLC
Application Number: 29/343,811
Classifications
Current U.S. Class: Heat Sink (D13/179)