Abstract: A display device includes: a substrate; a first transistor and a second transistor disposed on the substrate; a first electrode and a second electrode, wherein the first electrode is electrically connected to the first transistor through a first via hole, and the second electrode is electrically connected to the second transistor through a second via hole; a first signal line disposed on the substrate and overlapped with the first electrode and the second electrode; and a second signal line disposed on the substrate and adjacent to the first signal line, wherein the first signal line and the second signal line extend along a first direction, wherein a distance between the first via hole and the second via hole along the first direction is greater than a distance between the first signal line and the second signal line along a second direction different the first direction.

Abstract: A display device includes: a substrate; a first transistor and a second transistor disposed on the substrate; a first electrode and a second electrode, wherein the first electrode is electrically connected to the first transistor through a first via hole, and the second electrode is electrically connected to the second transistor through a second via hole; a first signal line disposed on the substrate and overlapped with the first electrode and the second electrode; and a second signal line disposed on the substrate and adjacent to the first signal line, wherein the first signal line and the second signal line extend along a first direction, wherein a distance between the first via hole and the second via hole along the first direction is greater than a distance between the first signal line and the second signal line along a second direction different the first direction.

Abstract: A modulation device including a plurality of electronic elements, at least one first signal line and a first driving circuit is provided. The at least one first signal line is respectively electrically connected to at least one of the electronic elements. The first driving circuit is electrically connected to the at least one first signal line. The first driving circuit provides a first signal to at least one of the at least one first signal line. The first signal includes a first pulse. The first pulse includes a first section and a second section closely adjacent to the first section.

Abstract: A heat pipe comprises a flat tube and a wick structure. The flat tube includes a hollow chamber and has two opposite sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the flat tube. The wick structure has a smooth form with continuous edge and without the sectional difference along the axial direction. The front section is near the front sealed end, the rear section is near the rear sealed end. The smooth form has a maximum length parallel to the width direction, respectively. The maximum lengths are gradually decreased along the axial direction.

Abstract: A display device includes: a substrate; a first transistor and a second transistor disposed on the substrate; a first electrode and a second electrode, wherein the first electrode is electrically connected to the first transistor through a first via hole, and the second electrode is electrically connected to the second transistor through a second via hole; a first signal line disposed on the substrate and overlapped with the first electrode and the second electrode; and a second signal line disposed on the substrate and adjacent to the first signal line, wherein the first signal line and the second signal line extend along a first direction, wherein a distance between the first via hole and the second via hole along the first direction is greater than a distance between the first signal line and the second signal line along a second direction different the first direction.

Abstract: An electronic device includes a substrate, a first transistor and a second transistor. The first transistor is disposed on the substrate and has a first terminal electrically connected to a first voltage level, a second terminal and a control terminal. The second transistor is disposed on the substrate and has a first terminal electrically connected to the second terminal of the first transistor, a second terminal electrically connected to a second voltage level, and a control terminal electrically connected to the control terminal of the first transistor. Wherein a voltage value of the first voltage level is greater than a voltage value of the second voltage level.

Abstract: An electronic device is provided. The electronic device includes at least one electronic circuit, a scan line, and a scan signal conversion circuit. The scan line transmits a first scan signal. The scan signal conversion circuit is electrically connected to the at least one electronic circuit and the scan line. The scan signal conversion circuit receives the first scan signal, converts the first scan signal into a second scan signal, and provides the second scan signal to the at least one electronic circuit.

Abstract: A compressor assembly is described comprising a compressor for generating an airflow through the compressor assembly and a silencer located downstream of the compressor. The silencer comprises a plurality of holes through which a portion of the airflow flows, a first end proximal to the compressor, a second end distal to the compressor, and serrations provided at one of the first end and the second end and between which a further portion of the airflow flows.

Abstract: An electronic device including a first base, a first conductive layer, an insulating layer, a first electronic element, a second base, and a second electronic element is provided. The first conductive layer is disposed on the first base. The insulating layer is disposed on the first conductive layer and has a first hole, wherein the first hole exposes at least a portion of the first conductive layer. The first electronic element is disposed on the first base. The second base is disposed between the insulating layer and the first electronic element, and has a second hole. The second electronic element is electrically connected to the first conductive layer. The first electronic element is electrically connected to the first conductive layer via the second hole and the first hole, and in a cross-sectional view of the electronic device, the second hole is different from the first hole in width.

Abstract: A heat pipe comprises a flat tube and a wick structure. The flat tube includes a hollow chamber and has a front and a rear sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the flat tube. The wick structure is divided into a front, a middle and a rear sections sequentially along the axial direction. The front section is near the front sealed end, the rear section is near the rear sealed end. The front, middle and rear sections have a maximum length parallel to the width direction, respectively. The maximum length of the front section is greater than that of the middle section, and the maximum length of the middle section is greater than that of the rear section.

Abstract: The disclosure provides an electronic device including a support plate and a first panel. The support plate includes a first bridge member and a second bridge member. The first panel is disposed on the support plate and includes a substrate, a signal line, a third bridge member, and a fourth bridge member. The signal line is disposed on the substrate. The third bridge member penetrates through the substrate and is electrically connected to the signal line and the first bridge member. The fourth bridge member penetrates through the substrate and is electrically connected to the signal line and the second bridge member.

Abstract: An electronic device is provided. The electronic device includes a first substrate and a plurality of light-emitting elements disposed on the first substrate. The plurality of light-emitting elements include a contact pad; an intermediate substrate disposed on the contact pad; and a light-emitting unit disposed on the intermediate substrate. The electronic device further includes a second substrate and a first thin-film transistor array disposed on the second substrate for driving at least a portion of the plurality of light-emitting elements. The light-emitting unit is electrically connected to the contact pad through a via hole that penetrates the intermediate substrate.

Abstract: An electronic circuit is provided. The electronic circuit includes an electronic element, a driving transistor, a first emitting transistor, and at least one capacitor. A first terminal of the driving transistor is coupled to a power voltage. The power voltage is used to drive the electronic element via the driving transistor. A first terminal of the first emitting transistor is coupled to a second terminal of the driving transistor. A second terminal of the first emitting transistor is coupled to the electronic element. A first terminal of the at least one capacitor is coupled to a gate terminal of the driving transistor. When the electronic element is driven, a second terminal of the at least one capacitor receives the power voltage.

Abstract: A package structure including an interposer, at least one semiconductor die and an insulating encapsulation is provided. The interposer includes a semiconductor substrate and an interconnect structure disposed on the semiconductor substrate, the interconnect structure includes interlayer dielectric films and interconnect wirings embedded in the interlayer dielectric films, the semiconductor substrate includes a first portion and a second portion disposed on the first portion, the first interconnect structure is disposed on the second portion, and a first maximum lateral dimension of the first portion is greater than a second maximum lateral dimension of the second portion. The at least one semiconductor die is disposed over and electrically connected to the interconnect structure. The insulating encapsulation is disposed on the first portion, wherein the insulating encapsulation laterally encapsulates the least one semiconductor die and the second portion.

Abstract: A light-emitting device is provided. The light-emitting device includes a circuit substrate, an array substrate, a plurality of light-emitting units and a driver. The circuit substrate has a top surface. A top circuit is disposed on the top surface. The array substrate is disposed on the top surface of the circuit substrate and electrically connected to the top circuit. The light-emitting units are disposed on the array substrate. The light-emitting device further includes an electrical connection structure, a plurality of light extraction layers, a protective layer, a plurality of test pads, and a light absorption layer. The plurality of test pads are disposed on the array substrate, and the light absorption layer covers at least one of the test pads.

Abstract: A package structure including an interposer, at least one semiconductor die and an insulating encapsulation is provided. The interposer includes a semiconductor substrate and an interconnect structure disposed on the semiconductor substrate, the interconnect structure includes interlayer dielectric films and interconnect wirings embedded in the interlayer dielectric films, the semiconductor substrate includes a first portion and a second portion disposed on the first portion, the first interconnect structure is disposed on the second portion, and a first maximum lateral dimension of the first portion is greater than a second maximum lateral dimension of the second portion. The at least one semiconductor die is disposed over and electrically connected to the interconnect structure. The insulating encapsulation is disposed on the first portion, wherein the insulating encapsulation laterally encapsulates the least one semiconductor die and the second portion.

Abstract: A vapor chamber is provided. The vapor chamber is adapted to be thermally connected to an electronic element. The vapor chamber includes a first member and a second member. The first member has a first heat transfer coefficient. The first member is connected to the electronic element. The second member has a second heat transfer coefficient. The second member is combined with the first member. The first member is located between the second member and the electronic element. The first heat transfer coefficient is greater than the second heat transfer coefficient.

Abstract: A display device includes: a substrate; a first transistor and a second transistor disposed on the substrate; a first electrode and a second electrode, wherein the first electrode is electrically connected to the first transistor through a first via hole, and the second electrode is electrically connected to the second transistor through a second via hole; a first signal line disposed on the substrate and overlapped with the first electrode and the second electrode; and a second signal line disposed on the substrate and adjacent to the first signal line, wherein the first signal line and the second signal line extend along a first direction, wherein a distance between the first via hole and the second via hole along the first direction is greater than a distance between the first signal line and the second signal line along a second direction different the first direction.

Abstract: A light-emitting device is provided. The light-emitting device includes a circuit substrate, an array substrate, a plurality of light-emitting units and a driver. The circuit substrate has a top surface. A top circuit is disposed on the top surface. The array substrate is disposed on the top surface of the circuit substrate and electrically connected to the top circuit. The light-emitting units are disposed on the array substrate. The light-emitting device further includes an electrical connection structure, a plurality of light extraction layers, a protective layer, a plurality of test pads, and a light absorption layer. The plurality of test pads are disposed on the array substrate, and the light absorption layer covers at least one of the test pads.

Abstract: A training data processing method and an electronic device are provided. The method includes: obtaining medical history data including at least one first disease suffered by a user; setting a plurality of disease types according to a target disease; setting a time interval; obtaining at least one second disease in the time interval from the medical history data; performing a pre-processing operation on the second disease according to the disease types to obtain processed data; and inputting the processed data to a neural network to train the neural network.