Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can give a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can give a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can gives a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: A through-hole wiring board comprising through-holes passing through a substrate and filled with an electroconductive material; copper toil lands and copper foil circuits formed on surfaces of the substrate; insulating layers formed on the copper toil circuits and between necessary portions of the copper foil lands and the copper foil circuits; and printed circuits (jumper circuits) formed by another electroconductive material having a different composition from that filling the through-holes on a part of the copper foil circuits, and the copper foil lands and the insulating layers except for unnecessary portions for electroconductivity; wherein the printed circuits and ends of the through-holes are electrically connected with an electroconductive material having a different composition from that filling the through-holes, permits easy formation of an electrical connection of the through-holes, has a high reliability on connection and is suitable for industrial production.

Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can give a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: A through-hole wiring board comprising through-holes passing through a substrate and filled with an electroconductive material; copper foil lands and copper foil circuits formed on surfaces of the substrate; insulating layers formed on the copper foil circuits and between necessary portions of the copper foil lands and the copper foil circuits; and printed circuits (jumper circuits) formed by another electroconductive material having a different composition from that filling the through-holes on a part of the copper foil circuits, and the copper foil lands and the insulating layers except for unnecessary portions for electroconductivity; wherein the printed circuits and ends of the through-holes are electrically connected with an electroconductive material having a different composition from that filling the through-holes, permits easy formation of an electrical connection of the through-holes, has a high reliability on connection and is suitable for industrial production.

Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can give a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastormer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can gives a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: A photosensitive resin composition comprising (A) a photosensitive resin having one or more carboxyl groups, (B) a special epoxy curing agent, and (C) a photopolymerization initiator is excellent in adhesiveness, heat resistance, resistance to PCT and developability and suitable as a solder resist composition.

Abstract: A flame spraying burner melts or partially melts with combustion heat, a spray material comprising a powdered fire-resisting material to thermally spray a damaged portion of a furnace wall or the like. The flame spraying burner includes a burner nozzle body having a central passage for supplying oxygen-contained gas, the central passage having a projecting leading end, and a plurality of fuel gas supply passages formed around the central passage. Each of the plurality of fuel gas supply passages has a leading end recessed from the leading end of the central passage. A cylindrical burner tile is positioned around the leading end of the fuel gas supply passages and extends to at least the leading end of the central passage. A plurality of oxygen jetting ports are formed in the radial direction around the leading end of the nozzle cap.

Abstract: A column base structure formed by integrally joining a column base metal fitting having a raised portion and a base plate to a steel-frame column, and joining the column base metal fitting joined to the steel-frame column to a concrete foundation via anchor bolts embedded in the concrete foundation, in which an anchor-bolt retainer having an upper anchor plate and a lower anchor plate is fixedly fitted to support members installed on a concrete subslab, anchor bolts are hold in position via the anchor-bolt retainer, and the anchor bolts are embedded, together with the anchor-bolt retainer, into the concrete foundation.

Abstract: In this invention, a back end portion of a preceding sheet bar and a front end of a succeeding sheet bar are cut in a transfer line at an entrance side of a finish rolling mill so that at least both side edge regions of these sheet bars are contacted with each other at a butted contact state thereof and a gap is formed between both end portions and then portions to be joined int he preceding and succeeding sheet bars are locally heated and pushed to join them while gradually enlarging a joining area, whereby the required time is largely reduced as compared with the conventional technique and also it is attempted to miniaturize the heating apparatus and shorten the length of the apparatus.

Abstract: A photosensitive resin composition comprising (A) a polymer obtained by reacting an isocyanate compound having an ethylenic unsaturated group with a polymer which is a reaction product of a tetracarboxylic acid dianhydride and a diamine, and (B) a photoinitiator, can provide a thick film excellent in heat resistant, adhesiveness, flexibility, electrical and mechanical properties, and is particularly suitable for producing a photosensitive element.

Abstract: An anti-oxidation agent for preventing oxidation of a stainless steel strip during continuous annealing comprising a colloidal inorganic substance which can be crystallized at a temperature not higher than 1300.degree. C. at least one compound having a melting point not higher than 1300.degree. C., selected from the group consisting of silicates, borates and phosphates, a dispersion agent, and the balance substantially water. The anti-oxidation agent is applied to the surface of the stainless steel strip. During the annealing, the anti-oxidation agent enhances the heat absorption so that the stainless steel strip temperature is elevated to the annealing temperature in a short time. The anti-oxidation agent on the strip surface forms a film of a fine structure which keeps the strip surface away from oxidizing components of the annealing atmosphere so as to suppress generation of oxide scale. The film is easily separated due to thermal contraction in the course of the cooling after the annealing.

Abstract: A structure having a movable dome-type roof including a plurality of independently movable shell sections which nest one beneath the other. A frame superstructure is arched over the dome to support the upper ends of the shell sections. The lower edges of the shell sections are mounted on self-powered carriages and are independently shiftable about a circular base of the structure. By selectively shifting individual shell sections, the dome may be contracted or expanded as desired. The superstructure may be mounted on a circular track or on a pair of linear tracks to expedite the opening and closing of the dome.

Abstract: An elasto-plastic damper adapted to be used in a structure for absorbing vibration energy created by earthquake tremors and other ground vibrations. The damper is formed from flat plates to simplify design and to minimize costs. The damper may be used in combination to absorb vibration energy impacting the structure from different directions.

Abstract: A descaling method for removing oxide scale from a hot-rolled stainless steel strip. A solution of an alkaline earth metal chloride is applied to the surface of the oxide scale layer formed on the hot-rolled stainless steel strip, and the solution is allowed to penetrate into the oxide scale layer. In a subsequent annealing, the solution is heated and dehydrated to become solid matter and the dehydrated matter is melted and diffused into the oxide scale layer to soften the oxide scale layer. The oxide scale layer is then removed by a simple mechanical descaling by, for example, grinding brushes with or without a subsequent chemical descaling by a weak acid solution.

Abstract: A vibration absorbing device to be secured between structural and non-structural members of a framed structure. An outer ring may be secured to a structural member and an inner ring is concentrically positioned within said outer ring and may be secured to a non-structural member. Radial spokes interconnecting the inner and outer rings are adapted to elasto-plastically deform when one ring is arcuately shifted relative to the other ring responsive to vibration of the inner and/or outer ring, thereby absorbing the energy of vibration.

Abstract: A connector/beam joining method for joining a beam and a connector having a base plate and a projection, both formed into a T-shape in cross-section, in which the edge of a welding groove provided on the end of the projection of the connector is matched with the edge of the inside surface of a flange constituting the beam for positioning, and a backing strip formed into a prescribed length is fixedly fitted by welding so as to come in close contact with the end surface of the projection and the inside surface of the flange.

Abstract: An elasto-plastic damper is adapted to be used in a structure, such as a building and other facilities, for absorbing vibration energy created by earthquake tremors and other ground vibrations. The damper is a centrally bulged and generally cone-shaped hollow body of revolution so that its section modulus changes substantially porportional to a bending moment created in the damper body due to horizontal stresses, thus permitting a maximum degree of deformability. This elasto-plastic damper is compact in size and demonstrates a high degree of vibrational energy absorbability.