Patents by Inventor Kuniaki Yamaguchi
Kuniaki Yamaguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11938945Abstract: An information processing system includes one or more vehicles, and a server communicable with the one or more vehicles. The vehicle acquires an image obtained by imaging a road on which a host vehicle is located. The vehicle or the server determines a degree of difficulty in traveling on the road due to snow cover from the image. The server stores the degree of difficulty in traveling for each of one or more roads, and provides information to a client by using the stored degree of difficulty in traveling for each of one or more roads.Type: GrantFiled: April 28, 2022Date of Patent: March 26, 2024Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Eiichi Kusama, Masatoshi Hayashi, Hisanori Mitsumoto, Kuniaki Jinnai, Makoto Akahane, Yuriko Yamaguchi, Daisuke Kato
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Publication number: 20230405762Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.Type: ApplicationFiled: July 5, 2023Publication date: December 21, 2023Inventors: Kuniaki YAMAGUCHI, Itsuki KOBATA, Toshio MIZUNO, Mitsuru MIYAZAKI, Naoki TOYOMURA, Takuya INOUE
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Publication number: 20230381916Abstract: One object is to suppress a substrate from being dried in the course of releasing the substrate from a substrate holding member in an apparatus for polishing.Type: ApplicationFiled: May 25, 2023Publication date: November 30, 2023Inventors: Kuniaki YAMAGUCHI, Dai YOSHINARI, Kentaro ASANO
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Publication number: 20230352326Abstract: A polishing apparatus is provided. The polishing apparatus includes: a polishing unit configured to polish a substrate by bringing a polishing tool into contact with the substrate and moving the substrate relatively to the polishing tool; a cleaning unit; and a first transfer robot configured to transfer the substrate before polishing to the polishing unit and/or configured to transfer the substrate after polishing from the polishing unit to the cleaning unit. The cleaning unit includes: at least one cleaning module, a buff processing module configured to perform a buff process to the substrate, and a second transfer robot configured to transfer the substrate between the cleaning module and the buff processing module, the second transfer robot being different from the first robot.Type: ApplicationFiled: July 10, 2023Publication date: November 2, 2023Inventors: Kuniaki YAMAGUCHI, Toshio MIZUNO, Itsuki KOBATA, Mitsuru MIYAZAKI, Naoki TOYOMURA, Takuya INOUE
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Patent number: 11731240Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.Type: GrantFiled: December 20, 2018Date of Patent: August 22, 2023Assignee: EBARA CORPORATIONInventors: Kuniaki Yamaguchi, Itsuki Kobata, Toshio Mizuno, Mitsuru Miyazaki, Naoki Toyomura, Takuya Inoue
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Publication number: 20230226662Abstract: A pusher that holds a substrate includes: a pusher body, and a plurality of seating members that is attached to the pusher body and on which a substrate is seated. Each of the plurality of seating members includes: a pedestal member including a seating portion on which the substrate is seated and a magnet disposed at a position different from the seating portion, and supported by the pusher body such that the position of the magnet is moved according to seating or leaving of the substrate; a seating sensor configured to detect movement of the magnet; and a magnetic member disposed to shield a portion between a movable region of the magnet and the seating sensor.Type: ApplicationFiled: January 9, 2023Publication date: July 20, 2023Inventors: Kuniaki YAMAGUCHI, Kentaro ASANO, Dai YOSHINARI
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Publication number: 20230001539Abstract: A liquid feeder includes: a first arm having a first nozzle; a second arm having a second nozzle; a first rotation shaft supporting a proximal end part of the first arm; a second rotation shaft supporting a proximal end part of the second arm; a first rotation driver configured to rotate the first rotation shaft to turn the first arm from a fluid feed position to a retracted position; a second rotation driver configured to rotate the second rotation shaft to turn the second arm from a fluid feed position to a retracted position; and a controller. The first rotation shaft and the second rotation shaft are disposed coaxially with each other. The controller is capable of controlling the operation of the first rotation driver and the operation of the second rotation driver independently of each other.Type: ApplicationFiled: June 27, 2022Publication date: January 5, 2023Inventors: Kuniaki YAMAGUCHI, Masayuki TAMURA, Kenji SHINKAI, Soichi ISOBE, Yusuke MOCHIDA
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Patent number: 11541502Abstract: A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.Type: GrantFiled: March 4, 2020Date of Patent: January 3, 2023Assignee: EBARA CORPORATIONInventors: Kuniaki Yamaguchi, Hiroshi Shimomoto, Soichi Isobe, Koji Maeda, Kenji Shinkai, Hidetatsu Isokawa, Dai Yoshinari, Masayuki Tamura, Haiyang Xu, Shun Ehara, Kentaro Asano
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Publication number: 20210394332Abstract: A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.Type: ApplicationFiled: March 4, 2020Publication date: December 23, 2021Inventors: Kuniaki YAMAGUCHI, Hiroshi SHIMOMOTO, Soichi ISOBE, Koji MAEDA, Kenji SHINKAI, Hidetatsu ISOKAWA, Dai YOSHINARI, Masayuki TAMURA, Haiyang XU, Shun EHARA, Kentaro ASANO
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Patent number: 11192216Abstract: A polishing method of polishing a substrate while preventing coarse particles from being discharged onto a polishing pad is disclosed. In this polishing method, a substrate is brought into sliding contact with a polishing pad while a polishing liquid, which has passed through a filter, is supplied onto the polishing pad. The polishing method includes: passing the polishing liquid through the filter while increasing a physical quantity of the polishing liquid until the physical quantity reaches a predetermined set value, the physical quantity being one of flow rate and pressure of the polishing liquid; and polishing the substrate W on the polishing pad while supplying the polishing liquid that has passed through the filter onto the polishing pad.Type: GrantFiled: February 15, 2018Date of Patent: December 7, 2021Assignee: EBARA CORPORATIONInventors: Hiromitsu Watanabe, Kuniaki Yamaguchi, Itsuki Kobata, Yutaka Wada
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Publication number: 20210023672Abstract: The invention simulates polishing amount taking into account pressure concentration that occurs in the vicinity of the edge of a substrate when a small-diameter buffing pad overhangs the substrate to be buffed. One embodiment of the invention provides a method for simulating polishing amount in a case where a polishing pad of a smaller size than a substrate is used to buff the substrate. The method includes measuring distributions of pressure that is applied from the polishing pad to the substrate according to each overhang amount of the polishing pad relative to the substrate by using a pressure sensor, and correcting the pressure that is used in the polishing amount simulation in accordance with the overhang amounts and the measured pressure distributions.Type: ApplicationFiled: September 2, 2020Publication date: January 28, 2021Inventors: Kuniaki Yamaguchi, Itsuki Kobata, Toshio Mizuno
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Publication number: 20210013071Abstract: A polishing apparatus is provided. The polishing apparatus includes: a polishing unit configured to polish a substrate by bringing a polishing tool into contact with the substrate and moving the substrate relatively to the polishing tool; a cleaning unit; and a first transfer robot configured to transfer the substrate before polishing to the polishing unit and/or configured to transfer the substrate after polishing from the polishing unit to the cleaning unit. The cleaning unit includes: at least one cleaning module, a buff processing module configured to perform a buff process to the substrate, and a second transfer robot configured to transfer the substrate between the cleaning module and the buff processing module, the second transfer robot being different from the first robot.Type: ApplicationFiled: September 29, 2020Publication date: January 14, 2021Inventors: Kuniaki Yamaguchi, Toshio Mizuno, Itsuki Kobata, Mitsuru Miyazaki, Naoki Toyomura, Takuya Inoue
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Patent number: 10818531Abstract: A substrate transport system includes a hand, a main positioning member permanently mounted on a base, where the main positioning member is engageable with the hand at a position offset by a first distance in the first axis direction and offset by a second distance in the second axis direction from a substrate transfer position, and a control unit that stores a position coordinate in the first axis direction and a position coordinate in the second axis direction of the hand in a state where the hand is positioned by being engaged with the main positioning member.Type: GrantFiled: November 29, 2018Date of Patent: October 27, 2020Assignee: EBARA CORPORATIONInventors: Kuniaki Yamaguchi, Haiyang Xu, Koji Maeda, Mitsuhiko Inaba
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Patent number: 10792782Abstract: The invention simulates polishing amount taking into account pressure concentration that occurs in the vicinity of the edge of a substrate when a small-diameter buffing pad overhangs the substrate to be buffed. One embodiment of the invention provides a method for simulating polishing amount in a case where a polishing pad of a smaller size than a substrate is used to buff the substrate. The method includes measuring distributions of pressure that is applied from the polishing pad to the substrate according to each overhang amount of the polishing pad relative to the substrate by using a pressure sensor, and correcting the pressure that is used in the polishing amount simulation in accordance with the overhang amounts and the measured pressure distributions.Type: GrantFiled: January 18, 2016Date of Patent: October 6, 2020Assignee: EBARA CORPORATIONInventors: Kuniaki Yamaguchi, Itsuki Kobata, Toshio Mizuno
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Patent number: 10688622Abstract: A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.Type: GrantFiled: June 6, 2017Date of Patent: June 23, 2020Assignee: Ebara CorporationInventors: Hiroshi Aono, Kuniaki Yamaguchi, Hiroshi Shimomoto, Koji Maeda, Tetsuya Yashima, Kenji Shinkai, Koichi Hashimoto, Mitsuhiko Inaba, Hidetatsu Isokawa, Hidetaka Nakao, Soichi Isobe
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Patent number: 10618140Abstract: The present invention relates to a substrate processing system and a substrate processing method capable of cleaning a processing-liquid supply line. A substrate processing system includes: a substrate processing apparatus (1) configured to process a substrate W; and a flushing device for cleaning a distribution line (93) and a processing-liquid supply line (92). The flushing device includes: a cleaning-liquid supply line (99) coupled to the distribution line (93); a drain mechanism (101) configured to direct a cleaning liquid, supplied into the processing-liquid supply line (92) through the distribution line (93), to a liquid disposal area (100); a supply switching valve (104) configured to allow only the processing liquid or the cleaning liquid to flow in the distribution line (93); and an operation controller (30) configured to control operations of the drain mechanism (101) and the supply switching valve (104).Type: GrantFiled: March 4, 2015Date of Patent: April 14, 2020Assignee: EBARA CORPORATIONInventor: Kuniaki Yamaguchi
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Patent number: 10573509Abstract: The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.Type: GrantFiled: June 23, 2017Date of Patent: February 25, 2020Assignee: Ebara CorporationInventors: Koji Maeda, Hiroshi Shimomoto, Kuniaki Yamaguchi, Hiroshi Aono, Tetsuya Yashima, Hidetatsu Isokawa, Kenji Shinkai, Mitsuhiko Inaba, Koichi Hashimoto, Junji Kunisawa, Mitsuru Miyazaki, Fujihiko Toyomasu
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Publication number: 20190164796Abstract: A substrate transport system includes a hand, a main positioning member permanently mounted on a base, where the main positioning member is engageable with the hand at a position offset by a first distance in the first axis direction and offset by a second distance in the second axis direction from a substrate transfer position, and a control unit that stores a position coordinate in the first axis direction and a position coordinate in the second axis direction of the hand in a state where the hand is positioned by being engaged with the main positioning member.Type: ApplicationFiled: November 29, 2018Publication date: May 30, 2019Inventors: Kuniaki YAMAGUCHI, Haiyang XU, Koji MAEDA, Mitsuhiko INABA
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Publication number: 20190118338Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.Type: ApplicationFiled: December 20, 2018Publication date: April 25, 2019Inventors: Kuniaki YAMAGUCHI, Itsuki KOBATA, Toshio MIZUNO, Mitsuru MIYAZAKI, Naoki TOYOMURA, Takuya INOUE
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Patent number: 10201888Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.Type: GrantFiled: May 24, 2017Date of Patent: February 12, 2019Assignee: EBARA CORPORATIONInventors: Kuniaki Yamaguchi, Itsuki Kobata, Toshio Mizuno, Mitsuru Miyazaki, Naoki Toyomura, Takuya Inoue