Abstract: A laser machining method and a laser machining apparatus superior in hole position accuracy and hole quality. An outgoing beam outputted as short pulses is shaped by a pulse shaping unit so as to form a #1 branch beam. The #1 branch beam is supplied to a portion to be machined, so as to machine the portion. In this case, the #1 branch beam may be controlled to synchronize with the outgoing beam. When a piece to be machined is made from a metal material and at least one of an organic material and an inorganic material, the metal material is machined with a laser beam shaped to have a pulse width not shorter than 100 ns, and at least one of the organic material and the inorganic material is machined with a laser beam shaped to have a pulse width shorter than 100 ns.

Abstract: There is provided a laser machining method and a laser machining apparatus whose machining accuracy and quality excel without lowering machining efficiency. One hole is machined by a split beam that is a first pulsed laser beam and another split beam that is a second pulsed laser beam whose irradiation position is determined based on irradiation position of the first laser beam. In this case, the machining quality may be improved by machining the circular hole by equalizing circling directions and angular velocity of the split beams. A beam splitter splits a laser beam outputted out of one laser oscillator into the split beams and AOMs can time-share them.

Abstract: A method for use in two-components electrostatic image developers is disclosed, in which secure separation of a carrier coating resinous materials from a core magnetic material is achieved without affecting the properties of the core materials through process steps benign to the environment in super- or sub-critical water compositions under the conditions of a temperature of 300° C. or more and a pressure of 20 MPa. The core magnetic material is subsequently recycled for forming carrier. This method may also be useful for processing waste including magnetic materials with silicone resin coating.

Abstract: There is provided a method for removing molten and scattered Cu and overhang that are generated around a via opening during laser machining in a direct laser via forming method of directly machining an outer-layer copper foil. In a manufacturing method of a printed wiring board of machining the via by laser directly through the copper foil of a copper-clad laminate in which the copper foil is clad on a base material resin, a process for machining the via is carried out in a sequence of (a) a copper foil surface treatment step of forming an oxide film on the surface of said copper foil, (b) a laser via machining step, (c) an alkali treatment step and (d) a molten and scattered Cu etching step. It is desirable to carry out (e) a de-smearing treatment after the molten and scattered Cu etching.

Abstract: A method and an apparatus for perforating a printed circuit board are provided so that the processing efficiency and the board densification can be improved. In test processing, a conductor layer 50i is irradiated with a pulsed laser beam 4a whose energy density is set at a value high enough to process the conductor layer 50i while emission 23a from a processed portion is monitored. Thus, the number of pulses of irradiation required for processing a window in the conductor layer 50i is obtained. An insulating layer 51i is irradiated with a pulsed laser beam 5a whose energy density is set at a value high enough to process the insulating layer 51i but low enough not to process a conductor layer 50i+1 under the insulating layer 51i. Thus, the number of pulses of irradiation required for processing a window in the insulating layer 51i is obtained.

Abstract: There is provided a laser drilling method that prevents hanging, expansion, or crinkles of copper foil caused when an ultraviolet laser beam that requires no surface roughening is used for a thin double-sided copper-clad film. The drilling method of the copper-clad film comprises the steps of: using an ultraviolet laser as a laser beam; drilling after bonding a resin film to the backside of the film which is the opposite side to the laser-beam-incidence; and delaminating the resin film on the backside after drilling. The resin film bonded to the backside prevents the copper foil from hanging, thus allowing the laser beam to be efficiently applied to the copper foil, and allowing the copper foil to be completely removed by ablation. In the case of a blind hole, the resin film bonded to the backside prevents expansion of the copper foil. Crinkles can be also prevented.

Abstract: The invention is to provide a printed circuit board in which advance of packaging density of the printed circuit board and reduction in production cost can be attained while processing quality can be made uniform, a method for processing the printed circuit board and a method for producing the printed circuit board. There is provided a printed circuit board including an alternate laminate of electric conductor layers and electrically insulating layers, wherein a coating layer capable of absorbing laser light but insoluble in an etching solution dissolving the electric conductor layers is provided on a front surface of a first one of the electric conductor layers. In this case, the coating layer may be provided on a front surface of a rear one of the electric conductor layers. Each of the electric conductor layers may contain Cu as a main component while the coating layer may contain CuO as a main component. The coating layer may have a thickness not thinner than 0.6 ?m.

Abstract: A method for forming II-type cellulose, which comprises introducing together a slurry having water and a I-type cellulose dispersed therein and water in the state of high temperature and high pressure to a tubular reactor (28) contacting the I-type cellulose with a hot water in a supercritical state or subcritical state for a predetermined time in the tubular reactor (28), to thereby cleave a part of the hydrogen bonds in the I-type cellulose and dissolve the I-type cellulose into the water in a supercritical state or subcritical state, cooling a cellulose solution discharged from the tubular reactor (28) in a cooler (30) to room temperature or lower, followed by allowing to stand, to thereby precipitate crystals of II-type cellulose having a molecular weight lower than that of the I-type cellulose, and separating the resultant II-type cellulose from a solvent. The method allows the preparation of pure II-type cellulose by the use of a simple process.

Abstract: A laser machining method and a laser machining apparatus superior in hole position accuracy and hole quality. An outgoing beam outputted as short pulses is shaped by a pulse shaping unit so as to form a #1 branch beam. The #1 branch beam is supplied to a portion to be machined, so as to machine the portion. In this case, the #1 branch beam may be controlled to synchronize with the outgoing beam. When a piece to be machined is made from a metal material and at least one of an organic material and an inorganic material, the metal material is machined with a laser beam shaped to have a pulse width not shorter than 100 ns, and at least one of the organic material and the inorganic material is machined with a laser beam shaped to have a pulse width shorter than 100 ns.

Abstract: Provided is a multi-beam laser drilling apparatus for drilling a workpiece, simultaneously at two positions while telecentric errors are suppressed, in which a conventional optical system in which galvanometer mirrors are used for a first laser beam, and a galvanometer-mirror system is located close to an f? lens in order to prevent occurrence of telecentric error. A second laser beam which has been deflected by a second galvanometer-mirror system, transmits through a polarized beam mixers and is incident upon the first galvanometer-mirror system and the f? lens, and accordingly, the workpiece is drilled simultaneously at two positions with the use of both first and second laser beams.

Abstract: A system for processing supercritical and subcritical fluid capable of bringing the inside of at least one processing container (1) formed in a flow passage into a supercritical or subcritical high pressure field, wherein thermal operation is applied to process fluid to apply thermal expansion to the fluid to produce a pressure difference between the processing container (1) and the outside, whereby a specified temperature and the high pressure field suitable for the processing of the supercritical or subcritical fluid can be provided in the processing container (1).

Abstract: The method for preparation quinacridone pigment nanocrystals with sub micrometer to nanometer in average size comprising, supplying supercritical or semi-critical liquid, which dissolves quinacridone pigment, into a specimen tube (ST) composing a reactor possessing a filter of desired opening to the upper stream side and to the down stream side in which quinacridone pigment is set up, flowing out the supercritical or semi-critical liquid in which quinacridone pigment is dissolved from said reactor to a mixing apparatus to which coolant is supplied, and by selecting the kind of supercritical of semi-critical liquid and combination of conditions e.g. supplying speed of each liquids, temperature of the liquid and the reacting pressure.

Abstract: There is provided a laser drilling method that prevents hanging, expansion, or crinkles of copper foil caused when an ultraviolet laser beam that requires no surface roughening is used for a thin double-sided copper-clad film. The drilling method of the copper-clad film comprises the steps of: using an ultraviolet laser as a laser beam; drilling after bonding a resin film to the backside of the film which is the opposite side to the laser-beam-incidence; and delaminating the resin film on the backside after drilling. The resin film bonded to the backside prevents the copper foil from hanging, thus allowing the laser beam to be efficiently applied to the copper foil, and allowing the copper foil to be completely removed by ablation. In the case of a blind hole, the resin film bonded to the backside prevents expansion of the copper foil. Crinkles can be also prevented.

Abstract: There is provided a laser drilling method including the step of successively drilling toward an inner part of a machining area while circumferentially moving beam positions from the outer periphery of the machining area. This causes thermal deformation to be symmetric with respect to the center of the machining area, and tension to be applied to the inner part, thereby preventing bending to increase the hole positioning accuracy.

Abstract: Provided is a multi-beam laser drilling apparatus for drilling a workpiece, simultaneously at two positions while telecentric errors are suppressed, in which a conventional optical system in which galvanometer mirrors are used for a first laser beam, and a galvanometer-mirror system is located close to an f&thgr; lens in order to prevent occurrence of telecentric error. A second laser beam which has been deflected by a second galvanometer-mirror system, transmits through a polarized beam mixers and is incident upon the first galvanometer-mirror system and the f&thgr; lens, and accordingly, the workpiece is drilled simultaneously at two positions with the use of both first and second laser beams.

Abstract: The method for preparation quinacridone pigment nanocrystals with sub micrometer to nanometer in average size comprising, supplying supercritical or semi-critical liquid, which dissolves quinacridone pigment, into a specimen tube (ST) composing a reactor possessing a filter of desired opening to the upper stream side and to the down stream side in which quinacridone pigment is set up, flowing out the supercritical or semi-critical liquid in which quinacridone pigment is dissolved from said reactor to a mixing apparatus to which coolant is supplied, and by selecting the kind of supercritical or semi-critical liquid and combination of conditions e.g. supplying speed of each liquids, temperature of the liquid and the reacting pressure.

Abstract: A method for use in two-components electrostatic image developers is disclosed, in which secure separation of a carrier coating resinous materials from a core magnetic material is achieved without affecting the properties of the core materials through process steps benign to the environment in super- or sub-critical water compositions under the conditions of a temperature of 300° C. or more and a pressure of 20 MPa. The core magnetic material is subsequently recycled for forming carrier. This method may also be useful for processing waste including magnetic materials with silicone resin coating.

Abstract: An improved method and apparatus for drilling blind via holes to connect between upper conductive layers and lower conductive layers of printed wiring boards with laser lights. The resin layer contacting the targeted conductive layer is drilled to remain the residual layer with laser lights, and the residual layer is removed with a UV laser beam whose energy density is lower than the decomposition energy threshold of the conductive layer and higher than that of the resin layer. The apparatus for this drilling has at least two laser paths. The spatial energy distributions are made top-hat-shaped with beam homogenizer units in the paths, and the diameters and the energy densities are adjusted independently.

Abstract: Beam distributing/shaping units 21a and 21b the number of which is the same as the number of heads 7a and 7b are disposed in series with each other on an optical path of a laser beam 2 radiated from a laser oscillator 1. Then, the beam distributing/shaping units 21a and 21b are operated so that a laser pulse is supplied to one of the heads which has been positioned. By selecting the timing for operating the beam distributing/shaping units 21a and 21b, the laser beam 2 having energy the magnitude of which is substantially fixed is supplied to a portion to be machined. Thus, the laser oscillator is used effectively, and the machining energy is controlled accurately so that a high-quality hole can be machined.

Abstract: A method for forming II-type cellulose, which comprises introducing together a slurry having water and a I-type cellulose dispersed therein and water in the state of high temperature and high pressure to a tubular reactor (28) contacting the I-type cellulose with a hot water in a supercritical state or subcritical state for a predetermined time in the tubular reactor (28), to thereby cleave a part of the hydrogen bonds in the I-type cellulose and dissolve the I-type cellulose into the water in a supercritical state or subcritical state, cooling a cellulose solution discharged from the tubular reactor (28) in a cooler (30) to room temperature or lower, followed by allowing to stand, to thereby precipitate crystals of II-type cellulose having a molecular weight lower than that of the I-type cellulose, and separating the resultant II-type cellulose from a solvent. The method allows the preparation of pure II-type cellulose by the use of a simple process.