Abstract: The disclosure is related to a battery formation system and probe supporting structure thereof. The battery formation system includes a base, a holder, a probe supporting structure and at least one probe. The base is adaptive to bear at least one battery, and the holder is located on one side of the base. The probe supporting structure is disposed on the holder. The probe supporting structure has an air flow passage and at least one air discharge channel connected to each other, and an extension direction of the air flow passage intersects an extension direction of the at least one air discharge channel. The at least one probe is disposed on the probe supporting structure, and a probing end of the at least one probe and an air outlet of the at least one air discharge channel are located at a same side of the probe supporting structure.

Abstract: A method includes depositing a first dielectric layer over a substrate; forming a first dummy metal layer over the first dielectric layer, wherein the first dummy metal layer has first and second portions laterally separated from each other; depositing a second dielectric layer over the first dummy metal layer; etching an opening having an upper portion in the second dielectric layer, a middle portion between the first and second portions of the first dummy metal layer, and a lower portion in the first dielectric layer, wherein a width of the lower portion of the opening is greater than a width of the middle portion of the opening, and a bottom of the opening is higher than a bottom of the first dielectric layer; and forming a dummy via in the opening and a second dummy metal layer over the dummy via and the second dielectric layer.

Abstract: A battery cell tray includes a bottom plate, a top plate opposite the bottom plate, at least one partition plate between the bottom plate and the top plate, a pressing plate between the partition plate and the bottom plate, and a transmission device between the pressing plate and the bottom plate and on the bottom plate. The transmission device includes moving members, a spiral rod, and supporting arms. The moving members respectively have a first threaded hole and a second threaded hole. The spiral rod has a first screw thread and a second screw thread that are arranged in reverse rotation directions and respectively engaged with the first threaded hole and the second threaded hole. Two top ends of the supporting arms are pivoted to the pressing plate, and two bottom ends of the supporting arms are respectively pivoted to the moving members.

Abstract: A semiconductor device and a method of manufacture thereof are provided. The method for manufacturing the semiconductor device includes forming a first dielectric layer on a substrate. Next, forming a first dummy metal layer on the first dielectric layer. Then, forming a second dielectric layer over the first dummy metal layer. Furthermore, forming an opening in the second dielectric layer and the first dummy metal layer. Then, forming a dummy via in the opening, wherein the dummy via extending through the second dielectric layer and at least partially through the first dummy metal layer. Finally, forming a second dummy metal layer on the second dielectric layer and contact the dummy via.

Abstract: The inkjet position adjustment method includes the following steps. A three-dimensional digital model is obtained, and a slicing processing is performed on the three-dimensional digital model to generate a layer object having a cross-sectional contour. A normal direction of an object surface corresponding to the layer object is obtained from the three-dimensional digital model. When the normal direction points to a negative direction of a first axis, a surface tilt degree of the object surface corresponding to the layer object is obtained, and an inner-shift amount of an inkjet position of the layer object is calculated according to the surface tilt degree. An inkjet region of the layer object is obtained according to the inner-shift amount and the cross-sectional contour. After controlling a print module to print the layer object, an inkjet module is controlled to inject ink on the layer object according to the inkjet region.

Abstract: An electrical probe includes a probe assembly and a second electrical connection member. The probe assembly includes a needle cylinder, a first electrical connection member, a probe head and a sub-probe. The first electrical connection member and the probe head locate to two opposite sides of the needle cylinder. The first electrical connection member and the probe head electrically connect the needle cylinder. The sub-probe penetrates the probe head, and plugs the needle cylinder to electrically connect a cable but being electrically isolated from the needle cylinder. The sub-probe is located on a side away from the first electrical connection member. When the probe head depresses the object, the needle cylinder drives the first cylinder to a contact position to allow the first electrical connection member to electrically contact the second electrical connection member, and thus the probe head connects the second electrical connection member via the needle cylinder.

Abstract: A semiconductor device includes a plurality of lower conductive lines overlying a substrate and extending in a first direction, an insulating layer overlying the plurality of lower conductive lines, a plurality of upper conductive lines overlying the insulating layer and the first conductive lines and extending in a second direction crossing the first direction, and a plurality of vias filled with a conductive material formed in the insulating layer. The plurality of upper conductive lines are arranged in the first direction with a first pitch. The plurality of vias includes first vias and second vias. At least one via of the first vias connects at least two lines of the plurality of lower conductive lines and one line of the plurality of upper conductive lines. An average width in the first direction of the first vias is different from an average width in the first direction of the second vias.

Abstract: A three-dimension (3-D) printing method and a 3-D printing system are provided. The method includes: generating printing information according to model information of a 3-D object; controlling a 3-D printing apparatus to perform a 3-D printing operation, so as to print a supporting object and the 3-D object, wherein the supporting object is used to support the 3-D object. Furthermore, the step of generating the printing information includes: detecting a floating contour of the 3-D object on the first printing layer according to the model information; and removing printing information of the supporting object from printing information corresponding to a second printing layer according to the floating contour. Thereby, difficulty of removing the supporting object can be reduced.

Abstract: A probe supporting structure, configured to support probe for testing battery cell, includes a base and at least two supporting members. The supporting members are detachably disposed on the base with an adjustable distance between the supporting members. The supporting members are arranged in parallel manner.

Abstract: A semiconductor device includes a plurality of lower conductive lines overlying a substrate and extending in a first direction, an insulating layer overlying the plurality of lower conductive lines, a plurality of upper conductive lines overlying the insulating layer and the first conductive lines and extending in a second direction crossing the first direction, and a plurality of vias filled with a conductive material formed in the insulating layer. The plurality of upper conductive lines are arranged in the first direction with a first pitch. The plurality of vias includes first vias and second vias. At least one via of the first vias connects at least two lines of the plurality of lower conductive lines and one line of the plurality of upper conductive lines. An average width in the first direction of the first vias is different from an average width in the first direction of the second vias.

Abstract: An inkjet width adjustment method adapting to three-dimensional printing equipment is provided. The method in one of exemplary embodiments is provided hereafter. A three-dimensional digital model is obtained, and a slicing procedure is performed on the three-dimensional digital model to produce a layer object, wherein the layer object has a cross-sectional contour. A surface tilt degree corresponding to the cross-sectional contour is obtained from the three-dimensional digital model, and an ideal inkjet width of the layer object is calculated according to the surface tilt degree corresponding to the cross-sectional contour. After a print module is controlled to print the layer object, an inkjet module is controlled to spray ink along the cross-sectional contour of the layer object according to the ideal inkjet width. In addition, the three-dimensional printing equipment is also provided.

Abstract: A method of inwardly decreasing a coloring contour of a color 3D object includes: performing an object-slicing on a 3D object to generate records of object print-route information of printing layers; performing an image-slicing on the 3D object to generate records of color-printing information of the printing layers, wherein each color-printing information respectively involves an original coloring contour (3) of each printing layer; performing an inward decrease on the records of color-printing information to generate records of updated color-printing information, wherein each updated color-printing information involves an inwardly decreased coloring contour (4) of each printing layer, and the inwardly decreased coloring contour (4) is spaced from the original coloring contour (3) by an inwardly decreased distance (D); and causing a storage to store the records of object print-route information as route files, and storing the records of updated color-printing information as image files.

Abstract: An inkjet position adjustment method and a three-dimensional printing equipment are provided. The inkjet position adjustment method includes the following steps. A three-dimensional digital model is obtained, and a slicing processing is performed on the three-dimensional digital model to generate a layer object having a cross-sectional contour. A normal direction of an object surface corresponding to the layer object is obtained from the three-dimensional digital model. When the normal direction points to a negative direction of a first axis, a surface tilt degree of the object surface corresponding to the layer object is obtained, and an inner-shift amount of an inkjet position of the layer object is calculated according to the surface tilt degree. An inkjet region of the layer object is obtained according to the inner-shift amount and the cross-sectional contour.

Abstract: An inkjet width adjustment method adapting to three-dimensional printing equipment is provided. The method in one of exemplary embodiments is provided hereafter. A three-dimensional digital model is obtained, and a slicing procedure is performed on the three-dimensional digital model to produce a layer object, wherein the layer object has a cross-sectional contour. A surface tilt degree corresponding to the cross-sectional contour is obtained from the three-dimensional digital model, and an ideal inkjet width of the layer object is calculated according to the surface tilt degree corresponding to the cross-sectional contour. After a print module is controlled to print the layer object, an inkjet module is controlled to spray ink along the cross-sectional contour of the layer object according to the ideal inkjet width. In addition, the three-dimensional printing equipment is also provided.

Abstract: The present invention is related to a clipped testing device, comprising a first clamping member, a second clamping member, a shaft, and a conducting member. The first clamping member has a first pin joint member and a first substrate, the second clamping member has a second pin joint member and a second substrate. The shaft detachably pivoted to a first pin joint member and a second pin joint member. The conducting member is disposed on the first clamping member and is located between the first substrate and the second substrate. The conducting member has an upper surface and a lower surface. The lower surface of the conducting member faces toward the first substrate, and at least a part of the conducting member is wavy-shaped and has a first scraping structure on the upper surface thereof.

Abstract: A method for three dimensional (3D) printing and a 3D printing device are provided. The 3D printing device includes a modeling printing head, a coloring printing head, and a platform. The modeling printing head and the coloring printing head are co-constructed. The three dimensional printing method includes: printing a forming layer and at least one material barrier outside a bounding area of the forming layer; calculating multiple coloring routes of the coloring printing head according to an edge of the forming layer; converting the coloring routes of the coloring printing head into multiple color-passing routes of the modeling printing head; calculating multiple detour routes of the modeling printing head according to the color-passing routes of the modeling printing head.

Abstract: A light-emitting module structure includes a substrate, a plurality of light-emitting diodes (LEDs) disposed on the substrate, and a light-guiding layer covering the light-emitting diodes. The light-guiding layer has an upper surface, the upper surface has a plurality of recesses, and the recesses are above the light-emitting diodes or between the light-emitting diodes. This light-emitting module structure can improve the brightness and uniformity of the light-emitting module.

Abstract: A battery cell tray includes a bottom plate, a top plate opposite the bottom plate, at least one partition plate between the bottom plate and the top plate, a pressing plate between the partition plate and the bottom plate, and a transmission device between the pressing plate and the bottom plate and on the bottom plate. The transmission device includes moving members, a spiral rod, and supporting arms. The moving members respectively have a first threaded hole and a second threaded hole. The spiral rod has a first screw thread and a second screw thread that are arranged in reverse rotation directions and respectively engaged with the first threaded hole and the second threaded hole. Two top ends of the supporting arms are pivoted to the pressing plate, and two bottom ends of the supporting arms are respectively pivoted to the moving members.

Abstract: An electronic device package includes a carrying board, an electronic device, a first insulating layer, and a barrier layer. The carrying board includes a central area, an inner edge area, and an outer edge area. The inner edge area is located between the central area and the outer edge area. The electronic device is located in the central area. The first insulating layer is located on the carrying board and overlapped with the electronic device and extends from the central area to the inner edge area. The barrier layer is located on the carrying board. Here, the barrier layer includes a sidewall contact portion and an extending portion. The sidewall contact portion surrounds a side surface of the first insulating layer, and the extending portion extends from the sidewall contact portion to the outer edge area in a direction away from the first insulating layer.

Abstract: The invention provides a sliced image processing method including following steps: analyzing a sliced object in a sliced image to determine whether the sliced object has a first contour line segment and a nearest second contour line segment, where the second contour line segment is located within a region encircled by the first contour line segment; determining whether vector directions of the first contour line segment and the second contour line segment are opposite when the sliced object has the first contour line segment and the second contour line segment, and correcting the vector direction of at least one of the first contour line segment and the second contour line segment when the vector directions of the first contour line segment and the second contour line segment are not opposite.