Patents by Inventor Kuo-cheng Lin

Kuo-cheng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210226036
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes an isolation structure formed over a substrate, and a first stacked nanostructure and a second stacked nanostructure extending above the isolation structure. The semiconductor device structure includes an inner spacer layer surrounding the first stacked nanostructure, and a dummy fin structure formed over the isolation structure. The dummy fin structure is between the first stacked nanostructure and the second stacked nanostructure, and a capping layer formed over the dummy fin structure. The inner spacer layer is in direct contact with the dummy fin structure and the capping layer.
    Type: Application
    Filed: April 1, 2021
    Publication date: July 22, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuo-Cheng CHING, Zhi-Chang LIN, Kuan-Ting PAN, Chih-Hao WANG, Shi-Ning JU
  • Publication number: 20210226020
    Abstract: A semiconductor structure is provided. The semiconductor structure includes nanostructures over a substrate, a gate stack around the nanostructures, a gate spacer layer alongside the gate stack, an inner spacer layer between the gate spacer layer and the nanostructures, a source/drain feature adjoining the nanostructures, a contact plug over the source/drain feature, and a silicon germanium layer along the surface of the source/drain feature and between the contact plug and the inner spacer layer.
    Type: Application
    Filed: January 16, 2020
    Publication date: July 22, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Zhi-Chang LIN, Shih-Cheng CHEN, Kuo-Cheng CHIANG, Pei-Hsun WANG, Chih-Hao WANG
  • Patent number: 9449931
    Abstract: Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using plating of a conductive material over terminals of an integrated circuit. A base portion of the pillar bump has a greater width than an upper portion. A cross-section of the base portion of the pillar bump may make a trapezoidal, rectangular, or sloping shape. Solder material may be formed on the top surface of the pillar. The resulting solder pillar bumps form fine pitch package solder connections that are more reliable than those of the prior art.
    Type: Grant
    Filed: August 25, 2014
    Date of Patent: September 20, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Chung Lin, Chung-Shi Liu, Meng-Wei Chou, Kuo Cheng Lin, Wen-Hsiung Lu, Chien Ling Hwang, Ying-Jui Huang, De-Yuan Lu
  • Patent number: 9103348
    Abstract: A DC motor device includes a first converting circuit, a second converting circuit, and a DC motor. A switch element is coupled to the DC motor device, and provides an alternating current to the first or second converting circuit. The first converting circuit receives the alternating current, and generates a first rotation speed signal. The second converting circuit receives the alternating current, and generates a second rotation speed signal. The DC motor is driven at a rotation speed according to the first or second rotation speed signal.
    Type: Grant
    Filed: July 17, 2013
    Date of Patent: August 11, 2015
    Assignee: Delta Electronics, Inc.
    Inventors: Hsin-Chih Lin, Ya-Sen Tu, Lee-Long Chen, Kuo-Cheng Lin
  • Publication number: 20140363966
    Abstract: Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using plating of a conductive material over terminals of an integrated circuit. A base portion of the pillar bump has a greater width than an upper portion. A cross-section of the base portion of the pillar bump may make a trapezoidal, rectangular, or sloping shape. Solder material may be formed on the top surface of the pillar. The resulting solder pillar bumps form fine pitch package solder connections that are more reliable than those of the prior art.
    Type: Application
    Filed: August 25, 2014
    Publication date: December 11, 2014
    Inventors: Cheng-Chung Lin, Chung-Shi Liu, Meng-Wei Chou, Kuo Cheng Lin, Wen-Hsiung Lu, Chien Ling Hwang, Ying-Jui Huang, De-Yuan Lu
  • Patent number: 8823166
    Abstract: Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using plating of a conductive material over terminals of an integrated circuit. A base portion of the pillar bump has a greater width than an upper portion. A cross-section of the base portion of the pillar bump may make a trapezoidal, rectangular or sloping shape. Solder material may be formed on the top surface of the pillar. The resulting solder pillar bumps form fine pitch package solder connections that are more reliable than those of the prior art.
    Type: Grant
    Filed: August 30, 2010
    Date of Patent: September 2, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Chung Lin, Chung-Shi Liu, Meng-Wei Chou, Kuo Cheng Lin, Wen-Hsiung Lu, Chien Ling Hwang, Ying-Jui Huang, De-Yuan Lu
  • Publication number: 20140227105
    Abstract: A DC motor device includes a first converting circuit, a second converting circuit, and a DC motor. A switch element is coupled to the DC motor device, and provides an alternating current to the first or second converting circuit. The first converting circuit receives the alternating current, and generates a first rotation speed signal. The second converting circuit receives the alternating current, and generates a second rotation speed signal. The DC motor is driven at a rotation speed according to the first or second rotation speed signal.
    Type: Application
    Filed: July 17, 2013
    Publication date: August 14, 2014
    Inventors: Hsin-Chih LIN, Ya-Sen TU, Lee-Long CHEN, Kuo-Cheng LIN
  • Patent number: 8609526
    Abstract: A method of forming an integrated circuit structure includes forming a copper-containing seed layer on a wafer, and performing a descum step on an exposed surface of the copper-containing seed layer. The descum step is performed using a process gas including fluorine and oxygen. A reduction/purge step is then performed on the exposed surface of the copper-containing seed layer using a nitrogen-containing gas. A copper-containing layer is plated on the copper-containing seed layer.
    Type: Grant
    Filed: July 23, 2010
    Date of Patent: December 17, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Shi Liu, Cheng-Chung Lin, Ming-Che Ho, Kuo Cheng Lin, Meng-Wei Chou
  • Patent number: 8324766
    Abstract: A heat-dissipation structure for a motor. The heat-dissipation structure comprises a shaft, a seat and a rotator. The rotator coupled to the seat by the shaft comprises a housing and a cover. The housing comprises an inner side connected to the shaft and a bottom comprising at least one through hole. The cover is connected to an exterior of the bottom of the housing and a distance is formed between the cover and the housing, so that the cover prevents objects from entering the through hole.
    Type: Grant
    Filed: March 22, 2010
    Date of Patent: December 4, 2012
    Assignee: Delta Electronics, Inc.
    Inventors: Hung-Chi Chen, Ying-Chi Chen, Te-Tsai Chuang, Kuo-Cheng Lin, Wen-Shi Huang
  • Publication number: 20120049346
    Abstract: Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using plating of a conductive material over terminals of an integrated circuit. A base portion of the pillar bump has a greater width than an upper portion. A cross-section of the base portion of the pillar bump may make a trapezoidal, rectangular or sloping shape. Solder material may be formed on the top surface of the pillar. The resulting solder pillar bumps form fine pitch package solder connections that are more reliable than those of the prior art.
    Type: Application
    Filed: August 30, 2010
    Publication date: March 1, 2012
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Chung Lin, Chung-Shi Liu, Meng-Wei Chou, Kuo Cheng Lin, Wen-Hsiung Lu, Chien Ling Hwang, Ying-Jui Huang, De-Yuan Lu
  • Publication number: 20110092064
    Abstract: A method of forming an integrated circuit structure includes forming a copper-containing seed layer on a wafer, and performing a descum step on an exposed surface of the copper-containing seed layer. The descum step is performed using a process gas including fluorine and oxygen. A reduction/purge step is then performed on the exposed surface of the copper-containing seed layer using a nitrogen-containing gas. A copper-containing layer is plated on the copper-containing seed layer.
    Type: Application
    Filed: July 23, 2010
    Publication date: April 21, 2011
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Shi Liu, Cheng-Chung Lin, Ming-Che Ho, Kuo Cheng Lin, Meng-Wei Chou
  • Publication number: 20100322764
    Abstract: A cooling fan with high heat-dissipating performance includes a plurality of blades; and a frame for receiving the blades therein, wherein the frame has a reduced height for exposing the blades to outside of the frame so as to allow air to enter into the frame via a top portion and a peripheral portion of the blades to improve air introduction and heat dissipating efficiency of the cooling fan. A cover may be mounted to a top surface of the frame, and formed with a plurality of openings for allowing air to enter into the frame through the openings; such an arrangement cam effectively enhance air intake and working efficiency of the cooling fan.
    Type: Application
    Filed: August 27, 2010
    Publication date: December 23, 2010
    Inventors: Wen-Shi HUANG, Kuo-Cheng LIN, Li-Kuang TAN, Tsung-Yu LEI, Wen-Ha LIU
  • Patent number: 7802965
    Abstract: A cooling fan with high heat-dissipating performance includes a plurality of blades; and a frame for receiving the blades therein, wherein the frame has a reduced height for exposing the blades to outside of the frame so as to allow air to enter into the frame via a top portion and a peripheral portion of the blades to improve air introduction and heat dissipating efficiency of the cooling fan. A cover may be mounted to a top surface of the frame, and formed with a plurality of openings for allowing air to enter into the frame through the openings; such an arrangement cam effectively enhance air intake and working efficiency of the cooling fan.
    Type: Grant
    Filed: January 17, 2006
    Date of Patent: September 28, 2010
    Assignee: Delta Electronics Inc.
    Inventors: Wen-Shi Huang, Kuo-Cheng Lin, Li-Kuang Tan, Tsung-Yu Lei, Wen-Ha Liu
  • Publication number: 20100178181
    Abstract: A heat-dissipation structure for a motor. The heat-dissipation structure comprises a shaft, a seat and a rotator. The rotator coupled to the seat by the shaft comprises a housing and a cover. The housing comprises an inner side connected to the shaft and a bottom comprising at least one through hole. The cover is connected to an exterior of the bottom of the housing and a distance is formed between the cover and the housing, so that the cover prevents objects from entering the through hole.
    Type: Application
    Filed: March 22, 2010
    Publication date: July 15, 2010
    Inventors: Hung-Chi Chen, Ying-Chi Chen, Te-Tsai Chuang, Kuo-Cheng Lin, Wen-Shi Huang
  • Patent number: 7740446
    Abstract: A serial fan includes a frame, a plurality of rotor vanes, a support connected to the frame through a plurality of connecting parts. The plurality of rotor vanes are arranged in series in the frame along an axial direction and the plurality of connecting parts are disposed therebetween to minimize space occupied by the serial fan in the axial direction, and effectively increase the blast pressure.
    Type: Grant
    Filed: February 8, 2007
    Date of Patent: June 22, 2010
    Assignee: Delta Electronics, Inc.
    Inventors: Kuo-cheng Lin, Wen-shi Huang, Shun-chen Chang, Pohao Yu
  • Patent number: 7726939
    Abstract: A heat-dissipating fan with an upward air-guiding member is provided. The heat-dissipating fan includes a housing, an impeller having a hub and a plurality of blades disposed around the hub, a base disposed inside the housing for supporting the impeller thereon, and an air-guiding member disposed between the base and the housing, wherein the air-guiding member has at least one inclined edge on the windward side or its opposite side relative to the horizontal line perpendicular to the axis of the heat-dissipating fan.
    Type: Grant
    Filed: July 6, 2007
    Date of Patent: June 1, 2010
    Assignee: Delta Electronics, Inc.
    Inventors: Chin-Hung Lee, Shun-Chen Chang, Kuo-Cheng Lin, Wen-Shi Huang, Hsiou-Chen Chang
  • Patent number: 7586742
    Abstract: A heat dissipation module includes a first heat dissipation apparatus, a second heat dissipation apparatus, at least one first flapper and at least one second flapper. The first heat dissipation apparatus has a first airflow passage, and the second heat dissipation apparatus has a second airflow passage. The first flappers and the second flappers are separately disposed within the first airflow passage and the second airflow passage. The first flappers and the second flappers are moved to an open position due to force generated by air flowing through the first airflow passage and the second airflow passage, and are moved to a closed position after the force is removed.
    Type: Grant
    Filed: November 8, 2005
    Date of Patent: September 8, 2009
    Assignee: Delta Electronics Inc.
    Inventors: Yung-Yu Chiu, Te-Tsai Chuang, Kuo-Cheng Lin, Wen-Shi Huang
  • Publication number: 20090196773
    Abstract: A foreign-body-proof or water-proof fan includes an impeller and a motor. The motor includes a rotor, a stator, a housing, at least one bearing and a spacer. The rotor has a shaft. The stator is disposed corresponding to the rotor. The housing supports for the stator and the rotor and has an axial hole, and the shaft passes through the axial hole. One end of the shaft protrudes out of the housing and is connected to the impeller. The bearing for supporting the shaft is disposed in the axial hole and securely disposed in the axial hole. The spacer loops the shaft and urges against the bearing.
    Type: Application
    Filed: September 12, 2008
    Publication date: August 6, 2009
    Applicant: DELTA ELECTRONICS, INC
    Inventors: Chen-Mo JIANG, Hung-Chi CHEN, Te-Tsai CHUANG, Kuo-Cheng LIN
  • Patent number: 7538465
    Abstract: A fan housing. The fan housing mounted on a frame of a system includes a main body, a first section, a second section and a fixing portion. Both the first and second sections are disposed on the main body. A gap is formed between the first and second sections. The fixing portion is formed in the gap.
    Type: Grant
    Filed: February 18, 2004
    Date of Patent: May 26, 2009
    Assignee: Delta Electronics, Inc.
    Inventors: Yi-Fang Chou, Tsu-Liang Lin, Kuo-Cheng Lin, Wen-Shi Huang
  • Patent number: 7462014
    Abstract: An axial flow fan with a plurality of segment blades is described. The axial flow fan has a base, a hub and a plurality of blade units. The hub is mounted on, or pivots on, the base and supports the blade units. Each of the blade units is connected to a periphery of the hub and extends radially outward from the base has a plurality of segment blades. A segment space between the segment blades reforms a boundary layer of fluid passing over the segment blades and reduces the thickness of the boundary layer on the blade surfaces. As a result, the separation between the blade surfaces and fluid is avoided to maintain a laminar flow of the fluid adjacent to the segment blades.
    Type: Grant
    Filed: December 1, 2004
    Date of Patent: December 9, 2008
    Assignee: Delta Eletronics, Inc.
    Inventors: Shun-Chen Chang, Kuo-Cheng Lin, Wen-Shi Huang