Abstract: Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using plating of a conductive material over terminals of an integrated circuit. A base portion of the pillar bump has a greater width than an upper portion. A cross-section of the base portion of the pillar bump may make a trapezoidal, rectangular, or sloping shape. Solder material may be formed on the top surface of the pillar. The resulting solder pillar bumps form fine pitch package solder connections that are more reliable than those of the prior art.

Abstract: Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using plating of a conductive material over terminals of an integrated circuit. A base portion of the pillar bump has a greater width than an upper portion. A cross-section of the base portion of the pillar bump may make a trapezoidal, rectangular or sloping shape. Solder material may be formed on the top surface of the pillar. The resulting solder pillar bumps form fine pitch package solder connections that are more reliable than those of the prior art.

Abstract: A DC motor device includes a first converting circuit, a second converting circuit, and a DC motor. A switch element is coupled to the DC motor device, and provides an alternating current to the first or second converting circuit. The first converting circuit receives the alternating current, and generates a first rotation speed signal. The second converting circuit receives the alternating current, and generates a second rotation speed signal. The DC motor is driven at a rotation speed according to the first or second rotation speed signal.

Abstract: A method of forming an integrated circuit structure includes forming a copper-containing seed layer on a wafer, and performing a descum step on an exposed surface of the copper-containing seed layer. The descum step is performed using a process gas including fluorine and oxygen. A reduction/purge step is then performed on the exposed surface of the copper-containing seed layer using a nitrogen-containing gas. A copper-containing layer is plated on the copper-containing seed layer.

Abstract: A heat-dissipation structure for a motor. The heat-dissipation structure comprises a shaft, a seat and a rotator. The rotator coupled to the seat by the shaft comprises a housing and a cover. The housing comprises an inner side connected to the shaft and a bottom comprising at least one through hole. The cover is connected to an exterior of the bottom of the housing and a distance is formed between the cover and the housing, so that the cover prevents objects from entering the through hole.

Abstract: Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using plating of a conductive material over terminals of an integrated circuit. A base portion of the pillar bump has a greater width than an upper portion. A cross-section of the base portion of the pillar bump may make a trapezoidal, rectangular or sloping shape. Solder material may be formed on the top surface of the pillar. The resulting solder pillar bumps form fine pitch package solder connections that are more reliable than those of the prior art.

Abstract: A method of forming an integrated circuit structure includes forming a copper-containing seed layer on a wafer, and performing a descum step on an exposed surface of the copper-containing seed layer. The descum step is performed using a process gas including fluorine and oxygen. A reduction/purge step is then performed on the exposed surface of the copper-containing seed layer using a nitrogen-containing gas. A copper-containing layer is plated on the copper-containing seed layer.

Abstract: A cooling fan with high heat-dissipating performance includes a plurality of blades; and a frame for receiving the blades therein, wherein the frame has a reduced height for exposing the blades to outside of the frame so as to allow air to enter into the frame via a top portion and a peripheral portion of the blades to improve air introduction and heat dissipating efficiency of the cooling fan. A cover may be mounted to a top surface of the frame, and formed with a plurality of openings for allowing air to enter into the frame through the openings; such an arrangement cam effectively enhance air intake and working efficiency of the cooling fan.

Abstract: A cooling fan with high heat-dissipating performance includes a plurality of blades; and a frame for receiving the blades therein, wherein the frame has a reduced height for exposing the blades to outside of the frame so as to allow air to enter into the frame via a top portion and a peripheral portion of the blades to improve air introduction and heat dissipating efficiency of the cooling fan. A cover may be mounted to a top surface of the frame, and formed with a plurality of openings for allowing air to enter into the frame through the openings; such an arrangement cam effectively enhance air intake and working efficiency of the cooling fan.

Abstract: A heat-dissipation structure for a motor. The heat-dissipation structure comprises a shaft, a seat and a rotator. The rotator coupled to the seat by the shaft comprises a housing and a cover. The housing comprises an inner side connected to the shaft and a bottom comprising at least one through hole. The cover is connected to an exterior of the bottom of the housing and a distance is formed between the cover and the housing, so that the cover prevents objects from entering the through hole.

Abstract: A serial fan includes a frame, a plurality of rotor vanes, a support connected to the frame through a plurality of connecting parts. The plurality of rotor vanes are arranged in series in the frame along an axial direction and the plurality of connecting parts are disposed therebetween to minimize space occupied by the serial fan in the axial direction, and effectively increase the blast pressure.

Abstract: A heat-dissipating fan with an upward air-guiding member is provided. The heat-dissipating fan includes a housing, an impeller having a hub and a plurality of blades disposed around the hub, a base disposed inside the housing for supporting the impeller thereon, and an air-guiding member disposed between the base and the housing, wherein the air-guiding member has at least one inclined edge on the windward side or its opposite side relative to the horizontal line perpendicular to the axis of the heat-dissipating fan.

Abstract: A heat dissipation module includes a first heat dissipation apparatus, a second heat dissipation apparatus, at least one first flapper and at least one second flapper. The first heat dissipation apparatus has a first airflow passage, and the second heat dissipation apparatus has a second airflow passage. The first flappers and the second flappers are separately disposed within the first airflow passage and the second airflow passage. The first flappers and the second flappers are moved to an open position due to force generated by air flowing through the first airflow passage and the second airflow passage, and are moved to a closed position after the force is removed.

Abstract: A foreign-body-proof or water-proof fan includes an impeller and a motor. The motor includes a rotor, a stator, a housing, at least one bearing and a spacer. The rotor has a shaft. The stator is disposed corresponding to the rotor. The housing supports for the stator and the rotor and has an axial hole, and the shaft passes through the axial hole. One end of the shaft protrudes out of the housing and is connected to the impeller. The bearing for supporting the shaft is disposed in the axial hole and securely disposed in the axial hole. The spacer loops the shaft and urges against the bearing.

Abstract: A fan housing. The fan housing mounted on a frame of a system includes a main body, a first section, a second section and a fixing portion. Both the first and second sections are disposed on the main body. A gap is formed between the first and second sections. The fixing portion is formed in the gap.

Abstract: An axial flow fan with a plurality of segment blades is described. The axial flow fan has a base, a hub and a plurality of blade units. The hub is mounted on, or pivots on, the base and supports the blade units. Each of the blade units is connected to a periphery of the hub and extends radially outward from the base has a plurality of segment blades. A segment space between the segment blades reforms a boundary layer of fluid passing over the segment blades and reduces the thickness of the boundary layer on the blade surfaces. As a result, the separation between the blade surfaces and fluid is avoided to maintain a laminar flow of the fluid adjacent to the segment blades.

Abstract: A heat dissipation module is disclosed. A first heat dissipation apparatus and a second heat dissipation apparatus are symmetrically disposed. A flow direction controlling structure has a rotatable element disposed between the first and second heat dissipation apparatuses and formed an isolation wall thereof, so that the first and second heat dissipation apparatuses respectively have a tunnel. Each of the rotatable elements has a fixed end and a correspondingly movable end for guiding air flow. When outlet pressures of the first and second heat dissipation apparatuses are different, the movable end deflects to the first heat dissipation apparatus or the second heat dissipation apparatus to change outlet areas thereof. The heat dissipation module and the flow direction controlling structure control air flow and prevent backflow, so as to maintain overall outlet area and improve heat dissipation effect of the module.

Abstract: A fan is disclosed for use in a system, and the system has at least one connection structure. The fan is mainly composed of an impeller and a base, and the impeller is connected to the base. The impeller at least has a hub, a plurality of blades and a driver. The base has at least one engaging member, and the engaging member is corresponding to the connection structure. Further, the fan is fixed on the system by connecting the engaging member and the connection structure together.

Abstract: A heat-dissipating device and its manufacturing process are provided for significantly increasing the number and size of blades so as to enhance the heat-dissipating performance. The heat-dissipating device has a plurality of blades arranged around the hub of the heat-dissipating device and there is an overlapped region formed between every two adjacent blades. A single mold is used to manufacture such a heat-dissipating device so that not only can the manufacturing cost be reduced but it can significantly increase the number and size of blades so as to increase the heat-dissipating efficiency.

Abstract: A centrifugal fan includes a hub and an impeller. The impeller is composed of a plurality of blades mounted around an outer circumference of the hub. The paraxial side of the blade forms a backward leaning structure, while the non-paraxial side thereof forms a forward leaning structure. A chamfer structure also can be formed at a paraxial side of each blade to enlarge the air inlet of the fan. Each blade further includes a protrusion, which is located at a side opposite to the inlet and extends toward a center of the hub, to increase the airflow rate through the fan motor. The centrifugal fan further includes an anti-decompression cap connected to an inlet side of the impeller to prevent an axial flow of the intake air from decompression.