Abstract: A method of process technology assessment is provided. The method includes: defining a scope of the process technology assessment, the scope comprising an original process technology and a first process technology; modeling a first object in an integrated circuit into a resistance domain and a capacitance domain; generating a first resistance scaling factor and a first capacitance scaling factor based on the modeling, the original process technology, and the first process technology; and utilizing, by an electronic design automation (EDA) tool, the first resistance scaling factor and the first capacitance scaling factor for simulation of the integrated circuit.

Abstract: A backlight module includes a back bezel, a light guide plate, a plurality of optical films, and a clamping device. The light guide plate is disposed in an area enclosed by a periphery structure of the back bezel, and the optical films are disposed on the light guide plate. The clamping device includes a supporting element, a clamping piece, and a cushion element. The supporting element protrudes from the back bezel. The clamping piece is disposed on the supporting element and extends from the back bezel to the optical films. The cushion element is disposed between the clamping piece and the optical films.

Abstract: A backlight module includes a back bezel, a light guide plate, a plurality of optical films, and a clamping device. The light guide plate is disposed in an area enclosed by a periphery structure of the back bezel, and the optical films are disposed on the light guide plate. The clamping device includes a supporting element, a clamping piece, and a cushion element. The supporting element protrudes from the back bezel. The clamping piece is disposed on the supporting element and extends from the back bezel to the optical films. The cushion element is disposed between the clamping piece and the optical films.

Abstract: A backlight module includes a back bezel, a light guide plate, a plurality of optical films, and a clamping device. The light guide plate is disposed in an area enclosed by a periphery structure of the back bezel, and the optical films are disposed on the light guide plate. The clamping device includes a supporting element, a clamping piece, and a cushion element. The supporting element protrudes from the back bezel. The clamping piece is disposed on the supporting element and extends from the back bezel to the optical films. The cushion element is disposed between the clamping piece and the optical films.

Abstract: A flat display panel comprises a plurality of driver ICs and one or more flexible printed circuit, a plurality of common wires formed on the substrate to electrically connect the ICs to the one or more flexible printed circuit, and at least one anisotropic conductive film that connects respective connecting terminals of the driver ICs and flexible printed circuit to terminals pads of the common wires. The anisotropic conductive film is laminated over the substrate to cover the terminal pads. The driver ICs and flexible printed circuit are aligned and attached on the anisotropic conductive layer by thermocompression bonding.

Abstract: A display apparatus includes a display panel, a light guide plate, a frame and an optical film disposed between the display panel and the light guide plate. The display panel is defined to have a display area and a non-display area adjacent to the display area. The frame surrounds the light guide plate, the optical film and the display panel. The frame includes a sidewall and a support structure extending from an inner surface of the sidewall to above the light guide plate. The support structure includes a light shielding part, a first support part configured to support the optical film. The light shielding part is connected to the first support part. A light-pervious area is formed between the light shielding part and the optical film. The first support part is under cover of the non-display area.

Abstract: A backlight module includes a back bezel, a light guide plate, a plurality of optical films, and a clamping device. The light guide plate is disposed in an area enclosed by a periphery structure of the back bezel, and the optical films are disposed on the light guide plate. The clamping device includes a supporting element, a clamping piece, and a cushion element. The supporting element protrudes from the back bezel. The clamping piece is disposed on the supporting element and extends from the back bezel to the optical films. The cushion element is disposed between the clamping piece and the optical films.

Abstract: A signal transmission assembly includes first and second substrates respectively having first and second electrodes, and a conductive layer disposed between the electrodes. The second electrode has a trench. The conductive layer includes an adhesive and conductive particles distributed therein. The second electrode is electrically connected to the first electrode through the conductive layer, and a portion of the adhesive is filled into the trench. When the assembly is applied to a display device, the first electrode electrically connects a non-display area to a display area of a display panel. When the second electrode and a third electrode at two ends of the second substrate are electrically connected to the first electrode and a third substrate (e.g., a PCB), respectively, a signal may be transmitted from the third substrate to the display area through the second substrate, the second electrode and the first electrode to control the display.

Abstract: A backlight module comprising a back bezel, at least one light emitting device, a first circuit board, and a second circuit board is provided. The light emitting device, which has an electrode, is disposed on the side of the back bezel, while the first circuit board is disposed on the edge of the back bezel. An elastic clip is used to electrically connect the first circuit board directly with the electrode of the light emitting device, while the second circuit board is electrically connected to the first circuit board.

Abstract: A backlight module and a liquid crystal display (LCD) device incorporating the same are provided. The backlight module includes a frame and at least a light source. The frame has at least a through aperture. The light source having at least a t high voltage electrode terminal is disposed above the frame. The high voltage electrode terminal is positioned above the through aperture.

Abstract: The present invention relates to a liquid crystal display panel having a cell test structure and a method for making the same. The liquid crystal display panel includes a substrate having a plurality of first driving IC mounting areas, a plurality of first conductive wires located on the substrate, a plurality of second conductive wires that are parallel and interlaced with the first conductive wires, a first shorting bar connected to the first conductive wires and passing through all of the first driving IC mounting areas, and a second shorting bar connected to the second conductive wires and passing through all of the first driving IC mounting areas.

Abstract: An external-electrode fluorescent lamp has two external electrodes disposed on its ends, wherein each external electrode has an extended portion flattened to form two substantially flat circumferential areas. With such flattened circumferential areas, the electric contact made to the conductive strip can be improved. For mounting a row of external-electrode fluorescent lamps, a mounting base with two electrically conductive strips are used. Each electrically conductive strip has a plurality of curved sections to fit the extended portion of the external electrode. The curved section has two substantially sidewalls to make contact with the flat circumferential areas of the extended portion of the external electrode. The extended portion can also be slightly tapered.

Abstract: A card having radio frequency identification (RFID) tag receives a first electrical signal having a first message sent by a RFID reader and returns a second electrical signal having a second message to the RFID reader in response to the first electrical signal. The card having RFID tag includes a coil, a microprocessor chip, a switch, and a display. The microprocessor chip is disposed in the card and electrically connected to the coil. The switch is disposed between the coil and the microprocessor chip. The display is controlled by the microprocessor chip to display the first message or the second message. The switch is used to control whether to start the RFID tag or not, and then the display displays the transmitted or received message, so as to protect data from being stolen and efficiently control the transmitted and received messages.

Abstract: A flat display panel comprises a plurality of driver ICs and one or more flexible printed circuit, a plurality of common wires formed on the substrate to electrically connect the ICs to the one or more flexible printed circuit, and at least one anisotropic conductive film that connects respective connecting terminals of the driver ICs and flexible printed circuit to terminals pads of the common wires. The anisotropic conductive film is laminated over the substrate to cover the terminal pads. The driver ICs and flexible printed circuit are aligned and attached on the anisotropic conductive layer by thermocompression bonding.

Abstract: A flat display panel comprises a plurality of driver ICs and one or more flexible printed circuit, a plurality of common wires formed on the substrate to electrically connect the ICs to the one or more flexible printed circuit, and at least one anisotropic conductive film that connects respective connecting terminals of the driver ICs and flexible printed circuit to terminals pads of the common wires. The anisotropic conductive film is laminated over the substrate to cover the terminal pads. The driver ICs and flexible printed circuit are aligned and attached on the anisotropic conductive layer by thermocompression bonding.

Abstract: A backlight module comprising a back bezel, at least one light emitting device, a first circuit board, and a second circuit board is provided. The light emitting device, which has an electrode, is disposed on the side of the back bezel, while the first circuit board is disposed on the edge of the back bezel. An elastic clip is used to electrically connect the first circuit board directly with the electrode of the light emitting device, while the second circuit board is electrically connected to the first circuit board.

Abstract: The present invention relates to a liquid crystal display panel having a cell test structure and a method for making the same. The liquid crystal display panel includes a substrate having a plurality of first driving IC mounting areas, a plurality of first conductive wires located on the substrate, a plurality of second conductive wires that are parallel and interlaced with the first conductive wires, a first shorting bar connected to the first conductive wires and passing through all of the first driving IC mounting areas, and a second shorting bar connected to the second conductive wires and passing through all of the first driving IC mounting areas.

Abstract: The present invention relates to a liquid crystal display panel having a cell test structure and a method for making the same. The liquid crystal display panel includes a substrate having a plurality of first driving IC mounting areas, a plurality of first conductive wires located on the substrate, a plurality of second conductive wires that are parallel and interlaced with the first conductive wires, a first shorting bar connected to the first conductive wires and passing through all of the first driving IC mounting areas, and a second shorting bar connected to the second conductive wires and passing through all of the first driving IC mounting areas.

Abstract: A signal transmission assembly includes first and second substrates respectively having first and second electrodes, and a conductive layer disposed between the electrodes. The second electrode has a trench. The conductive layer includes an adhesive and conductive particles distributed therein. The second electrode is electrically connected to the first electrode through the conductive layer, and a portion of the adhesive is filled into the trench. When the assembly is applied to a display device, the first electrode electrically connects a non-display area to a display area of a display panel. When the second electrode and a third electrode at two ends of the second substrate are electrically connected to the first electrode and a third substrate (e.g., a PCB), respectively, a signal may be transmitted from the third substrate to the display area through the second substrate, the second electrode and the first electrode to control the display.

Abstract: A communication device outside-connected incoming call indicator and an earphone device having such an incoming call indicator are provided. The incoming call indicator has a first communication port connected to a communication device, which is used to receive the incoming call; and an incoming call indication module used to detect the incoming signal and send out an incoming call indication. The earphone device with the incoming call indicator has a connector, which is used to connect to a communication device provided with an insertion hole, and receive the incoming call signal transmitted from the communication device; an incoming call indicator, which is used to receive the incoming call signal and send out an incoming call indication; and an earphone, which is used to receive and broadcast the voice signals transmitted from the communication device. A signal wire is used to connect the connector, the incoming call indicator, and the earphone.