Patents by Inventor Kuo Chin Huang

Kuo Chin Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100081220
    Abstract: The present invention relates to a light-emitting diode (LED) and a method for manufacturing the same. The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively.
    Type: Application
    Filed: September 2, 2009
    Publication date: April 1, 2010
    Inventors: Wei-Kang Cheng, Jia-Lin Li, Shyi-Ming Pan, Kuo-Chin Huang
  • Publication number: 20100078667
    Abstract: The present invention relates to a light-emitting diode (LED).The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively.
    Type: Application
    Filed: August 26, 2009
    Publication date: April 1, 2010
    Inventors: Wei-Kang Cheng, Jia-Lin Li, Shyi-Ming Pan, Kuo-Chin Huang
  • Publication number: 20100078671
    Abstract: A nitride based semiconductor light emitting device is revealed. The light emitting device includes a light emitting epitaxial layer, a P-type electrode and a N-type electrode. The P-type electrode and the N-type electrode are disposed on the light emitting epitaxial layer. The light emitting device features on that the N-type electrode is arranged on the inner side of the P-type electrode. The P-type electrode extends toward the N-type electrode along the edge of the light emitting epitaxial layer and the N-type electrode extends inward along the inner side of the P-type electrode. By means of the electrode pattern with special design, the light emitting area of the light emitting device is increased.
    Type: Application
    Filed: January 16, 2009
    Publication date: April 1, 2010
    Inventors: Kuo-Chin HUANG, Shyi-Ming Pan, Hung-Li Pan, Cheng-Kuo Huang, Wei-Kang Cheng, Yi-Sheng Ting
  • Publication number: 20100052494
    Abstract: An alternating current (AC) light emitting device is revealed. The AC light emitting device includes a substrate and a plurality of light emitting units arranged on the substrate. The light emitting unit consists of a first semiconductor layer, a light emitting layer, a second semiconductor layer, at least one electrode and at least one second electrode respectively arranged on the first semiconductor layer and the second semiconductor layer from bottom to top. The plurality of light emitting units is coupled to at least one adjacent light emitting unit by a plurality of conductors. By the plurality of conductors that connect light emitting units with at least one adjacent light emitting unit, an open circuit will not occur in the AC light emitting device once one of the conductors is broken.
    Type: Application
    Filed: December 8, 2008
    Publication date: March 4, 2010
    Inventors: Hui Ching FENG, Kuo-Chin Huang, Shyi-Ming Pan, Hung-Li Pan
  • Publication number: 20100032690
    Abstract: The present invention is related to a light emitting device with an insulating layer, which comprises a transparent substrate, a first light emitting unit, a second light emitting unit, an insulating layer and a conducting layer. The first light emitting unit and the second light emitting unit are set up on the transparent substrate, wherein the second light emitting unit has an appearance of a stair structure. The insulating layer is set between the first and the second light emitting units. The conducting layer is on the insulating layer in order to conduct the first and the second light emitting units. Because of the appearance of the stair structure of the second light emitting unit, improving the cladding efficiency of the insulating layer, further improving the insulating efficiency of the insulating layer and avoiding the insulating layer loosing and the leakage between the first and the second light emitting units.
    Type: Application
    Filed: January 6, 2009
    Publication date: February 11, 2010
    Inventors: Hui Ching Feng, Kuo-Chin Huang, Shyi-Ming Pan, Hung-Li Pan, Yin-Cheng Chu
  • Patent number: 7635871
    Abstract: A light emitting diode (LED) with higher illumination efficiency is revealed. The LED includes a LED chip and an optical layer arranged on the bottom of the LED chip. The optical layer is a light-guiding layer, a light reflective layer or an energy-conversion layer that increases light emitting efficiency of the LED. Furthermore, a rough layer is disposed between the LED chip and the optical layer so as to increase surface area of the LED chip. Thus light emitted from the LED chip enters the optical layer more easily and the illumination efficiency of the LED is increased.
    Type: Grant
    Filed: April 19, 2008
    Date of Patent: December 22, 2009
    Assignee: Formosa Epitaxy Incorporation
    Inventors: Shyi-Ming Pan, Wei-Kang Cheng, Kuo-Chin Huang
  • Publication number: 20090310357
    Abstract: This invention relates to a collimation structure of LED module and a lamp using said LED module. The collimation structure of the present invention mainly has a lens provided at a place along the irradiation direction of the light beam emitted from LED. The lens has a first curved surface and a second curved surface, and the curvatures of both are different from each other. In this manner, the object of collimating the light emitted from the LED can be achieved by the provision of the first curved surface and the second curved surface and by the difference between the curvatures of the first curved surface and the second curved surface. Moreover, the collimated beam pattern of the light output through the lens can be changed by the variation of the curvatures of the first curved surface and the second curved surface so that said LED can fulfill the requirement of the application in illumination or alarming.
    Type: Application
    Filed: May 5, 2009
    Publication date: December 17, 2009
    Inventor: Kuo-Chin Huang
  • Publication number: 20090275156
    Abstract: A light-emitting gallium nitride-based III-V group compound semiconductor device and a manufacturing method thereof are disclosed. The light emitting device includes a substrate, a n-type semiconductor layer over the substrate, an active layer over the n-type semiconductor layer, a p-type semiconductor layer over the active layer, a conductive layer over the p-type semiconductor layer, a first electrode disposed on the conductive layer and a second electrode arranged on exposed part of the n-type semiconductor layer. A resistant reflective layer or a contact window is disposed on the p-type semiconductor layer, corresponding to the first electrode so that current passes beside the resistant reflective layer or by the contact window to the active layer for generating light. When the light is transmitted to the conductive layer for being emitted, it is not absorbed or shielded by the first electrode. Thus the current is distributed efficiently over the conductive layer.
    Type: Application
    Filed: July 14, 2009
    Publication date: November 5, 2009
    Inventors: Kuo-Chin Huang, Shyi-Ming Pan, Cheng-Kuo Huang, Chi-Yang Chuang, Fen-Ren Chien
  • Publication number: 20090267095
    Abstract: The present invention provides a light-emitting device with a reflection layer and the structure of the reflection layer. The reflection layer comprises a variety of dielectric materials. The reflection layer includes a plurality of dielectric layers. The materials of the plurality of dielectric layers have two or more types with two or more thicknesses, except for the combination of two material types and two thicknesses, for forming the reflection layer with a variety of structures. The reflection layer according to the present invention can be applied to light-emitting diodes of various types to form new light-emitting devices. Owing to its excellent reflectivity, the reflection layer can improve light-emitting efficiency of the light-emitting devices.
    Type: Application
    Filed: September 20, 2008
    Publication date: October 29, 2009
    Inventors: Wei-Kang CHENG, Shyi-Ming Pan, Cheng-Kuo Huang, Yin-Cheng Chu, Kuo-Chin Huang
  • Publication number: 20090189172
    Abstract: A light emitting diode (LED) with higher illumination efficiency is revealed. The LED includes a LED chip and an optical layer arranged on the bottom of the LED chip. The optical layer is a light-guiding layer, a light reflective layer or an energy-conversion layer that increases light emitting efficiency of the LED. Furthermore, a rough layer is disposed between the LED chip and the optical layer so as to increase surface area of the LED chip. Thus light emitted from the LED chip enters the optical layer more easily and the illumination efficiency of the LED is increased.
    Type: Application
    Filed: April 19, 2008
    Publication date: July 30, 2009
    Inventors: Shyi-Ming Pan, Wei-Kang Cheng, Kuo-Chin Huang
  • Patent number: 7510446
    Abstract: A multiple-function power supply adapter includes a supporting base with an interior thereof hollowed out, a power-supplying sleeve provided on the supporting base, and a transforming unit provided in the supporting base. The power-supplying sleeve is an automobile power-supplying socket. The transforming unit is electrically connected between a power supply line and the power-supplying sleeve. The power supply line extends from the inside of the supporting base to the outside thereof. The distal end of the power supply line is provided with a power supply plug. With the automobile power-supplying sleeve, the power supply adapter can be applied to various electrical appliances.
    Type: Grant
    Filed: November 1, 2007
    Date of Patent: March 31, 2009
    Inventors: Kuo-Ming Yu, Kuo-Chin Huang
  • Publication number: 20080303034
    Abstract: A light-emitting gallium nitride-based III-V group compound semiconductor device and a manufacturing method thereof are disclosed. The light emitting device includes a substrate, a n-type semiconductor layer over the substrate, an active layer over the n-type semiconductor layer, a p-type semiconductor layer over the active layer, a conductive layer over the p-type semiconductor layer, a first electrode disposed on the conductive layer and a second electrode arranged on exposed part of the n-type semiconductor layer. A resistant reflective layer or a contact window is disposed on the p-type semiconductor layer, corresponding to the first electrode so that current passes beside the resistant reflective layer or by the contact window to the active layer for generating light. When the light is transmitted to the conductive layer for being emitted, it is not absorbed or shielded by the first electrode. Thus the current is distributed efficiently over the conductive layer.
    Type: Application
    Filed: November 13, 2007
    Publication date: December 11, 2008
    Inventors: Kuo-Chin Huang, Shyi-Ming Pan, Cheng-Kuo Huang, Chi-Yang Chuang, Fen-Ren Chien
  • Publication number: 20070294800
    Abstract: A seamless down cloth and manufacturing method thereof are provided. The cloth comprises a shell fabric, a lining, and down, wherein the down are filled between the shell fabric and the lining, several down areas and pasted areas are spread around the shell fabric, wherein the shell fabric is seamless. The manufacturing method comprises the steps of patterning, cutting, forming down cloth, down filled, and pasting, further, the shell fabric is divided into several down areas by the seamless skill, and every down area is filled the down. The seamless shell fabric can overcome the problem of that the down will bore from the suture, such that can prevent from rain leaking through the suture. The shell fabric can be made by the material with the functions of water proof, wind proof, and moisture conductivity, such that the down cloth can be with water proof, wind proof, and warm keeping surely.
    Type: Application
    Filed: February 21, 2007
    Publication date: December 27, 2007
    Inventor: Kuo-Chin Huang
  • Patent number: 7118043
    Abstract: A hanging tab with a sensing chip, when in manufacturing, a fine net section for sewing or knitting and a frame are integrally shaped by injection molding; the frame has a fine net section, and includes an integrally formed fine-net frame surrounding a fine net, and has a sensing-chip frame section with a recess to receive a sensing chip; a sensing-chip cover can be integrally formed with the frame or separately formed, it can cover the recess to seal the sensing chip in the sensing-chip frame section. Thereby, an effect of simplifying the manufacturing process and increasing the speed as well as lowering the cost of production can be acquired.
    Type: Grant
    Filed: July 7, 2004
    Date of Patent: October 10, 2006
    Inventor: Kuo Chin Huang
  • Publication number: 20050225963
    Abstract: This invention provides a cooling apparatus for a light source disposed in a housing, which comprises a light source, a fan device, and an air-flow guiding device. The light source is capable of providing an optical energy propagating outward in an optical path. The fan device is disposed in a predetermined distance for producing airflow. The air-flow guiding device is disposed between the light source and the fan device for guiding the airflow towards the light source to cool down the light source.
    Type: Application
    Filed: November 12, 2004
    Publication date: October 13, 2005
    Inventors: Kuo-Chin Huang, Bor-Bin Chou
  • Publication number: 20050139346
    Abstract: A cooling apparatus for a light valve of the present invention includes a control box disposed on the back of the light valve to actuate the light valve, followed by a heat pipe and a heat-conducting component pasted upon the inner surface of the control box. The heat-conducting component is connected to a heat-collecting end of the heat pipe and one of its surface contacts with the light valve. The heat of the light valve is conducted to the second part of the control box through the heat-conducting component, and then the heat is conducted to the second part of the control box via the heat pipe pasted upon it. Thus, the heat of the light valve can be removed through the large area of the second part of control box, so as to increase the cooling efficiency and simplify the cooling apparatus.
    Type: Application
    Filed: November 17, 2004
    Publication date: June 30, 2005
    Applicant: Coretronic Corporation
    Inventors: Kuo-Chin Huang, Bor-Bin Chou, Chun-Yao Chen
  • Publication number: 20040101256
    Abstract: The present invention provides an optical fiber connector connected to a printed circuit board. The optical fiber connector comprises a main body and a supporting bracket. The main body has an inserted surface and a jointed surface arranged opposite to each other, the inserted surface comprises a fiber groove, and the jointed surface is faced with the printed circuit board. The supporting bracket has a top-surface and at least two side surfaces. One end of the side surface connects to said top surface and the other end of the side surface extends to form a piece. Thus, the piece is fastened into the printed circuit board to form a 180-angled optical fiber connector. The optical fiber transmitting lines can be perpendicularly inserted into the optical fiber connector. It also economizes the molding cost and manufacturing time.
    Type: Application
    Filed: July 31, 2003
    Publication date: May 27, 2004
    Applicant: Coretronic Corporation
    Inventors: Yih-Long Lin, Kuo-Chin Huang, Fan-Chieh Chang
  • Patent number: 6724634
    Abstract: The invention is related to a fixture device for motherboard module by placing two fixing plates on the locational surface of a major control device. A Π-shaped slide way with the same width as the motherboard module is formed on the base plate below the fixing plate. Additionally, a locating button in front of the opening of the slide way is used to secure the motherboard module into the slide way. Through this approach, the motherboard module can be easily installed/disassembled by pressing the locating button without using any tools or test fixtures.
    Type: Grant
    Filed: January 6, 2003
    Date of Patent: April 20, 2004
    Assignee: Coretronic Corporation
    Inventors: Kuo-Chin Huang, Kuan-Chou Ko
  • Patent number: 6715890
    Abstract: The present invention relates to an adjustable height apparatus applied to a horizontal projector and comprises a shield assembly, a supporting means, a compression link and a lever. When adjusting the projection elevation, an external force is applied on an adjusting button of the top wall of the projector. The compression link, connecting with the button, makes a vertical movement according to the external force and pushes the detent of the lever to depart from contact with the axial height-positioning component. The sleeve extends toward the outside of said shell by the elasticity of a first elastic component for adjusting a suitable height of the bottom base of the supporting means of the projector.
    Type: Grant
    Filed: February 7, 2002
    Date of Patent: April 6, 2004
    Assignee: Coretronic Corporation
    Inventors: Kuo-Chin Huang, Kuan-Chou Ko
  • Patent number: D566670
    Type: Grant
    Filed: April 14, 2006
    Date of Patent: April 15, 2008
    Assignee: High Tech Computer Corp.
    Inventor: Kuo-Chin Huang