Abstract: An object detection device and a confidence threshold method adjustment method are provided. The object detection device includes an optical camera, multiple sensors, and a processor. The optical camera and sensors are used to respectively capture a real-time video and environmental value of a detection area. The processor performs an object recognition model and at least one second recognition model. The object recognition model determines whether an object exists in the detection area based on the real-time video to generate a first recognition result and a corresponding first confidence value. The at least one second recognition model generates a second result based on the environmental value respectively. The processor dynamically adjusts a confidence threshold value based on a value of the second result and a correlation degree between the object and the second result.

Abstract: The present invention provides a control method of a flash memory controller, which includes the steps of: setting a waiting time in an interrupt coalescing mechanism, and setting a timer, wherein a timeout value of the timer is equal to the waiting time; receiving multiple commands from a submission queue in a host device, generating multiple command responses after processing the multiple commands, and writing the multiple command responses to a completion queue in the host device; receiving a submission queue tail and a completion queue head from the host device; and when the timer reaches the timeout value, subtracting the completion queue head from the submission queue tail to obtain a queue depth of a command queue of the host device.

Abstract: A chip package including a heat-dissipating device, a first thermal interface material layer disposed on the heat-dissipating device, a patterned circuit layer disposed on the first thermal interface material layer, a chip disposed on the patterned circuit layer and electrically connected to the patterned circuit layer, and an insulating encapsulant covering the chip, the patterned circuit layer, and the first thermal interface material layer is provided. The first thermal interface material layer has a thickness between 100 ?m and 300 ?m. The first thermal interface material layer is located between the patterned circuit layer and the heat-dissipating device.

Abstract: A power module including a main housing, a power element, and at least one assembling component is provided. The main housing has at least one side wall and at least two ribs extending from the side wall. The power element is disposed in the main housing and is closely pressed against a heat dissipation structure by the side wall. The assembling component includes a main section and two bending sections. The main section is located between the two ribs and includes a central portion, at least one movable component, and a peripheral portion. The central portion has a fastening portion, the peripheral portion surrounds the central portion, and the movable component is connected between the central portion and the peripheral portion. The two bending sections are respectively connected to two opposite sides of the peripheral portion and are respectively embedded in the two ribs.

Abstract: The tool connector includes a socket having a receiving space and a through hole communicating the receiving space, a sliding member slidably received in the receiving space, a positioning member received in the receiving space, and a hook member. A funnel-shaped opening is formed at an end of the receiving space. The sliding member is connected to the socket with an end via a first elastic member, and the other end is for a tool bit to abut against. The positioning member is selectively inserted into the through hole. An end of the hook member is connected to the sliding member, and the other end has a hook portion for grasp the tool bit. When the positioning member is moved inward and the sliding member is moved toward the funnel-shaped opening, the hook portion is swingable in the funnel-shaped opening to release the tool bit.

Abstract: A chip package including a heat-dissipating device, a first thermal interface material layer disposed on the heat-dissipating device, a patterned circuit layer disposed on the first thermal interface material layer, a chip disposed on the patterned circuit layer and electrically connected to the patterned circuit layer, and an insulating encapsulant covering the chip, the patterned circuit layer, and the first thermal interface material layer is provided. The first thermal interface material layer has a thickness between 100 ?m and 300 ?m. The first thermal interface material layer is located between the patterned circuit layer and the heat-dissipating device.

Abstract: A chip package including a lead frame, a first chip, a heat dissipation structure, and an insulating encapsulant is provided. The lead frame includes a chip pad having a first surface and a second surface opposite to the first surface and a lead connected to the chip pad. The first chip is disposed on the first surface of the chip pad and electrically connected to the lead of the lead frame and to the outside of the insulating encapsulant via the lead. The head dissipation structure is disposed on the second surface of the chip pad and includes a thermal interface material layer attached to the second surface. The insulating encapsulant encapsulates the first chip, the heat dissipation structure, and a portion of the lead frame.

Abstract: The tool connector includes a socket having a receiving space and a through hole communicating the receiving space, a sliding member slidably received in the receiving space, a positioning member received in the receiving space, and a hook member. A funnel-shaped opening is formed at an end of the receiving space. The sliding member is connected to the socket with an end via a first elastic member, and the other end is for a tool bit to abut against. The positioning member is selectively inserted into the through hole. An end of the hook member is connected to the sliding member, and the other end has a hook portion for grasp the tool bit. When the positioning member is moved inward and the sliding member is moved toward the funnel-shaped opening, the hook portion is swingable in the funnel-shaped opening to release the tool bit.

Abstract: An electronic device package structure including a substrate, a first circuit layer, a second circuit layer, an electronic device and an input/output device is provided. The first circuit layer includes a first conductive portion, a second conductive portion and a first curve portion located between the first conductive portion and the second conductive portion. At least a partial thickness of the first curve portion is greater than a thickness of the first conductive portion. The electronic device disposed on the second circuit layer is electrically connected to the second conductive portion of the first circuit layer. The input/output device disposed corresponding to the first conductive portion is electrically connected to the first conductive portion of the first circuit layer.

Abstract: An electronic package structure is provided. The electronic packaging structure includes a substrate, a conductive layer disposed on the substrate, an intermetallic compound disposed on the conductive layer, a stress buffering material disposed on the substrate and adjacent to the conductive layer, and an electronic device disposed on the conductive layer and the stress buffering material. The intermetallic compound is disposed between the electronic device and the conductive layer, between the electronic device and the stress buffering material, between the substrate and the stress buffering material, and between the conductive layer and the stress buffering material.

Abstract: Unit-dose oral care composition comprising a fibrous composition and/or an open cell foam with a low level of inorganic salts. Oral care compositions that dissolve quickly upon initial contact with water. Oral care compositions which leave a low amount of residue on surfaces upon use. Methods of use of unit-dose oral care compositions.

Abstract: A power module including a main housing, a power element, and at least one assembling component is provided. The main housing has at least one side wall and at least two ribs extending from the side wall. The power element is disposed in the main housing and is closely pressed against a heat dissipation structure by the side wall. The assembling component includes a main section and two bending sections. The main section is located between the two ribs and includes a central portion, at least one movable component, and a peripheral portion. The central portion has a fastening portion, the peripheral portion surrounds the central portion, and the movable component is connected between the central portion and the peripheral portion. The two bending sections are respectively connected to two opposite sides of the peripheral portion and are respectively embedded in the two ribs.

Abstract: An electronic device package structure including a substrate, a first circuit layer, a second circuit layer, an electronic device and an input/output device is provided. The first circuit layer includes a first conductive portion, a second conductive portion and a first curve portion located between the first conductive portion and the second conductive portion. At least a partial thickness of the first curve portion is greater than a thickness of the first conductive portion. The electronic device disposed on the second circuit layer is electrically connected to the second conductive portion of the first circuit layer. The input/output device disposed corresponding to the first conductive portion is electrically connected to the first conductive portion of the first circuit layer.

Abstract: A chip package including a lead frame, a first chip, a heat dissipation structure, and an insulating encapsulant is provided. The lead frame includes a chip pad having a first surface and a second surface opposite to the first surface and a lead connected to the chip pad. The first chip is disposed on the first surface of the chip pad and electrically connected to the lead of the lead frame and to the outside of the insulating encapsulant via the lead. The head dissipation structure is disposed on the second surface of the chip pad and includes a thermal interface material layer attached to the second surface. The insulating encapsulant encapsulates the first chip, the heat dissipation structure, and a portion of the lead frame.

Abstract: A chip package including a lead frame, a first chip, a heat dissipation structure, and an insulating encapsulant is provided. The lead frame includes a chip pad having a first surface and a second surface opposite to the first surface and a lead connected to the chip pad. The first chip is disposed on the first surface of the chip pad and electrically connected to the lead of the lead frame and to the outside of the insulating encapsulant via the lead. The head dissipation structure is disposed on the second surface of the chip pad and includes a thermal interface material layer attached to the second surface. The insulating encapsulant encapsulates the first chip, the heat dissipation structure, and a portion of the lead frame.

Abstract: An electronic paper display apparatus and a driving method thereof are provided. The electronic paper display apparatus includes an electronic paper display panel and a control chip. The control chip is coupled to the electronic paper display panel. The control chip is configured to generate a clock signal and simulate a driving signal according to the clock signal and panel control data. The control chip drives the electronic paper display panel by utilizing the clock signal and the driving signal.

Abstract: An electronic paper display apparatus including an electronic paper display panel and a driver apparatus is provided. The electronic paper display panel displays image frames and includes a plurality of display modes. The driver apparatus is electrically connected to the electronic paper display panel. The driver apparatus determines what display mode the electronic paper display panel is in according to image data. The driver apparatus selects a driving signal to drive the electronic paper display panel to display the image frames according to the display mode of the electronic paper display panel. The image data is encoded according to one of a plurality of encoding methods to include information related to the display mode of the electronic paper display panel.

Abstract: Unit-dose oral care composition comprising a fibrous composition and/or an open cell foam with a low level of inorganic salts. Oral care compositions that dissolve quickly upon initial contact with water. Oral care compositions which leave a low amount of residue on surfaces upon use. Methods of use of unit-dose oral care compositions.

Abstract: A chip package including a lead frame, a first chip, a heat dissipation structure, and an insulating encapsulant is provided. The lead frame includes a chip pad having a first surface and a second surface opposite to the first surface and a lead connected to the chip pad. The first chip is disposed on the first surface of the chip pad and electrically connected to the lead of the lead frame and to the outside of the insulating encapsulant via the lead. The head dissipation structure is disposed on the second surface of the chip pad and includes a thermal interface material layer attached to the second surface. The insulating encapsulant encapsulates the first chip, the heat dissipation structure, and a portion of the lead frame.

Abstract: An electronic package structure is provided. The electronic packaging structure includes a substrate, a conductive layer disposed on the substrate, an intermetallic compound disposed on the conductive layer, a stress buffering material disposed on the substrate and adjacent to the conductive layer, and an electronic device disposed on the conductive layer and the stress buffering material. The intermetallic compound is disposed between the electronic device and the conductive layer, between the electronic device and the stress buffering material, between the substrate and the stress buffering material, and between the conductive layer and the stress buffering material.