Abstract: A surface light source LED device includes a circuit board, at least one power input and at least two LED bar elements, the at least two LED bar elements are arranged in a staggered manner, and each of the LED bar elements includes a plurality of LED bars arranged linearly on the circuit board. Each of the LED bars has a straight strip structure and has a plurality of LED dies of the same type provided inside. The plurality of LED dies is arranged linearly at equal intervals.

Abstract: An evaporation apparatus including a material source, a chamber, a passageway, and a heating component is provided. The material source is configured to provide a deposition material. The chamber includes a manifold. The passageway is configured to be connected to the material source and the manifold. The heating component is disposed in at least a portion of the passageway and configured to heat the deposition material. A calibration method of the evaporation apparatus is also provided.

Abstract: A flexible substrate adjusting device includes a substrate transmission mechanism, a pressure roller, and a force applying assembly. The substrate transmission mechanism has a transmission direction for carrying a first surface of a flexible substrate thereon. The pressure roller is disposed on at least one side of a second surface of the flexible substrate in a non-transmission direction. The force applying assembly is connected to the pressure roller and provides the pressure roller with a pressure to the flexible substrate, wherein when the flexible substrate moves in the transmission direction, the pressure roller generates a friction force in the non-transmission direction with the flexible substrate to adjust flatness or position of the flexible substrate.

Abstract: A fan-out wafer level light-emitting diode package method for packaging a plurality of light-emitting diode chips on a wafer protective film, the method comprising: forming a package surface layer on first electrodes of the light-emitting diode chips, and then forming a plurality of leading electrodes electrically connected to the first electrodes on the package surface layer, cutting the light-emitting diode chips, sorting and testing as well as regrouping the light-emitting diode chips, covering sides of the light-emitting diode chips with a package layer, drilling and filling a conductive material on the package layer to form a plurality of common electrodes, and then printing a plurality of common electrical circuits, electrically connecting each of the common electrical circuits to one of the common electrodes and the leading electrodes, and finally covering with a circuit protection layer to complete the process.

Abstract: A roller assembly for transporting a substrate includes a step roller and a plurality of first auxiliary rollers. The step roller includes a main roller, and a pair of edge rollers sleeved on the main roller and located on two opposite ends of the main roller, respectively. The plurality of first auxiliary rollers are disposed on two opposite sides of the step roller, respectively. A first film forms a closed loop through the first film being rolled on the plurality of first auxiliary rollers and the step roller cyclically. A method using the same is also provided.

Abstract: A substrate conveying device and a deposition apparatus are provided. The substrate conveying device includes a transmission shaft, a plurality of conveying rollers, and a plurality of bearings. The conveying rollers are configured to convey a substrate respectively. Each conveying roller is assembled to the transmission shaft via the corresponding bearing. Each bearing includes a stator and a rotator. Each conveying roller is fixed to the corresponding rotator. The stators are fixed to the transmission shaft. A magnetic repulsion force parallel to an axial direction of the transmission shaft exists between the stator and the rotator. The stator drives the rotator to rotate via a friction force generated by the magnetic repulsion force between the stator and the rotator.

Abstract: An evaporation apparatus including a material source, a chamber, a passageway, and a heating component is provided. The material source is configured to provide a deposition material. The chamber includes a manifold. The passageway is configured to be connected to the material source and the manifold. The heating component is disposed in at least a portion of the passageway and configured to heat the deposition material. A calibration method of the evaporation apparatus is also provided.

Abstract: A cutting method of a multilayer structure containing a brittle layer is provided. The cutting method includes: cutting the multilayer structure to form a cut edge; removing a material of the multilayer structure other than the brittle layer along the cut edge, wherein the material of the multilayer structure other than the brittle layer has a width ranging from 1 micron to 2 millimeter; and modifying an edge of the brittle layer remaining after removing the material of the multilayer structure other than the brittle layer by a laser beam.

Abstract: A film thickness monitoring system is provided. The film thickness monitoring system includes a source, a valve, and a chamber. The source is configured to provide a deposition material. The valve is connected to the source. The chamber includes a manifold, a quartz crystal microbalance, and a pressure sensor. The manifold is connected to the valve and has at least one first nozzle and at least one second nozzle. The quartz crystal microbalance is disposed opposite to the at least one second nozzle. The deposition material is adapted to be deposited on the quartz crystal microbalance through the at least one second nozzle, and the quartz crystal microbalance includes a shutter facing the at least one second nozzle. The pressure sensor is disposed in the manifold. A method for monitoring a film thickness deposition process is also provided.

Abstract: A wafer substrate, a light emitting diode (LED) light-emitting layer, a circuit layer and an excitation material layer are included. The LED light-emitting layer includes at least two light-emitting regions, independently distinguished. The circuit layer includes at least two circuit structures that correspond to the at least two light-emitting regions in quantity and are independently controlled. The excitation material layer includes at least one photo-luminescence material, at least one of the at least two light-emitting regions is provided with different photo-luminescence materials, and at least one of the at least two light-emitting regions is not provided with the photo-luminescence material. Accordingly, in the present invention, at least two light colors can be formed over a single wafer substrate through the at least two independently-controlled circuit structures and providing the different photo-luminescence materials.

Abstract: A wafer substrate, a light emitting diode (LED) light-emitting layer, a circuit layer and an excitation material layer are included. The LED light-emitting layer includes at least two light-emitting regions, independently distinguished. The circuit layer includes at least two circuit structures that correspond to the at least two light-emitting regions in quantity and are independently controlled. The excitation material layer includes at least one photo-luminescence material, at least one of the at least two light-emitting regions is provided with different photo-luminescence materials, and at least one of the at least two light-emitting regions is not provided with the photo-luminescence material. Accordingly, in the present invention, at least two light colors can be formed over a single wafer substrate through the at least two independently-controlled circuit structures and providing the different photo-luminescence materials.

Abstract: A roller assembly for transporting a substrate includes a step roller and a plurality of first auxiliary rollers. The step roller includes a main roller, and a pair of edge rollers sleeved on the main roller and located on two opposite ends of the main roller, respectively. The plurality of first auxiliary rollers are disposed on two opposite sides of the step roller, respectively. A first film forms a closed loop through the first film being rolled on the plurality of first auxiliary rollers and the step roller cyclically. A method using the same is also provided.

Abstract: A roller assembly for transporting a substrate includes a step roller, a first transport roller, and a second transport roller. The step roller includes a main roller, an air cylinder, and a pair of edge rollers. The air cylinder is sleeved on the main roller, and includes a plurality of air jetting holes and a plurality of air suction holes. The edge rollers are disposed on the main roller and are located on opposite ends of the air cylinder. The first transport roller and the second transport roller are disposed on opposite sides of the step roller, wherein the substrate is transported from the first transport roller to the second transport roller through the step roller. A method using the same is also provided.

Abstract: A film thickness monitoring system is provided. The film thickness monitoring system includes a source, a valve, and a chamber. The source is configured to provide a deposition material. The valve is connected to the source. The chamber includes a manifold, a quartz crystal microbalance, and a pressure sensor. The manifold is connected to the valve and has at least one first nozzle and at least one second nozzle. The quartz crystal microbalance is disposed opposite to the at least one second nozzle. The deposition material is adapted to be deposited on the quartz crystal microbalance through the at least one second nozzle, and the quartz crystal microbalance includes a shutter facing the at least one second nozzle. The pressure sensor is disposed in the manifold. A method for monitoring a film thickness deposition process is also provided.

Abstract: According to an embodiment of the present disclosure, a roll-to-roll apparatus may include an unwinding unit, a winding unit, at least one supporting unit, at least one breakage sensor, and at least one holding unit. The at least one supporting unit is disposed between the unwinding unit and the winding unit, and supports the flexible substrate to move from the unwinding unit to the winding unit. The at least one breakage sensor may sense whether the flexible substrate is broken or not. The at least one holding unit may grip the flexible substrate while a breakage of the flexible substrate is sensed by the at least one breakage sensor.

Abstract: The present invention includes a safety indication structure a high energy invisible light light emitting structure and two potential applying layers. The high energy invisible light light emitting structure includes a high energy invisible light light emitting layer that receives a forward to emit invisible light, and a P-type semiconductor layer and an N-type semiconductor layer respectively disposed at two sides of the high energy invisible light light emitting layer. The two potential applying layers are respectively in contact with the P-type semiconductor layer and the N-type semiconductor layer. The safety indication structure includes a photoluminescent light emitting layer disposed on the high energy invisible light light emitting structure. When the high energy invisible light light emitting structure emits invisible light, the photoluminescent light emitting layer absorbs and converts the invisible light to visible light, which serves as a signal warning for danger to ensure user safety.

Abstract: A cutting method of a multilayer structure containing a brittle layer is provided. The cutting method includes: cutting the multilayer structure to form a cut edge; removing a material of the multilayer structure other than the brittle layer along the cut edge, wherein the material of the multilayer structure other than the brittle layer has a width ranging from 1 micron to 2 millimeter; and modifying an edge of the brittle layer remaining after removing the material of the multilayer structure other than the brittle layer by a laser beam.

Abstract: The present invention includes a safety indication structure a high energy invisible light light emitting structure and two potential applying layers. The high energy invisible light light emitting structure includes a high energy invisible light light emitting layer that receives a forward to emit invisible light, and a P-type semiconductor layer and an N-type semiconductor layer respectively disposed at two sides of the high energy invisible light light emitting layer. The two potential applying layers are respectively in contact with the P-type semiconductor layer and the N-type semiconductor layer. The safety indication structure includes a photoluminescent light emitting layer disposed on the high energy invisible light light emitting structure. When the high energy invisible light light emitting structure emits invisible light, the photoluminescent light emitting layer absorbs and converts the invisible light to visible light, which serves as a signal warning for danger to ensure user safety.

Abstract: A suction-type transmission apparatus includes at least one suction region allocation member and a suction wheel member. The suction region allocation member has a chamber and through holes communicating with the chamber. The suction wheel member is pivoted to the suction region allocation member, and includes an inner lining body with gas flow channels disposed in parallel, and an outer ring sleeve. The inner lining body has gas holes corresponding to the through holes and being in communication with the gas flow channels. The outer ring sleeve with micro-pores in communication with the gas flow channels is sleeved on the inner lining body, and wraps the gas flow channels. The chamber is connected to a gas extraction port, and at least one sealing element is selectively disposed in the chamber to seal at least one of the through holes for forming a suction region of the suction wheel member.

Abstract: An LED illumination system includes a DC power supply, at least two LED illumination lamp sets and at least two power circuits corresponding to the LED illumination lamp sets. The DC power supply provides sufficient electric power for the LED illumination lamp sets and is connected to the LED illumination lamp sets via the power circuits. The invention supplies electric power required by the LED illumination lamp sets via a single DC power supply without an extra DC power supply, hence the cost is lower. Moreover, the DC power supply is located remote from the LED illumination lamp sets, hence high temperature generated by the DC power supply does not affect lighting and lifespan of the LED illumination lamp sets. The hazard of electric shock by inadvertently touching the AC power source while replacing lamps in the LED illumination lamp sets can also be avoided to improve safety.