Patents by Inventor Kuo-Hsiung Li
Kuo-Hsiung Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230060584Abstract: There is provided an optical machine of a smoke detector including a substrate, a light source, a light sensor and a light blocking member. The light source and the light sensor are arranged on the substrate in a first direction. The light blocking member is arranged upon the light source and blocks a part of an emission angle of the light source in the first direction far away from the light sensor.Type: ApplicationFiled: April 15, 2022Publication date: March 2, 2023Inventors: Cheng-Nan TSAI, Yen-Chang CHU, Chih-Ming SUN, Chi-Chih SHEN, Kuo-Hsiung LI
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Publication number: 20220140173Abstract: There is provided an optical sensor package including a substrate, a base layer, an optical detection region, a light source and a light blocking wall. The base layer is arranged on the substrate. The light detection region and the light source are arranged on the base layer. The light blocking wall is arranged on the base layer, and located between the light detection region and the light source to block light directly propagating from the light source to the light detection region.Type: ApplicationFiled: October 29, 2020Publication date: May 5, 2022Inventors: Chi-Chih SHEN, Kuo-Hsiung LI, Shang-Feng HSIEH, Jui-Cheng CHUANG, Yi-Chang CHANG
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Patent number: 10340299Abstract: An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly has a first aperture to expose at least a first subset of the pixels that is configured to receive corresponding light.Type: GrantFiled: September 11, 2017Date of Patent: July 2, 2019Assignee: PIXART IMAGING INC.Inventors: Chi-Chih Shen, Kuo-Hsiung Li, Jui-Cheng Chuang
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Patent number: 10274365Abstract: The present disclosure discloses an optical module package structure and method thereof. The optical module includes a substrate, a shield, a photosensitive unit and a cover. The shield is disposed on the top of the substrate and forms a first housing space with the upper surface of the substrate. The photosensitive unit is disposed on the substrate and located in the first housing space. The shield has a light-receiving part above the photosensitive unit. At least one notch is on the outer surface of the shield. A cushion is disposed on the notch and protrudes on the upper surface of the shield. The cover is disposed on the cushion(s) and kept a constant distance to the upper surface of the shield by contacting with the cushion(s).Type: GrantFiled: April 4, 2017Date of Patent: April 30, 2019Assignee: PIXART IMAGING INC.Inventors: Chi-Chih Shen, Kuo-Hsiung Li, Shang-Feng Hsieh, Jui-Cheng Chuang
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Publication number: 20190081097Abstract: An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly has a first aperture to expose at least a first subset of the pixels that is configured to receive corresponding light.Type: ApplicationFiled: September 11, 2017Publication date: March 14, 2019Inventors: CHI-CHIH SHEN, KUO-HSIUNG LI, JUI-CHENG CHUANG
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Patent number: 9976898Abstract: An optical sensing module capable of providing a multi-directional optical sensing function teaches that the optical sensing module can be fixed on a circuit board via a bridging medium. The optical sensing module includes a supporter, a photosensitive component and a connecting component. The supporter includes a base and several lateral portions. The lateral portions are bent from edges of the base to form an accommodating space. The photosensitive component is disposed inside the accommodating space to receive an optical signal passing into an opening of the accommodating space. The connecting component is disposed on the supporter and includes a conductive terminal. The supporter is connected with the bridging material via the conductive terminal to stand on the circuit board by one of a plurality of sensing directions.Type: GrantFiled: July 24, 2016Date of Patent: May 22, 2018Assignee: PixArt Imaging Inc.Inventors: Chi-Chih Shen, Jen-Yu Chen, Yen-Hsin Chen, Kuo-Hsiung Li, Jui-Cheng Chuang
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Publication number: 20180087958Abstract: The present disclosure discloses an optical module package structure and method thereof. The optical module includes a substrate, a shield, a photosensitive unit and a cover. The shield is disposed on the top of the substrate and forms a first housing space with the upper surface of the substrate. The photosensitive unit is disposed on the substrate and located in the first housing space. The shield has a light-receiving part above the photosensitive unit. At least one notch is on the outer surface of the shield. A cushion is disposed on the notch and protrudes on the upper surface of the shield. The cover is disposed on the cushion(s) and kept a constant distance to the upper surface of the shield by contacting with the cushion(s).Type: ApplicationFiled: April 4, 2017Publication date: March 29, 2018Inventors: CHI-CHIH SHEN, KUO-HSIUNG LI, SHANG-FENG HSIEH, JUI-CHENG CHUANG
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Publication number: 20170167914Abstract: An optical sensing module capable of providing a multi-directional optical sensing function teaches that the optical sensing module can be fixed on a circuit board via a bridging medium. The optical sensing module includes a supporter, a photosensitive component and a connecting component. The supporter includes a base and several lateral portions. The lateral portions are bent from edges of the base to form an accommodating space. The photosensitive component is disposed inside the accommodating space to receive an optical signal passing into an opening of the accommodating space. The connecting component is disposed on the supporter and includes a conductive terminal. The supporter is connected with the bridging material via the conductive terminal to stand on the circuit board by one of a plurality of sensing directions.Type: ApplicationFiled: July 24, 2016Publication date: June 15, 2017Inventors: Chi-Chih Shen, Jen-Yu Chen, Yen-Hsin Chen, Kuo-Hsiung Li, Jui-Cheng Chuang
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Publication number: 20170133290Abstract: The invention provides a package structure which includes a substrate, at least one chip module, and a housing. The at least one chip module is located on the substrate. The housing includes an upper cover, a surrounding wall, and at least one adhesion enhancement structure. The surrounding wall is connected to the upper cover and encompasses the at least one chip module. The surrounding wall and the adhesion enhancement structure are bonded to the substrate by an adhesive. The adhesion enhancement structure includes an encircled hole or a semi-encircled hole.Type: ApplicationFiled: July 6, 2016Publication date: May 11, 2017Inventors: Kuo-Hsiung Li, Chi-Chih Shen, Jui-Cheng Chuang, Jen-Yu Chen
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Patent number: 9627286Abstract: The invention provides a package structure which includes a substrate, at least one chip module, and a housing. The at least one chip module is located on the substrate. The housing includes an upper cover, a surrounding wall, and at least one adhesion enhancement structure. The surrounding wall is connected to the upper cover and encompasses the at least one chip module. The surrounding wall and the adhesion enhancement structure are bonded to the substrate by an adhesive. The adhesion enhancement structure includes an encircled hole or a semi-encircled hole.Type: GrantFiled: July 6, 2016Date of Patent: April 18, 2017Assignee: PIXART IMAGING INCORPORATIONInventors: Kuo-Hsiung Li, Chi-Chih Shen, Jui-Cheng Chuang, Jen-Yu Chen
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Patent number: 8913035Abstract: An optical touch panel includes a panel and a light guide module. The light guide module is disposed on the panel, and the light guide module includes a printed circuit board, at least one light emitting element, and a light guide strip. The light emitting element is electrically disposed on the printed circuit board. The light guide strip is disposed on the printed circuit board, and wraps the light emitting element. Additionally, the light emitting element emits light rays, and the light rays penetrate the light guide strip and are emitted to the panel.Type: GrantFiled: April 28, 2011Date of Patent: December 16, 2014Assignee: Pixart Imaging Inc.Inventors: Hung-Ching Lai, Kuo-Hsiung Li, Hui-Hsuan Chen
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Patent number: 8841593Abstract: An image sensor module is installed in a sensing device, and is used to detect a reflected light of an object. The image sensor module includes a carrier, a light sensing element, and a package body. The light sensing element is disposed on a substrate. The carrier is disposed on the substrate in the sensing device. The light sensing element is installed in the carrier, and is electrically connected with the substrate via multiple solder balls. The package body is installed on the carrier, and has a reflecting and diverting element, which is located between the light sensing element and the object and is used for reflecting reflected light of the object and diverting the reflected light towards a receiving direction of the light sensing element. The light sensing element receives the reflected light and generates a corresponding sensing signal.Type: GrantFiled: February 24, 2011Date of Patent: September 23, 2014Assignee: Pixart Imaging Inc.Inventors: Wei Chung Wang, Chi Chih Shen, Kuo Hsiung Li, Hui Hsuan Chen, Jui Cheng Chuang
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Patent number: 8482012Abstract: A chip module package structure applied to an optical input device includes a cover body, a first chip module, and a second chip module. The first chip module and the second chip module are respectively combined with the cover body, the first chip module has an optical source, and the second chip module has an optical sensor. Further, the optical source and the optical sensor form a preset relative spatial position relation, such that a part of light emitted by the optical source is received by the optical sensor after at least one reflection.Type: GrantFiled: July 12, 2010Date of Patent: July 9, 2013Assignee: Pixart Imaging Inc.Inventors: Kuo-Hsiung Li, Hung-Ching Lai
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Patent number: 8330094Abstract: In an optical mouse, an optical sensing module includes a printed circuit board and a packaging body. The printed circuit board has an upper surface and a lower surface on opposite sides. The packaging body including a compound, an optical sensing die and a lead frame is disposed on the lower surface. The compound has a transparent surface. The optical sensing die used for receiving light is located inner the compound and has an optical sensing surface facing the transparent surface of the compound. The lead frame with a shoulder portion is electrically connected to the optical sensing die. The shoulder portion extends out from the compound along a direction that is parallel to the optical sensing surface of the optical sensing die. The shoulder portion is fixed on the lower surface. The optical sensing module may be used in an optical mouse.Type: GrantFiled: February 28, 2009Date of Patent: December 11, 2012Assignee: Pixart Imaging Inc.Inventors: Wei-Chung Wang, Kuo-Hsiung Li
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Patent number: 8325154Abstract: The present invention discloses an optical touch control apparatus, comprising: a light guide module having an optical information capturing position, the light guide module guiding light to the optical information capturing position, and generating optical information according to light input through or reflected from the optical information capturing position; and an image sensor module for sensing the optical information, and generating an electronic signal according to the optical information.Type: GrantFiled: February 13, 2008Date of Patent: December 4, 2012Assignee: PixArt Imaging IncorporationInventors: Cho-Yi Lin, Yao-Ching Hsu, Hui-Hsuan Chen, Chin-Chou Lee, Kuo-Hsiung Li, Hsin-Chia Chen
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Publication number: 20120206409Abstract: An optical touch panel includes a panel and a light guide module. The light guide module is disposed on the panel, and the light guide module includes a printed circuit board, at least one light emitting element, and a light guide strip. The light emitting element is electrically disposed on the printed circuit board. The light guide strip is disposed on the printed circuit board, and wraps the light emitting element. Additionally, the light emitting element emits light rays, and the light rays penetrate the light guide strip and are emitted to the panel.Type: ApplicationFiled: April 28, 2011Publication date: August 16, 2012Applicant: PixArt Imaging, Inc.Inventors: Hung-Ching Lai, Kuo-Hsiung Li, Hui-Hsuan Chen
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Patent number: 8110837Abstract: A sensing module comprises a carrier, a sensor, a substrate, and a plurality of chips. The carrier has a carrying surface and a back surface opposite to the carrying surface. The sensor and the substrate are disposed on the carrying surface and are electrically connected to the carrier respectively. The chips are disposed on the substrate and are electrically connected to the substrate respectively. The production cost of the sensing module is low.Type: GrantFiled: November 28, 2008Date of Patent: February 7, 2012Assignee: Pixart Imaging IncInventors: Hung-Ching Lai, Kuo-Hsiung Li, Hui-Hsuan Chen, Wei-Chung Wang
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Publication number: 20120001054Abstract: An image sensor module is installed in a sensing device, and is used to detect a reflected light of an object. The image sensor module includes a carrier, a light sensing element, and a package body. The light sensing element is disposed on a substrate. The carrier is disposed on the substrate in the sensing device. The light sensing element is installed in the carrier, and is electrically connected with the substrate via multiple solder balls. The package body is installed on the carrier, and has a reflecting and diverting element, which is located between the light sensing element and the object and is used for reflecting reflected light of the object and diverting the reflected light towards a receiving direction of the light sensing element. The light sensing element receives the reflected light and generates a corresponding sensing signal.Type: ApplicationFiled: February 24, 2011Publication date: January 5, 2012Applicant: PIXART IMAGING INC.Inventors: Wei Chung Wang, Chi Chih Shen, Kuo Hsiung Li, Hui Hsuan Chen, Jui Cheng Chuang
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Publication number: 20110200066Abstract: A chip module package structure applied to an optical input device includes a cover body, a first chip module, and a second chip module. The first chip module and the second chip module are respectively combined with the cover body, the first chip module has an optical source, and the second chip module has an optical sensor. Further, the optical source and the optical sensor form a preset relative spatial position relation, such that a part of light emitted by the optical source is received by the optical sensor after at least one reflection.Type: ApplicationFiled: July 12, 2010Publication date: August 18, 2011Applicant: PIXART IMAGING INC.Inventors: Kuo-Hsiung Li, Hung-Ching Lai
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Publication number: 20100181466Abstract: In an optical mouse, an optical sensing module includes a printed circuit board and a packaging body. The printed circuit board has an upper surface and a lower surface on opposite sides. The packaging body including a compound, an optical sensing die and a lead frame is disposed on the lower surface. The compound has a transparent surface. The optical sensing die used for receiving light is located inner the compound and has an optical sensing surface facing the transparent surface of the compound. The lead frame with a shoulder portion is electrically connected to the optical sensing die. The shoulder portion extends out from the compound along a direction that is parallel to the optical sensing surface of the optical sensing die. The shoulder portion is fixed on the lower surface. The optical sensing module may be used in an optical mouse.Type: ApplicationFiled: February 28, 2009Publication date: July 22, 2010Inventors: Wei-Chung Wang, Kuo-Hsiung Li