Abstract: A package structure is described. A light emitting element and a light sensing element are disposed on a substrate, and are both wrapped by a package layer. Meanwhile, the light emitting element and the light sensing element are separated by a trench of the package layer, such that lights generated by the light emitting element are blocked, thereby reducing the noise interference on the light sensing element and improving the sensing precision of the light sensing element.

Abstract: A sensing module comprises a carrier, a sensor, a substrate, and a plurality of chips. The carrier has a carrying surface and a back surface opposite to the carrying surface. The sensor and the substrate are disposed on the carrying surface and are electrically connected to the carrier respectively. The chips are disposed on the substrate and are electrically connected to the substrate respectively. The production cost of the sensing module is low.

Abstract: The present invention discloses an optical touch control apparatus, comprising: a light guide module having an optical information capturing position, the light guide module guiding light to the optical information capturing position, and generating optical information according to light input through or reflected from the optical information capturing position; and an image sensor module for sensing the optical information, and generating an electronic signal according to the optical information.

Abstract: An optical apparatus includes an optical semiconductor device and a lens assembly mounted on opposite surfaces of a substrate. The height of a surrounding wall and the thickness of a cover member of a semiconductor package of the optical semiconductor device are selected so that, when the cover member and the lens assembly abut directly against the opposite surfaces of the substrate, an optimum optical distance will be formed between a lens set of the lens assembly and a light-sensing portion of an optical semiconductor chip in the semiconductor package. A method for making the optical apparatus is also disclosed.

Abstract: An optical apparatus includes an optical semiconductor device and a lens assembly mounted on opposite surfaces of a substrate. The height of a surrounding wall and the thickness of a cover member of a semiconductor package of the optical semiconductor device are selected so that, when the cover member and the lens assembly abut directly against the opposite surfaces of the substrate, an optimum optical distance will be formed between a lens set of the lens assembly and a light-sensing portion of an optical semiconductor chip in the semiconductor package. A method for making the optical apparatus is also disclosed.

Abstract: An improved automobile wheel cover, in particular a wheel cover having several catch blocks at its outer edge that are used to engage lugs of wing members to form a highly secure, easily assembled and cheaper priced automobile wheel cover. The catch blocks are removably attached to an outer cover and serve to mount the wing members.