Abstract: A battery system for an electric vehicle is provided. The electric vehicle includes a motor and a vehicle control unit. The battery system includes a first battery module, a second battery module configured to accommodate a plurality of swappable batteries, and a power control module configured to receive a driving intention from the vehicle control unit and switch a power supplying configuration of the motor according to the driving intention. The power supplying configuration includes a power supply by the first battery module only, a power supply by the second battery module only, a power supply by the first battery module and the second battery module in series, and a power supply by the first battery module and the second battery module in parallel.

Abstract: A battery system for electric vehicles is provided. The battery system includes a first battery module, a second battery module configured to accommodate multiple swappable batteries and a switch device. The switch device is configured to switch a first connection configuration between the first battery module and the second battery module, and to switch a second connection configuration between the swappable batteries when switching the first connection configuration. Each of the first connection configuration and the second connection configuration includes a series connection and a parallel connection. In addition, a power control system and a control method of the battery system are also provided.

Abstract: A semiconductor device package includes a first conductive base, a first insulation layer and a second insulation layer. The first conductive base has a first surface, a second surface opposite to the first surface and a lateral surface extended between the first surface and the second surface. The lateral surface includes a first portion adjacent to the first surface and a second portion adjacent to the second surface. The first insulation layer comprises a first insulation material. The first insulation layer has a first surface and a second surface opposite to the first surface. The first insulation layer covers the first portion of the lateral surface of the first conductive base. The second insulation layer comprises a second insulation material and covers the second portion of the lateral surface of the first conductive base. The first insulation material is different from the second insulation material.

Abstract: A semiconductor package structure includes a base, at least one semiconductor element, a first dielectric layer, a second dielectric layer and a circuit layer. The semiconductor element is disposed on the base and has an upper surface. The first dielectric layer covers at least a portion of a peripheral surface of the semiconductor element and has a top surface. The top surface is non-coplanar with the upper surface of the semiconductor element. The second dielectric layer covers the semiconductor element and the first dielectric layer. The circuit layer extends through the second dielectric layer to electrically connect the semiconductor element.

Abstract: A semiconductor package structure includes a base, at least one semiconductor element, a first dielectric layer, a second dielectric layer and a circuit layer. The semiconductor element is disposed on the base and has an upper surface. The first dielectric layer covers at least a portion of a peripheral surface of the semiconductor element and has a top surface. The top surface is non-coplanar with the upper surface of the semiconductor element. The second dielectric layer covers the semiconductor element and the first dielectric layer. The circuit layer extends through the second dielectric layer to electrically connect the semiconductor element.

Abstract: A semiconductor device package includes a first conductive base, a first insulation layer and a second insulation layer. The first conductive base has a first surface, a second surface opposite to the first surface and a lateral surface extended between the first surface and the second surface. The lateral surface includes a first portion adjacent to the first surface and a second portion adjacent to the second surface. The first insulation layer comprises a first insulation material. The first insulation layer has a first surface and a second surface opposite to the first surface. The first insulation layer covers the first portion of the lateral surface of the first conductive base. The second insulation layer comprises a second insulation material and covers the second portion of the lateral surface of the first conductive base. The first insulation material is different from the second insulation material.

Abstract: A semiconductor device package includes a first conductive base, a first insulation layer and a second insulation layer. The first conductive base has a first surface, a second surface opposite to the first surface and a lateral surface extended between the first surface and the second surface. The lateral surface includes a first portion adjacent to the first surface and a second portion adjacent to the second surface. The first insulation layer comprises a first insulation material. The first insulation layer has a first surface and a second surface opposite to the first surface. The first insulation layer covers the first portion of the lateral surface of the first conductive base. The second insulation layer comprises a second insulation material and covers the second portion of the lateral surface of the first conductive base. The first insulation material is different from the second insulation material.

Abstract: A flasher relay for driving a left turn signal lamp and a right turn signal lamp of a vehicle to flash includes a main body and a control circuit. The main body includes a base, a casing, and a circuit board. The circuit board is disposed on the base. The casing is mounted on the base and covers the circuit board. The control circuit is disposed on the circuit board. The control circuit includes a microchip having an input terminal coupled to a field-effect transistor and an electromagnetic buzzer. A drain of the field-effect transistor and one end of the electromagnetic buzzer are coupled to a node B. A heat dissipation terminal of the field-effect transistor is coupled to the node B, and the node B guides thermal energy to a wire.

Abstract: A display matrix, a display device and an associated display method are provided. The display matrix includes a first display device and a second display device. The first display device transmits a source image at a first transmitting time point. The second display device is serially connected to the first display device via a daisy chain. The first display device and the second display device are arranged in a matrix. The second display device receives the source image via the daisy chain at a second receiving time point. The first display device displays the source image at a first display time point. The first display time point is the same as or later than the second receiving time point.

Abstract: A semiconductor device package includes a first conductive base, a first insulation layer and a second insulation layer. The first conductive base has a first surface, a second surface opposite to the first surface and a lateral surface extended between the first surface and the second surface. The lateral surface includes a first portion adjacent to the first surface and a second portion adjacent to the second surface. The first insulation layer comprises a first insulation material. The first insulation layer has a first surface and a second surface opposite to the first surface. The first insulation layer covers the first portion of the lateral surface of the first conductive base. The second insulation layer comprises a second insulation material and covers the second portion of the lateral surface of the first conductive base. The first insulation material is different from the second insulation material.

Abstract: An embodiment of the disclosure provides an electronic device including a power supply, an optical to electrical converter and a controller. The power supply outputs a first electric power. The optical to electrical converter receives an infrared light beam and converts the infrared light beam to a second electric power. The controller is coupled to the power supply and the optical to electrical converter. The controller operates in a first mode and a second mode. When the controller operates in the first mode, the controller is activated by the second electric power and after the controller is activated, the controller operates in the second mode and drives the power supply. Then, the controller receives the first electric power and stops receiving the first electric power for operation.

Abstract: The present disclosure relates to a semiconductor package structure, including a die and a package substrate. The die includes a semiconductor substrate, multiple interconnect metal layers, and at least one inter-level dielectric disposed between ones of the interconnect metal layers. Each inter-level dielectric is formed of a low k material. An outermost interconnect metal layer has multiple first conductive segments exposed from a surface of the inter-level dielectric. The package substrate includes a substrate body and multiple second conductive segments exposed from a surface of the substrate body. The second conductive segments are electrically connected to the first conductive segments.

Abstract: The present disclosure relates to a semiconductor package structure and a method for manufacturing the same. The semiconductor package structure includes a leadframe and a semiconductor die. The leadframe includes a main portion and a protrusion portion. The semiconductor die is bonded to a first surface of the main portion. The protrusion portion protrudes from a second surface of the main portion. The position of the protrusion portion corresponds to the position of the semiconductor die.

Abstract: A substrate structure is provided. The substrate structure includes a number of traces, a substrate core, a number of first metal tiles, a number of second metal tiles, a number of first electrically-functioning circuits, and a number of second electrically-functioning circuits. The substrate core has a first surface and a second surface opposite to the first surface. The traces, the first metal tiles, and the first electrically-functioning circuits are disposed on the first surface and add up to a first metal structure proportion, and the second metal tiles and the second electrically-functioning circuits are disposed on the second surface and add up to a second metal structure proportion. The difference between the first metal structure proportion and the second metal structure proportion is within 15%.

Abstract: A semiconductor device package includes a substrate and a semiconductor device disposed on a surface of the substrate. The semiconductor device includes a first contact pad and a second contact pad disposed on an upper surface of the semiconductor device. The semiconductor device package further includes a conductive bar disposed on the first contact pad, and a conductive pillar disposed on the second contact pad. A method of making a semiconductor device package includes (a) providing a substrate; (b) mounting a semiconductor device on the substrate, wherein the semiconductor device comprises a first contact pad and a second contact pad on an upper surface of the semiconductor device; (c) forming a dielectric layer on the substrate to cover the semiconductor device; (d) exposing the second contact pad by forming a hole in the dielectric layer; and (e) applying a conductive material over the dielectric layer and filling the hole.

Abstract: The present disclosure relates to a semiconductor package structure and a method for manufacturing the same. The semiconductor package structure includes a leadframe and a semiconductor die. The leadframe includes a main portion and a protrusion portion. The semiconductor die is bonded to a first surface of the main portion. The protrusion portion protrudes from a second surface of the main portion. The position of the protrusion portion corresponds to the position of the semiconductor die.

Abstract: A display module includes a display panel and a reflective optical film. The display panel has a display surface. The reflective optical film is disposed on the display surface of the display panel. The reflective optical film includes a cholesteric liquid crystal layer and a first anti-glare layer. The first anti-glare layer is disposed between the display panel and the cholesteric liquid crystal layer.

Abstract: A display matrix, a display device and an associated display method are provided. The display matrix includes a first display device and a second display device. The first display device transmits a source image at a first transmitting time point. The second display device is serially connected to the first display device via a daisy chain. The first display device and the second display device are arranged in a matrix. The second display device receives the source image via the daisy chain at a second receiving time point. The first display device displays the source image at a first display time point. The first display time point is the same as or later than the second receiving time point.

Abstract: The present disclosure relates to a semiconductor package structure, including a die and a package substrate. The die includes a semiconductor substrate, multiple interconnect metal layers, and at least one inter-level dielectric disposed between ones of the interconnect metal layers. Each inter-level dielectric is formed of a low k material. An outermost interconnect metal layer has multiple first conductive segments exposed from a surface of the inter-level dielectric. The package substrate includes a substrate body and multiple second conductive segments exposed from a surface of the substrate body. The second conductive segments are electrically connected to the first conductive segments.

Abstract: An audio output device includes a housing, a speaker, a switching unit, a fixing component and a control unit. An opening is formed on the housing. The speaker is for outputting sound. The switching unit is installed inside the housing. The fixing component is fixed in the opening of the housing for triggering the switching unit so that the switching unit outputs a switching signal. The control unit is electrically connected to the switching unit and the speaker, and the control unit controls the speaker to output sound in a corresponding sound field as the control unit receives the switching signal.