Abstract: A display module includes a display panel and a reflective optical film. The display panel has a display surface. The reflective optical film is disposed on the display surface of the display panel. The reflective optical film includes a cholesteric liquid crystal layer and a first anti-glare layer. The first anti-glare layer is disposed between the display panel and the cholesteric liquid crystal layer.

Abstract: A display matrix, a display device and an associated display method are provided. The display matrix includes a first display device and a second display device. The first display device transmits a source image at a first transmitting time point. The second display device is serially connected to the first display device via a daisy chain. The first display device and the second display device are arranged in a matrix. The second display device receives the source image via the daisy chain at a second receiving time point. The first display device displays the source image at a first display time point. The first display time point is the same as or later than the second receiving time point.

Abstract: The present disclosure relates to a semiconductor package structure, including a die and a package substrate. The die includes a semiconductor substrate, multiple interconnect metal layers, and at least one inter-level dielectric disposed between ones of the interconnect metal layers. Each inter-level dielectric is formed of a low k material. An outermost interconnect metal layer has multiple first conductive segments exposed from a surface of the inter-level dielectric. The package substrate includes a substrate body and multiple second conductive segments exposed from a surface of the substrate body. The second conductive segments are electrically connected to the first conductive segments.

Abstract: An audio output device includes a housing, a speaker, a switching unit, a fixing component and a control unit. An opening is formed on the housing. The speaker is for outputting sound. The switching unit is installed inside the housing. The fixing component is fixed in the opening of the housing for triggering the switching unit so that the switching unit outputs a switching signal. The control unit is electrically connected to the switching unit and the speaker, and the control unit controls the speaker to output sound in a corresponding sound field as the control unit receives the switching signal.

Abstract: The disclosure relates to a semiconductor bonding structure and process and a semiconductor chip. The semiconductor bonding structure includes a first pillar, a first interface, an intermediate area, a second interface and a second pillar in sequence. The first pillar, the second pillar and the intermediate area include a first metal. The first interface and the second interface include the first metal and an oxide of a second metal. The content percentage of the first metal in the first interface and the second interface is less than that of the first metal in the intermediate area.

Abstract: The present invention provides a neural sensing device and method for making the same. The neural sensing device includes a base, an integrated circuit portion, a plurality of microprobes and at least one conductive via. The base has an active surface and a backside surface. The integrated circuit portion is disposed on the active surface of the base. The microprobes protrude from the backside surface of the base. The through silicon via is disposed in the base and electrically connects the integrated circuit portion and the microprobes. Each of the microprobes includes an isolation layer partially covering a conductive layer.

Abstract: The present invention provides a neural sensing device and method for making the same. The neural sensing device includes a base, an integrated circuit portion and a plurality of microprobes. The base has an active surface and a backside surface. The integrated circuit portion is disposed on the active surface of the base. The microprobes protrude from the backside surface of the base. The conductive vias are disposed in the microprobes and electrically connected to the integrated circuit portion.

Abstract: An audio output device includes a housing, a speaker, a switching unit, a fixing component and a control unit. An opening is formed on the housing. The speaker is for outputting sound. The switching unit is installed inside the housing. The fixing component is fixed in the opening of the housing for triggering the switching unit so that the switching unit outputs a switching signal. The control unit is electrically connected to the switching unit and the speaker, and the control unit controls the speaker to output sound in a corresponding sound field as the control unit receives the switching signal.

Abstract: The present invention relates to a package having a semiconductor device. The semiconductor device includes a substrate body, a plurality of conductive vias and a plurality of metal pads. The conductive vias are disposed in the through holes of the substrate body. The metal pads are electrically connected to the conductive vias. At least one of the metal pads has at least one curved side wall and at least one reference side wall. The curvature of the curved side wall is different from that of the reference side wall, so as to allow the metal pads to be closer to each other. This arrangement allows the conductive to be closer to each other. Therefore, more conductive vias can be arranged in a limited space.

Abstract: The present invention provides a neural sensing device and method for making the same. The neural sensing device includes a base, an integrated circuit portion and a plurality of microprobes. The base has an active surface and a backside surface. The integrated circuit portion is disposed on the active surface of the base. The microprobes protrude from the backside surface of the base. The conductive vias are disposed in the microprobes and electrically connected to the integrated circuit portion.

Abstract: The present invention provides a neural sensing device and method for making the same. The neural sensing device includes a base, an integrated circuit portion, a plurality of microprobes and at least one conductive via. The base has an active surface and a backside surface. The integrated circuit portion is disposed on the active surface of the base. The microprobes protrude from the backside surface of the base. The through silicon via is disposed in the base and electrically connects the integrated circuit portion and the microprobes. Each of the microprobes includes an isolation layer partially covering a conductive layer.

Abstract: The disclosure relates to a semiconductor bonding structure and process and a semiconductor chip. The semiconductor bonding structure includes a first pillar, a first interface, an intermediate area, a second interface and a second pillar in sequence. The first pillar, the second pillar and the intermediate area include a first metal. The first interface and the second interface include the first metal and an oxide of a second metal. The content percentage of the first metal in the first interface and the second interface is less than that of the first metal in the intermediate area.

Abstract: A substrate structure is provided. The substrate structure includes a number of traces, a substrate core, a number of first metal tiles, a number of second metal tiles, a number of first electrically-functioning circuits, and a number of second electrically-functioning circuits. The substrate core has a first surface and a second surface opposite to the first surface. The traces, the first metal tiles, and the first electrically-functioning circuits are disposed on the first surface and add up to a first metal structure proportion, and the second metal tiles and the second electrically-functioning circuits are disposed on the second surface and add up to a second metal structure proportion. The difference between the first metal structure proportion and the second metal structure proportion is within 15%.

Abstract: A substrate structure and a package structure using the same are provided. The substrate structure includes a number of traces, a substrate core and a number of first metal tiles. The substrate core has a first surface and a second surface opposite to the first surface. The first metal tiles are disposed on one of the first surface and the second surface, the minimum pitch between adjacent two of the first metal tiles is the minimum process pitch.

Abstract: An embodiment of the disclosure provides an electronic device including a power supply, an optical to electrical converter and a controller. The power supply outputs a first electric power. The optical to electrical converter receives an infrared light beam and converts the infrared light beam to a second electric power. The controller is coupled to the power supply and the optical to electrical converter. The controller operates in a first mode and a second mode. When the controller operates in the first mode, the controller is activated by the second electric power and after the controller is activated, the controller operates in the second mode and drives the power supply. Then, the controller receives the first electric power and stops receiving the first electric power for operation.

Abstract: An electronic card connector is used to connect an electronic card to an electronic device, such as a level-shifting device. The electronic card connector includes an insert slot unit and a switch unit. The insert slot unit is adapted for insertion of the electronic card and is provided with a power signal terminal for providing electric power to the electronic card that is inserted into the insert slot unit. The 10 switch unit is disposed in the insert slot unit, is operable to establish electrical connection between the power signal terminal and a first power source when the electronic card inserted into the insert slot unit does not actuate the switch unit, and is further operable to establish electrical connection between the power signal terminal and a second power source when the electronic card inserted into the insert slot unit actuates the switch unit.

Abstract: The present invention relates to a silicon substrate having through vias and a package having the same. The silicon substrate includes a substrate body, a plurality of through vias and at least one heat dissipating area. The substrate body has a surface, and the material of the substrate body is silicon. The through vias penetrate the substrate body, and each of the through vias has a conductive material therein. The heat dissipating area is disposed on the surface of the substrate body and covers at least two through vias. The heat dissipating area is made of metal, and the through vias inside the heat dissipating area have same electrical potential. Thus, the heat in the through vias is transmitted to the heat dissipating area, and since the area of the heat dissipating area is large, the silicon substrate has good heat dissipation efficiency.

Abstract: The present invention relates to a package having a semiconductor device. The semiconductor device includes a substrate body, a plurality of conductive vias and a plurality of metal pads. The conductive vias are disposed in the through holes of the substrate body. The metal pads are electrically connected to the conductive vias. At least one of the metal pads has at least one curved side wall and at least one reference side wall. The curvature of the curved side wall is different from that of the reference side wall, so as to allow the metal pads to be closer to each other. This arrangement allows the conductive to be closer to each other. Therefore, more conductive vias can be arranged in a limited space.

Abstract: A package structure with an embedded die includes a core layer, a first build-up wiring structure, and a second build-up wiring structure. The core layer has a first surface and a second surface opposite thereto. Besides, the core layer includes a first dielectric layer, a leadframe, a die, a first signal layer, and a second signal layer. The die is disposed on and electrically connected to the leadframe. The die and the leadframe are embedded in the first dielectric layer. The first signal layer is disposed on an upper surface of the first dielectric layer and electrically connected to the leadframe. The second signal layer is disposed on a bottom surface of the first dielectric layer and electrically connected to the leadframe. The first and the second build-up wiring structures are disposed on the first and the second surfaces of the core layer, respectively.

Abstract: An electronic card connector is used to connect an electronic card to an electronic device, such as a level-shifting device. The electronic card connector includes an insert slot unit and a switch unit. The insert slot unit is adapted for insertion of the electronic card and is provided with a power signal terminal for providing electric power to the electronic card that is inserted into the insert slot unit. The 10 switch unit is disposed in the insert slot unit, is operable to establish electrical connection between the power signal terminal and a first power source when the electronic card inserted into the insert slot unit does not actuate the switch unit, and is further operable to establish electrical connection between the power signal terminal and a second power source when the electronic card inserted into the insert slot unit actuates the switch unit.