Patents by Inventor Kuo-Huang Hsieh
Kuo-Huang Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240072155Abstract: A method includes forming a transistor, which includes forming a dummy gate stack over a semiconductor region, and forming an Inter-Layer Dielectric (ILD). The dummy gate stack is in the ILD, and the ILD covers a source/drain region in the semiconductor region. The method further includes removing the dummy gate stack to form a trench in the first ILD, forming a low-k gate spacer in the trench, forming a replacement gate dielectric extending into the trench, forming a metal layer to fill the trench, and performing a planarization to remove excess portions of the replacement gate dielectric and the metal layer to form a gate dielectric and a metal gate, respectively. A source region and a drain region are then formed on opposite sides of the metal gate.Type: ApplicationFiled: November 8, 2023Publication date: February 29, 2024Inventors: Kuo-Hua Pan, Je-Wei Hsu, Hua Feng Chen, Jyun-Ming Lin, Chen-Huang Peng, Min-Yann Hsieh, Java Wu
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Patent number: 8461282Abstract: The present invention discloses an iridium complex containing a (pentaphenyl)phenyl ligand, having the following general equation: in which G is primary ligand, R? and R? are auxiliary ligands. On the other hand, the present invention discloses a compound with a 9-[(pentaphenyl)phenyl]carbazole structure and its polymeric derivative.Type: GrantFiled: December 2, 2009Date of Patent: June 11, 2013Assignee: National Taiwan UniversityInventors: Kuo-Huang Hsieh, Man-Kit Leung, Wen-Chang Chen, Chao-Hui Kuo, Hong-Jun Chen, Hsin-Chung Ke, Cheng-Hsiu Ku
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Patent number: 8101703Abstract: A process for preparing a precursor solution for polyimide/silica composite material and a process for forming a polyimide/silica composite material film on a substrate, including adding a monomer of a silane compound to allow a poly(amic acid) to carry a silica moiety; adding a monomer of formula (R6)xSi(R7)4-x to allow the silica moiety to carry a photo-polymerizable unsaturated group; adding a monomer of formula R8N(R9)2 to allow the poly(amic acid) to carry a photo-polymerizable unsaturated group, where R6, R7, R8, R9 and x are as defined in the specification. Also, a precursor solution for polyimide/silica composite material and a polyimide/silica composite material. The composite material is useful in microelectronic devices, semiconductor elements, and photoelectric elements.Type: GrantFiled: July 30, 2010Date of Patent: January 24, 2012Assignee: Eternal Chemical Co., LtdInventors: Chung-Jen Wu, Min-Chi Wang, Chung-Hung Chang, Meng-Yen Chou, Chin-Chang Chuang, Hsin-Wei Huang, Shu-Wan Lu, Chin-Min An, Chung-Hao Wu, Wen-Chang Chen, Cheng-Tyng Yen, Yu-Wen Wang, Kuo-Huang Hsieh
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Patent number: 8088838Abstract: The present invention discloses a cone material in endodontic treatment. The cone material comprises a thermoplastic polyurethane and a filler. The thermoplastic polyurethane is formed by a. isophorone diisocyanate (IPDI) or hexamethylene diisocyanate (HDI), b. poly(butyleneadipate) glycol (PBA) and c. chain extender, wherein the molar ratio of PBA and the diisocyanate is equal to or more than 0.8. By changing the molar composition of the components such as polyol and diisocyanate, physical and chemical property of the disclosed cone material in endodontic treatment can be adjusted.Type: GrantFiled: February 26, 2009Date of Patent: January 3, 2012Assignee: National Taiwan UniversityInventors: Kuo-Huang Hsieh, Chun-Pin Lin, Ken-Hsuan Liao, Chung-Yi Lee, Ching-Ting Tsao
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Patent number: 7977406Abstract: The present invention discloses an endodontic sealer which comprises a urethane-monoacrylate oligomer, a diluting monomer, at least one photo-initiator, at least one thermal-initiator, and a filler, wherein the urethane-monoacrylate oligomer is obtained by firstly reacting the acrylate with the diisocyanate to form an intermediate with only one isocyanate group, and then reacting the intermediate with the polyol to form the desired urethane-monoacrylate oligomer.Type: GrantFiled: December 19, 2008Date of Patent: July 12, 2011Assignee: National Taiwan UniversityInventors: Kuo-Huang Hsieh, Chun-Pin Lin, Ken-Hsuan Liao, Chung-Yi Lee
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Publication number: 20100297455Abstract: The present invention relates to a process for preparing a precursor solution for polyimide/silica composite material and a process for forming a polyimide/silica composite material film on a substrate, comprising adding a monomer of a silane compound to allow a poly(amic acid) to carry a silica moiety; adding a monomer of formula (R6)xSi(R7)(4-x) to allow the silica moiety to carry a photo-polymerizable unsaturated group; and adding a monomer of formula R8N(R9)2 to allow the poly(amic acid) to carry a photo-polymerizable unsaturated group, where R6, R7, R8, R9, and x are as defined in the specification. The present invention also relates to a precursor solution for polyimide/silica composite material and a polyimide/silica composite material. The composite material of the present invention is useful in microelectronic devices, semiconductor elements, and photoelectric elements.Type: ApplicationFiled: July 30, 2010Publication date: November 25, 2010Inventors: Chung-Jen WU, Min-Chi Wang, Chung-Hung Chang, Meng-Yen Chou, Chin-Chang Chuang, Hsin-Wei Huang, Shu-Wan Lu, Chin-Min An, Chung-Hao Wu, Wen-Chang Chen, Cheng-Tyng Yen, Yu-Wen Wang, Kuo-Huang Hsieh
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Patent number: 7790828Abstract: A process for preparing a precursor solution for polyimide/silica composite material and a process for forming a polyimide/silica composite material film on a substrate, including adding a monomer of a silane compound to allow a poly(amic acid) to carry a silica moiety; adding a monomer of formula (R6)xSi(R7)(4?x) to allow the silica moiety to carry a photo-polymerizable unsaturated group; and adding a monomer of formula R8N(R9)2 to allow the poly(amic acid) to carry a photo-polymerizable unsaturated group, where R6, R7, R8, R9, and x are as defined in the specification. Also, a precursor solution for polyimide/silica composite material and a polyimide/silica composite material. The composite material is useful in microelectronic devices, semiconductor elements, and photoelectric elements.Type: GrantFiled: May 2, 2005Date of Patent: September 7, 2010Assignee: Eternal Chemical Co., Ltd.Inventors: Chung-Jen Wu, Min-Chi Wang, Chung-Hung Chang, Meng-Yen Chou, Chin-Chang Chuang, Hsin-Wei Huang, Shu-Wan Lu, Chin-Min An, Chung-Hao Wu, Wen-Chang Chen, Cheng-Tyng Yen, Yu-Wen Wang, Kuo-Huang Hsieh
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Publication number: 20100137461Abstract: The present invention discloses an iridium complex containing a (pentaphenyl)phenyl ligand, having the following general equation: in which G is primary ligand, R? and R? are auxiliary ligands. On the other hand, the present invention discloses a compound with a 9-[(pentaphenyl)phenyl]carbazole structure and its polymeric derivative.Type: ApplicationFiled: December 2, 2009Publication date: June 3, 2010Applicant: National Taiwan UniversityInventors: Kuo-Huang Hsieh, Man-Kit Leung, Wen-Chang Chen, Chao-Hui Kuo, Hong-Jun Chen, Hsin-Chung Ke, Cheng-Hsiu Ku
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Publication number: 20100026168Abstract: The present invention discloses a photo-curable hole-transport material used in a polymer light-emitting diode. The photo-curable hole-transport material comprises at least one first conjugate structure, at least one connecting structure, and at least one second conjugate structure. The first conjugate structure is a triarylamine derivative. The second conjugate structure is a carbazole derivative. The connecting structure is derived from one structure selected from the group consisting of the following or the combination thereof: urethane and urea structures.Type: ApplicationFiled: January 21, 2009Publication date: February 4, 2010Applicant: National Taiwan UniversityInventors: Kuo-Huang Hsieh, Man-Kit Leung, Wen-Chang Chen, Cheng-Hsiu Ku, Chih-Yu Chen, Cheng-Dar Liu, Ching-Nan Chuang, Yu-Shan Cheng
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Patent number: 7615603Abstract: The present invention discloses hole or electron injection polymers and prepolymers, hole or electron transport polymers and prepolymers, which comprises a plurality of conjugated or non-conjugated structures with electronic function and a plurality of connecting structures, wherein the connecting structure is used to connect different conjugated or non-conjugated structures with electronic function, and the connecting structure comprises any one or any combination of the following group: ether based group, ester based group, urethane based group, urea based group, carbonate based group, nitrogen atom based group, amide based group, and imide based group. Moreover, this invention also discloses a method for forming the mentioned charge injection or transport polymers and prepolymers.Type: GrantFiled: November 30, 2005Date of Patent: November 10, 2009Assignee: National Taiwan UniversityInventors: Kuo-Huang Hsieh, Man-Kit Leung, Chao-Hui Kuo, Li-Chung Kuo, Kuei-Hui Yang, Jiun-Haw Lee, Kang-Jyun Peng
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Publication number: 20090183671Abstract: A color filter fabrication apparatus is disclosed to include a platform carrying a substrate, a black matrix printing roller, a first photoresist printing roller, a second photoresist printing roller and a third photoresist printing roller for printing a black matrix, a first photoresist, a second photoresist and a third photoresist onto the substrate in a proper order, and curing apparatuses for curing the printed black matrix, first photoresist, second photoresist and third photoresist respectively.Type: ApplicationFiled: January 14, 2009Publication date: July 23, 2009Inventors: Sen-Yeu Yang, Kuo-Huang Hsieh, Jian-Ren Ciou, Liang-Ting Jiang, Po-Hsun Huang
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Publication number: 20090156710Abstract: The present invention discloses a cone material in endodontic treatment. The cone material comprises a thermoplastic polyurethane and a filler. The thermoplastic polyurethane is formed by a. isophorone diisocyanate (IPDI) or hexamethylene diisocyanate (HDI), b. poly(butyleneadipate) glycol (PBA) and c. chain extender, wherein the molar ratio of PBA and the diisocyanate is equal to or more than 0.8. By changing the molar composition of the components such as polyol and diisocyanate, physical and chemical property of the disclosed cone material in endodontic treatment can be adjusted.Type: ApplicationFiled: February 26, 2009Publication date: June 18, 2009Applicant: National Taiwan UniversityInventors: Kuo-Huang Hsieh, Chun-Pin Lin, Ken-Hsuan Liao, Chung-Yi Lee, Ching-Ting Tsao
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Patent number: 7537884Abstract: The present invention discloses a method by utilizing chemical reaction or specific attractive forces (complexation or hydrogen bonding) for forming self-synthesizing conductive or conjugated polymer film and its application. First of all, at least one photoresist layer with a first functional group and a specific pattern is formed, so that the first functional group can bond a second functional group of a conductive or conjugated polymer unit, whereby a conductive or conjugated polymer film with specific pattern is formed. Furthermore, this invention can be applied for forming emitting films, especially for forming emitting layers of OLED/PLED elements.Type: GrantFiled: October 20, 2004Date of Patent: May 26, 2009Assignee: National Taiwan UniversityInventors: Kuo-Huang Hsieh, Man-Kit Leung, King-Fu Lin, Wen-Yen Chiu, Wen-Chang Chen, Lee-Yih Wang, Wen-Bin Liau, Chi-An Dai, Wei-Fang Su, Hung-Chun Chang, Hung-Ren Wang, Chao-Hui Kuo, Chi-Shin Lee, Jun-Ming Huang, Cheng-Yuan Shih
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Publication number: 20090131552Abstract: The present invention discloses an endodontic sealer which comprises a urethane-monoacrylate oligomer, a diluting monomer, at least one photo-initiator, at least one thermal-initiator, and a filler, wherein the urethane-monoacrylate oligomer is obtained by firstly reacting the acrylate with the diisocyanate to form an intermediate with only one isocyanate group, and then reacting the intermediate with the polyol to form the desired urethane-monoacrylate oligomer.Type: ApplicationFiled: December 19, 2008Publication date: May 21, 2009Applicant: NATIONAL TAIWAN UNIVERSITYInventors: Kuo-Huang Hsieh, Chun-Pin Lin, Ken-Hsuan Liao, Chung-Yi Lee
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Publication number: 20090038492Abstract: This invention discloses a micro-stamping method for photoelectric process. First of all, in this invention, the micro-stamping method provides a stamp, an ink, an inkpad and a substrate, wherein the stamp or the inkpad having specific protruding bodies and the ink is one element of the group consisting of red ink, green ink and blue ink. Further, by adherence of the ink to the stamp, the specific pattern can be transferred to the surface of the substrate. Furthermore, this micro-stamping method comprises an ink adherence process, a positioning process, a pattern transferring process and a fixation process, and the above-mentioned processes will repeat until the three inks, such as red ink, green ink and blue ink, all adhered and fixed on the predetermined places of substrate.Type: ApplicationFiled: August 11, 2008Publication date: February 12, 2009Applicant: National Taiwan UniversityInventors: Kuo-Huang Hsieh, Long-Sun Huang, Sen-Yeu Yang, Da-Ming Wang, Pe-Zen Chang, Chih-Yuan Chang, Wei-Yen Chen
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Publication number: 20080319103Abstract: The present invention discloses a Polyurethane (PU) composite material comprising a thermoplastic polyurethane and a filler. The thermoplastic polyurethane comprises a linear polyurethane main-chain, and the polyurethane main-chain comprises a soft segment and a hard segment. The hard segment of the polyurethane main-chain is formed by a diisocyanate and a chain extender, and the soft segment of the polyurethane main-chain is formed by a polyol. The present invention also teaches the application of the disclosed thermoplastic polyurethane composite material in dental root canal material.Type: ApplicationFiled: June 20, 2007Publication date: December 25, 2008Applicant: NATIONAL TAIWAN UNIVERSITYInventors: Kuo-Huang Hsieh, Chun-Pin Lin, Ken-Hsuan Liao, Chung-Yi Lee
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Publication number: 20080319098Abstract: The present invention discloses an endodontic sealer which comprises a urethane-acrylate oligomer, a diluting monomer, at least one photo-initiator, at least one thermal-initiator, and a filler, wherein the urethane-acrylate oligomer is obtained by firstly reacting the acrylate with the diisocyanate to form an intermediate with only one isocyanate group, and then reacting the intermediate with the polyol to form the desired urethane-acrylate oligomer.Type: ApplicationFiled: June 20, 2007Publication date: December 25, 2008Applicant: NATIONAL TAIWAN UNIVERSITYInventors: Kuo-Huang Hsieh, Chun-Pin Lin, Ken-Hsuan Liao, Chung-Yi Lee
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Publication number: 20080293945Abstract: The present invention discloses an iridium complex containing a (pentaphenyl)phenyl ligand, having the following general equation: in which G is primary ligand, R? and R? are auxiliary ligands. On the other hand, the present invention discloses a compound with a 9-[(pentaphenyl)phenyl]carbazole structure and its polymeric derivative.Type: ApplicationFiled: May 22, 2007Publication date: November 27, 2008Applicant: NATIONAL TAIWAN UNIVERSITYInventors: Kuo-Huang Hsieh, Man-Kit Leung, Wen-Chang Chen, Chao-Hui Kuo, Hong-Jun Chen, Hsin-Chung Ke, Cheng-Hsiu Ku
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Publication number: 20060149392Abstract: The present invention is directed to compositions and methods of using compositions comprising a scaffold with growth factors chemically immobilized thereto for inducing chondrogenesis and/or osteogenesis when implanted in vivo or osteogenesis or chondrogenesis in cultures in vitro. The compositions and methods enhance bone and cartilage growth. Also described are compositions and methods for targeted drug delivery.Type: ApplicationFiled: December 6, 2005Publication date: July 6, 2006Inventors: Kuo-Huang Hsieh, Ken-Yu Chang, Chun-Pin Lin, Liou Horng, Yung-Hsin Lin
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Publication number: 20060115682Abstract: The present invention discloses hole or electron injection polymers and prepolymers, hole or electron transport polymers and prepolymers, which comprises a plurality of conjugated or non-conjugated structures with electronic function and a plurality of connecting structures, wherein the connecting structure is used to connect different conjugated or non-conjugated structures with electronic function, and the connecting structure comprises any one or any combination of the following group: ether based group, ester based group, urethane based group, urea based group, carbonate based group, nitrogen atom based group, amide based group, and imide based group. Moreover, this invention also discloses a method for forming the mentioned charge injection or transport polymers and prepolymers.Type: ApplicationFiled: November 30, 2005Publication date: June 1, 2006Inventors: Kuo-Huang Hsieh, Man-Kit Leung, Chao-Hui Kuo, Li-Chung Kuo, Kuei-Hui Yang, Jiun-Haw Lee, Kang-Jyun Peng