Patents by Inventor Kuo-Huang Hsieh

Kuo-Huang Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060084009
    Abstract: The present invention discloses a method by utilizing chemical reaction or specific attractive forces (complexation or hydrogen bonding) for forming self-synthesizing conductive or conjugated polymer film and its application. First of all, at least one photoresist layer with a first functional group and a specific pattern is formed, so that the first functional group can bond a second functional group of a conductive or conjugated polymer unit, whereby a conductive or conjugated polymer film with specific pattern is formed. Furthermore, this invention can be applied for forming emitting films, especially for forming emitting layers of OLED/PLED elements.
    Type: Application
    Filed: October 20, 2004
    Publication date: April 20, 2006
    Inventors: Kuo-Huang Hsieh, Man-Kit Leung, King-Fu Lin, Wen-Yen Chiu, Wen-Chang Chen, Lee-Yih Wang, Wen-Bin Liau, Chi-An Dai, Wei-Fang Su, Hung-Chun Chang, Hung-Ren Wang, Chao-Hui Kuo, Chi-Shin Lee, Jun-Ming Huang, Cheng-Yuan Shih
  • Publication number: 20050245715
    Abstract: The present invention relates to a process for preparing a precursor solution for polyimide/silica composite material and a process for forming a polyimide/silica composite material film on a substrate, comprising adding a monomer of a silane compound to allow a poly(amic acid) to carry a silica moiety; adding a monomer of formula (R6)xSi(R7)(4-x) to allow the silica moiety to carry a photo-polymerizable unsaturated group; and adding a monomer of formula R8N(R9)2 to allow the poly(amic acid) to carry a photo-polymerizable unsaturated group, where R6, R7, R8, R9, and x are as defined in the specification. The present invention also relates to a precursor solution for polyimide/silica composite material and a polyimide/silica composite material. The composite material of the present invention is useful in microelectronic devices, semiconductor elements, and photoelectric elements.
    Type: Application
    Filed: May 2, 2005
    Publication date: November 3, 2005
    Inventors: Chung-Jen Wu, Min-Chi Wang, Chung-Hung Chang, Meng-Yen Chou, Chin-Chang Chuang, Hsin-Wei Huang, Shu-Wan Lu, Chin-Min An, Chung-Hao Wu, Wen-Chang Chen, Cheng-Tyng Yen, Yu-Wen Wang, Kuo-Huang Hsieh
  • Publication number: 20050069644
    Abstract: This invention discloses a micro-stamping method for photoelectric process. First of all, in this invention, the micro-stamping method provides a stamp, an ink, an inkpad and a substrate, wherein the stamp or the inkpad having a specific raised pattern and the ink is one element of the group consisting of red ink, green ink and blue ink. Further, by adherence of the ink to the stamp, the specific pattern can be transferred to the surface of the substrate. Furthermore, this micro-stamping method comprises an ink adherence process, a positioning process, a pattern transferring process and a fixation process, and the above-mentioned processes will repeat until the three inks, such as red ink, green ink and blue ink, all adhered and fixed on the predetermined places of substrate.
    Type: Application
    Filed: September 29, 2003
    Publication date: March 31, 2005
    Applicant: National Taiwan University
    Inventors: Kuo-Huang Hsieh, Long-Sun Huang, Sen-Yeu Yang, Da-Ming Wang, Pe-Zen Chang, Chih-Yuan Chang, Wei-Yen Chen
  • Patent number: 5635581
    Abstract: The present invention relates to a polymer including a fullerene core and a plurality of prepolymer units. Each of the prepolymer units is linked to a carbon atom of the core by a moiety independently selected from the group consisting of --O--(C.dbd.O)--NH--, --NH--(C.dbd.O)--NH--, --0--(C.dbd.S)--NH--, and --N--(C.dbd.S)--NH--.
    Type: Grant
    Filed: November 28, 1994
    Date of Patent: June 3, 1997
    Assignee: National Science Counsel
    Inventors: Long Y. Chiang, Lee-Yih Wang, Kuo-Huang Hsieh