Patents by Inventor Kuo-Liang Lu

Kuo-Liang Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210272928
    Abstract: The present disclosure, in some embodiments, relates to a workpiece bonding apparatus. The workpieces bonding apparatus includes a first substrate holder having a first surface configured to receive a first workpiece, and a second substrate holder having a second surface configured to receive a second workpiece. A vacuum apparatus is positioned between the first substrate holder and the second substrate holder and is configured to selectively induce a vacuum between the first surface and the second surface. The vacuum is configured to attract the first surface and the second surface toward one another.
    Type: Application
    Filed: May 13, 2021
    Publication date: September 2, 2021
    Inventors: Xin-Hua Huang, Kuan-Liang Liu, Kuo Liang Lu, Ping-Yin Liu
  • Patent number: 11031369
    Abstract: An apparatus and method is provided for controlling a propagation of a bond wave during semiconductor processing. The apparatus has a first chuck to selectively retain a first workpiece. A second chuck selectively retains a second workpiece. The first and second chucks selectively secure at least a periphery of the respective first workpiece and second workpiece. An air vacuum is circumferentially located in a region between the first chuck and second chuck. The air vacuum is configured to induce a vacuum between the first workpiece and second workpiece to selectively bring the first workpiece and second workpiece together from a propagation point. The air vacuum can be localized air vacuum guns, a vacuum disk, or an air curtain positioned about the periphery of the region between the first chuck and second chuck. The air curtain induces a lower pressure within the region between the first and second chucks.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: June 8, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Xin-Hua Huang, Kuan-Liang Liu, Kuo Liang Lu, Ping-Yin Liu
  • Patent number: 10889097
    Abstract: The present disclosure relates to a debonding apparatus. In some embodiments, the debonding apparatus comprises a wafer chuck configured to hold a pair of bonded substrates on a chuck top surface. The debonding apparatus further comprises a pair of separating blades including a first separating blade and a second separating blade placed at edges of the pair of bonded substrates. The first separating blade has a first thickness that is smaller than a second thickness of the second separating blade. The debonding apparatus further comprises a flex wafer assembly configured to pull the pair of bonded substrates upwardly to separate a second substrate from a first substrate of the pair of bonded substrate. By providing unbalanced initial torques on opposite sides of the bonded substrate pair, edge defects and wafer breakage are reduced.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: January 12, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chang-Chen Tsao, Kuo Liang Lu, Ru-Liang Lee, Sheng-Hsiang Chuang, Yu-Hung Cheng, Yeur-Luen Tu, Cheng-Kang Hu
  • Publication number: 20200397663
    Abstract: A storage rack structure and a storage panel module thereof are disclosed. The storage panel module includes an inclined carrying panel, a rolling unit and a plurality of storage boxes. The inclined carrying panel has an inclined top wall and a first lateral side and a second lateral side arranged at two sides of the inclined top wall, and a height of the inclined top wall is gradually reduced from the first lateral side to the second lateral side. The rolling unit is disposed on the inclined top wall and crossly arranged between the first lateral side and the second lateral side. The storage boxes are disposed on the inclined top wall and the rolling unit and adjacently arranged between the first lateral side and the second lateral side. Accordingly advantages of easily taking out medicines and efficiently managing expire dates of the medicines are provided.
    Type: Application
    Filed: June 19, 2020
    Publication date: December 24, 2020
    Inventors: Kuo-Liang LU, Fu-Chi TSAI
  • Publication number: 20200108592
    Abstract: The present disclosure relates to a debonding apparatus. In some embodiments, the debonding apparatus comprises a wafer chuck configured to hold a pair of bonded substrates on a chuck top surface. The debonding apparatus further comprises a pair of separating blades including a first separating blade and a second separating blade placed at edges of the pair of bonded substrates. The first separating blade has a first thickness that is smaller than a second thickness of the second separating blade. The debonding apparatus further comprises a flex wafer assembly configured to pull the pair of bonded substrates upwardly to separate a second substrate from a first substrate of the pair of bonded substrate. By providing unbalanced initial torques on opposite sides of the bonded substrate pair, edge defects and wafer breakage are reduced.
    Type: Application
    Filed: December 11, 2019
    Publication date: April 9, 2020
    Inventors: Chang-Chen Tsao, Kuo Liang Lu, Ru-Liang Lee, Sheng-Hsiang Chuang, Yu-Hung Cheng, Yeur-Luen Tu, Cheng-Kang Hu
  • Patent number: 10569520
    Abstract: The present disclosure relates to a debonding apparatus. In some embodiments, the debonding apparatus comprises a wafer chuck configured to hold a pair of bonded substrates on a chuck top surface. The debonding apparatus further comprises a pair of separating blades including a first separating blade and a second separating blade placed at edges of the pair of bonded substrates diametrically opposite to each other. The first separating blade has a first thickness that is smaller than a second thickness of the second separating blade. The debonding apparatus further comprises a flex wafer assembly placed above the pair of bonded substrates and configured to pull the pair of bonded substrates upwardly to separate a second substrate from a first substrate of the pair of bonded substrate. By providing unbalanced initial torques on opposite sides of the bonded substrate pair, edge defects and wafer breakage are reduced.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: February 25, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chang-Chen Tsao, Kuo Liang Lu, Ru-Liang Lee, Sheng-Hsiang Chuang, Yu-Hung Cheng, Yeur-Luen Tu, Cheng-Kang Hu
  • Publication number: 20200051950
    Abstract: An apparatus and method is provided for controlling a propagation of a bond wave during semiconductor processing. The apparatus has a first chuck to selectively retain a first workpiece. A second chuck selectively retains a second workpiece. The first and second chucks selectively secure at least a periphery of the respective first workpiece and second workpiece. An air vacuum is circumferentially located in a region between the first chuck and second chuck. The air vacuum is configured to induce a vacuum between the first workpiece and second workpiece to selectively bring the first workpiece and second workpiece together from a propagation point. The air vacuum can be localized air vacuum guns, a vacuum disk, or an air curtain positioned about the periphery of the region between the first chuck and second chuck. The air curtain induces a lower pressure within the region between the first and second chucks.
    Type: Application
    Filed: October 16, 2019
    Publication date: February 13, 2020
    Inventors: Xin-Hua Huang, Kuan-Liang Liu, Kuo Liang Lu, Ping-Yin Liu
  • Patent number: 10497667
    Abstract: An apparatus and method is provided for controlling a propagation of a bond wave during semiconductor processing. The apparatus has a first chuck to selectively retain a first workpiece. A second chuck selectively retains a second workpiece. The first and second chucks selectively secure at least a periphery of the respective first workpiece and second workpiece. An air vacuum is circumferentially located in a region between the first chuck and second chuck. The air vacuum is configured to induce a vacuum between the first workpiece and second workpiece to selectively bring the first workpiece and second workpiece together from a propagation point. The air vacuum can be localized air vacuum guns, a vacuum disk, or an air curtain positioned about the periphery of the region between the first chuck and second chuck. The air curtain induces a lower pressure within the region between the first and second chucks.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: December 3, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Xin-Hua Huang, Kuan-Liang Liu, Kuo Liang Lu, Ping-Yin Liu
  • Publication number: 20190118522
    Abstract: The present disclosure relates to a debonding apparatus. In some embodiments, the debonding apparatus comprises a wafer chuck configured to hold a pair of bonded substrates on a chuck top surface. The debonding apparatus further comprises a pair of separating blades including a first separating blade and a second separating blade placed at edges of the pair of bonded substrates diametrically opposite to each other. The first separating blade has a first thickness that is smaller than a second thickness of the second separating blade. The debonding apparatus further comprises a flex wafer assembly placed above the pair of bonded substrates and configured to pull the pair of bonded substrates upwardly to separate a second substrate from a first substrate of the pair of bonded substrate. By providing unbalanced initial torques on opposite sides of the bonded substrate pair, edge defects and wafer breakage are reduced.
    Type: Application
    Filed: December 14, 2018
    Publication date: April 25, 2019
    Inventors: Chang-Chen Tsao, Kuo Liang Lu, Ru-Liang Lee, Sheng-Hsiang Chuang, Yu-Hung Cheng, Yeur-Luen Tu, Cheng-Kang Hu
  • Publication number: 20190096848
    Abstract: An apparatus and method is provided for controlling a propagation of a bond wave during semiconductor processing. The apparatus has a first chuck to selectively retain a first workpiece. A second chuck selectively retains a second workpiece. The first and second chucks selectively secure at least a periphery of the respective first workpiece and second workpiece. An air vacuum is circumferentially located in a region between the first chuck and second chuck. The air vacuum is configured to induce a vacuum between the first workpiece and second workpiece to selectively bring the first workpiece and second workpiece together from a propagation point. The air vacuum can be localized air vacuum guns, a vacuum disk, or an air curtain positioned about the periphery of the region between the first chuck and second chuck. The air curtain induces a lower pressure within the region between the first and second chucks.
    Type: Application
    Filed: March 26, 2018
    Publication date: March 28, 2019
    Inventors: Xin-Hua Huang, Kuan-Liang Liu, Kuo Liang Lu, Ping-Yin Liu
  • Patent number: 10155369
    Abstract: The present disclosure relates to a method for debonding a pair of bonded substrates. In the method, a debonding apparatus is provided comprising a wafer chuck, a flex wafer assembly, and a set of separating blades. The pair of bonded substrates is placed upon the wafer chuck so that a first substrate of the bonded substrate pair is in contact with a chuck top surface. The flex wafer assembly is placed above the bonded substrate pair so that its first surface is in contact with an upper surface of a second substrate of the bonded substrate pair. A pair of separating blades having different thicknesses is inserted between the first and second substrates from edges of the pair of bonded substrates diametrically opposite to each other while the second substrate is concurrently pulled upward until the flex wafer assembly flexes the second substrate from the first substrate. By providing unbalanced initial torques on opposite sides of the bonded substrate pair, edge defects and wafer breakage are reduced.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: December 18, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chang-Chen Tsao, Kuo Liang Lu, Ru-Liang Lee, Sheng-Hsiang Chuang, Yu-Hung Cheng, Yeur-Luen Tu, Cheng-Kang Hu
  • Patent number: 10056275
    Abstract: Embodiments using immersion de-taping are described. A substrate having a substrate tape attached thereto is provided. The substrate includes electrically conductive connectors attached to the substrate tape. A fluid is provided between the substrate and the substrate tape. While the fluid is between the substrate and the substrate tape, the substrate tape is removed from the substrate. Another embodiment is an apparatus comprising an immersion tank, a substrate chuck, first and second fixed rollers, and a moveable roller. The substrate chuck is configured to secure a substrate and to place the substrate into the immersion tank. The first fixed roller is operable to dispense a clamp tape. The second fixed roller is operable to roll the clamp tape. The moveable roller is operable to extend into the immersion tank and to adhere the clamp tape to a substrate tape on the substrate.
    Type: Grant
    Filed: March 12, 2017
    Date of Patent: August 21, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching Tasi Liu, Fu-Chen Chang, Chien-Chen Li, Te Lung Liu, Kuo Liang Lu
  • Publication number: 20180147825
    Abstract: The present disclosure relates to a method for debonding a pair of bonded substrates. In the method, a debonding apparatus is provided comprising a wafer chuck, a flex wafer assembly, and a set of separating blades. The pair of bonded substrates is placed upon the wafer chuck so that a first substrate of the bonded substrate pair is in contact with a chuck top surface. The flex wafer assembly is placed above the bonded substrate pair so that its first surface is in contact with an upper surface of a second substrate of the bonded substrate pair. A pair of separating blades having different thicknesses is inserted between the first and second substrates from edges of the pair of bonded substrates diametrically opposite to each other while the second substrate is concurrently pulled upward until the flex wafer assembly flexes the second substrate from the first substrate. By providing unbalanced initial torques on opposite sides of the bonded substrate pair, edge defects and wafer breakage are reduced.
    Type: Application
    Filed: June 5, 2017
    Publication date: May 31, 2018
    Inventors: Chang-Chen Tsao, Kuo Liang Lu, Ru-Liang Lee, Sheng-Hsiang Chuang, Yu-Hung Cheng, Yeur-Luen Tu, Cheng-Kang Hu
  • Publication number: 20170186632
    Abstract: Embodiments using immersion de-taping are described. A substrate having a substrate tape attached thereto is provided. The substrate includes electrically conductive connectors attached to the substrate tape. A fluid is provided between the substrate and the substrate tape. While the fluid is between the substrate and the substrate tape, the substrate tape is removed from the substrate. Another embodiment is an apparatus comprising an immersion tank, a substrate chuck, first and second fixed rollers, and a moveable roller. The substrate chuck is configured to secure a substrate and to place the substrate into the immersion tank. The first fixed roller is operable to dispense a clamp tape. The second fixed roller is operable to roll the clamp tape. The moveable roller is operable to extend into the immersion tank and to adhere the clamp tape to a substrate tape on the substrate.
    Type: Application
    Filed: March 12, 2017
    Publication date: June 29, 2017
    Inventors: Ching Tasi Liu, Fu-Chen Chang, Chien-Chen Li, Te Lung Liu, Kuo Liang Lu
  • Patent number: 9613845
    Abstract: Embodiments using immersion de-taping are described. A substrate having a substrate tape attached thereto is provided. The substrate includes electrically conductive connectors attached to the substrate tape. A fluid is provided between the substrate and the substrate tape. While the fluid is between the substrate and the substrate tape, the substrate tape is removed from the substrate. Another embodiment is an apparatus comprising an immersion tank, a substrate chuck, first and second fixed rollers, and a moveable roller. The substrate chuck is configured to secure a substrate and to place the substrate into the immersion tank. The first fixed roller is operable to dispense a clamp tape. The second fixed roller is operable to roll the clamp tape. The moveable roller is operable to extend into the immersion tank and to adhere the clamp tape to a substrate tape on the substrate.
    Type: Grant
    Filed: January 17, 2014
    Date of Patent: April 4, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching Tasi Liu, Fu-Chen Chang, Chien-Chen Li, Te Lung Liu, Kuo Liang Lu
  • Publication number: 20150206784
    Abstract: Embodiments using immersion de-taping are described. A substrate having a substrate tape attached thereto is provided. The substrate includes electrically conductive connectors attached to the substrate tape. A fluid is provided between the substrate and the substrate tape. While the fluid is between the substrate and the substrate tape, the substrate tape is removed from the substrate. Another embodiment is an apparatus comprising an immersion tank, a substrate chuck, first and second fixed rollers, and a moveable roller. The substrate chuck is configured to secure a substrate and to place the substrate into the immersion tank. The first fixed roller is operable to dispense a clamp tape. The second fixed roller is operable to roll the clamp tape. The moveable roller is operable to extend into the immersion tank and to adhere the clamp tape to a substrate tape on the substrate.
    Type: Application
    Filed: January 17, 2014
    Publication date: July 23, 2015
    Inventors: Ching Tasi Liu, Fu-Chen Chang, Chien-Chen Li, Te Lung Liu, Kuo Liang Lu
  • Patent number: 7730898
    Abstract: A novel semiconductor wafer lifter is disclosed for handling wafers during wet bench processing. In particular, the lifter has a plurality of holes formed in its vertical support surface to allow cleaning or rinsing fluid to flow through the vertical support instead of around its sides. These holes facilitates a constant flow of fluid across the wafer during recirculation of the tank contents during etching and rinsing operations, thus ensuring more even etching of all wafers and minimizing the deposition of particulate matter on wafer surfaces.
    Type: Grant
    Filed: March 1, 2005
    Date of Patent: June 8, 2010
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yang Cheng Hung, Kuo Liang Lu, Tseng Wen Song, Chen Peir Horng
  • Patent number: 7009772
    Abstract: A transmittance overcoat with effectively planar top surface and specified optical and materials properties is applied above a microlens layer to extend the focal length and enhance the performance of long focal length microlenses for semiconductor array color imaging devices. The geometrical optics design factors and microelectric fabrication sequence to achieve optimized long focal length microlens performance are disclosed. The principal advantages of the adaptive process taught in the present invention is shown to enable real-time compensation adjustments for process and material variations. The overcoat process enables simplified single-layer integrated microlens optics for low-cost, high volume manufacturing of CMOS and CCD color video cameras.
    Type: Grant
    Filed: October 4, 2004
    Date of Patent: March 7, 2006
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Kung Hsiao, Sheng-Liang Pan, Bii-Juno Chang, Kuo-Liang Lu
  • Patent number: 6926818
    Abstract: A method of forming a bump structure through the use of an electroplating solution, comprising the following steps. A substrate having an overlying conductive structure is provided. A patterned dry film resist is formed over the conductive structure. The patterned dry film resist having a trench exposing a portion of conductive structure. The patterned dry film resist adhering to the conductive structure at an interface. The structure is treated with a treatment that increases the adherence of the patterned dry film resist to the conductive structure at the interface. A conductive plug is over the exposed portion of the conductive structure within the trench through the use of the electroplating solution. The increased adhesion of the patterned dry film resist to the conductive structure at the interface preventing the electroplating solution from penetrating the interface of the patterned dry film resist and the conductive structure during the formation of the conductive plug.
    Type: Grant
    Filed: September 24, 2001
    Date of Patent: August 9, 2005
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yih-Ann Lin, Tung-Heng Shie, Kai-Ming Ching, Sheng-Liang Pan, Kuo-Liang Lu
  • Publication number: 20050158885
    Abstract: A method and system for preventing wafer breakage during wet processing is desscribed. A wet processing tank is provided wherein a wafer is to be placed within the wet processing tank. A sensor is provided within the wet processing tank wherein the sensor continuously counts bubbles formed within the wet processing tank in a time interval. The sensor is queried wherein if a bubble count within the time interval exceeds a trigger point, then an alarm is given so that a process lot will not be entered into the wet processing tank.
    Type: Application
    Filed: January 20, 2004
    Publication date: July 21, 2005
    Inventors: Wen-Song Tseng, Kuo-Liang Lu