Abstract: The application discloses a mobile communication device and method. The mobile communication method includes: when a collision between third party communication by a third party module and Wi-Fi communication by a Wi-Fi module is detected, determining a next Wi-Fi receiving gain; and adjusting a Wi-Fi receiving gain based on the calculated next Wi-Fi receiving gain to concurrently receive Wi-Fi signals and third party signals.

Abstract: A semiconductor structure and a method for fabricating the same are provided. The semiconductor structure includes a first chip, a second chip and a conductive structure. The first chip has an active side and an opposite side disposed opposite to each other. The second chip includes a chip bonding portion and an outer pad, and the outer pad is located outside the chip bonding portion. The first chip is disposed on the chip bonding portion of the second chip with the active side. The conductive structure is disposed on the outer pad, and the conductive structure includes a stack of a plurality of metal balls. The stack extends from the outer pad beyond the opposite side of the first chip.

Abstract: An injection molding equipment includes an injection molding machine, and a feeding machine mounted on the injection molding machine and configured to feed plastic granules into the same. The injection molding machine includes an injection device having an inner horizontal tubular surface that defines a horizontal channel and an inner vertical tubular surface that defines a vertical channel, and an extruder screw rotatably disposed in the horizontal channel and configured to heat and propel the plastic granules. The feeding machine includes a supply tube inserted into the vertical channel for supplying the plastic granules into the horizontal channel.

Abstract: A feeding apparatus is mounted to an injection molding apparatus defining an injecting space for receiving multiple pellets, and includes a feeding device defining a feeding space that has a delivering space portion and a feeding space portion spatially intercommunicating the delivering space portion and the injecting space, a supplying device defining a supplying space spatially communicating with the delivering space portion and being operable to allow or interrupt spatial communication with the supplying space and the delivering space portion, and an air suction device mounted to the feeding device and being operable to draw air from the injecting space and the feeding space. The pellets move from the supplying device into the injecting space.

Abstract: A fan-out wafer level package is provided. The fan-out wafer level package includes a semiconductor element, a molding compound, a first fan-out structure, a conductive heat spreader, and a plurality of solder balls. The semiconductor element includes a plurality of bonding pads. The molding compound covers the semiconductor element. The first fan-out structure is formed on the semiconductor element, wherein the first fan-out structure has a plurality of fan-out contacts electrically connected to the bonding pads. The conductive heat spreader is formed on the first fan-out structure, wherein the conductive heat spreader has a plurality of through holes filled with a conductive material. The solder balls are formed on the conductive heat spreader, wherein the solder balls are electrically connected to the first fan-out structure via the through holes filled with the conductive material.

Abstract: A fan-out wafer level package is provided. The fan-out wafer level package includes a semiconductor element, a molding compound, a first fan-out structure, a conductive heat spreader, and a plurality of solder balls. The semiconductor element includes a plurality of bonding pads. The molding compound covers the semiconductor element. The first fan-out structure is formed on the semiconductor element, wherein the first fan-out structure has a plurality of fan-out contacts electrically connected to the bonding pads. The conductive heat spreader is formed on the first fan-out structure, wherein the conductive heat spreader has a plurality of through holes filled with a conductive material. The solder balls are formed on the conductive heat spreader, wherein the solder balls are electrically connected to the first fan-out structure via the through holes filled with the conductive material.

Abstract: A chip package is disclosed. The chip package comprises a chip, a plurality of bond pads, a plurality of connecting lines and a rigid cover. The chip has a plurality of recesses arranged along at least an edge of the chip and also has an active surface and a backside. The bond pads are disposed on the active surface and the bond pads are arranged to be corresponding to the recesses respectively. The connecting lines are disposed on surfaces of the recesses respectively at the edge of the chip. For each of the connecting lines, a first end of the connecting line is connected to one of the bond pads and a second end of the connecting line extends to the backside to be a terminal pad. The rigid cover is located on the active surface without covering the bond pads on the active surface.

Abstract: A method for dicing a wafer including the following steps is provided. First, a carrier tape is attached to a first side of the wafer. Then, a patterned photoresist layer exposing a scribe line region of the wafer is formed on a second side of the wafer, in which the second side is the opposite side of the first side. After that, a cutting process is performed to the scribe line region from the second side of the wafer to the first side of the wafer through non-mechanical force.

Abstract: A chip packaging process includes providing a wafer, having an active surface and a backside. The wafer has a first chip area and a second chip area adjacent to the first chip area. The wafer has several first and second bond pads on the active surface in the first and second chip areas respectively. Several through holes are formed on the wafer. The through holes pass through the wafer and connect the active surface and the backside. The through. holes are arranged between the first chip area and the second chip area. Several connecting lines are formed on peripheral surfaces of the through holes. Each of the connecting lines has a first end portion extending on the active surface and a second portion extending on the backside. Each the first end portion is electrically connected to one of the first bond pads and one of the second bond pads.

Abstract: The chip package and the process thereof are disclosed. The chip package comprises a chip and a rigid cover. The chip has a plurality of bond pads formed thereon. The rigid cover is located on the chip and has a plurality of openings formed therein, wherein the openings expose the bond pads on the chip respectively.

Abstract: An integrated die bumping process includes providing a load board, defining a plurality of die regions on a surface of the load board for placing dice of a plurality of die specifications, affixing a plurality of dice respectively on the die regions according to the plurality of die specifications, and performing a die bumping process.

Abstract: A waterproof structure for switch pins includes a pin exposed outside a switch to be connected to an electric wire. The pin and the electric wire are covered by a waterproof insulation material through an injection forming process to become an integrated manner. The pin and electric wire are fully waterproof. The electric wire also can be fastened firmly to the pin to prevent separation of the two.