Abstract: A light sensing module and an electronic device using the same are provided. The light sensing module includes a substrate, a light sensing unit, a first light-transmissive component and a blocking wall. The light sensing unit is disposed on the substrate to sense an intensity of a working light beam. The first light-transmissive component covers the light sensing unit, and has a first refractive index that is between a refractive index of the light sensing unit and a refractive index of air. The blocking wall is disposed on the substrate, and surrounds the light sensing unit and the first light-transmissive component.

Abstract: An package structure includes a substrate, a pair of electrodes and a solder pad layer both electrically connected to each other and respectively disposed on two opposite surfaces of the substrate, a lighting diode arranged above the substrate and electrically connected to the pair of electrodes, a wall disposed on the substrate and arranged around the lighting diode, and a package compound disposed inside of the wall and covering the lighting diode. The package compound includes an attaching portion disposed on a top surface of the lighting diode, and a surrounding portion arranged around the attaching portion. The surrounding portion has an annular slot arranged on a top surface thereof. A bottom end of the annular slot is located at a position aligning with 25%˜90% of a thickness of the lighting diode along a height direction.

Abstract: A light-emitting diode (LED) package structure includes a substrate, an LED, a side wall, an encapsulant, and a waterproof protective coating. The LED is disposed on the substrate, the side wall defines a through hole and is disposed on the substrate, and the LED is accommodated in the through hole. The encapsulant is filled in the through hole and covers the LED. A heterojunction is disposed between the encapsulant and the side wall, and the waterproof protective coating seals the heterojunction. Furthermore, the encapsulant includes a first fluoropolymer, the waterproof protective coating includes a second fluoropolymer, and the light transmittance of the first fluoropolymer is greater than that of the second fluoropolymer.

Abstract: A light emitting structure includes a substrate, at least one light emitting chip disposed on the substrate and, a side wall disposed on the substrate and surrounding the at least one light emitting chip, a cover disposed on the side wall, an anti-reflective coating disposed on the cover, and a protective layer disposed on outside of the cover, wherein the cover, the side wall and the substrate define an enclosed space for accommodating the at least one light emitting chip.

Abstract: An LED package structure includes a ceramic substrate, a ceramic board, a light-emitting unit, a first adhesive layer, a second adhesive layer, and a cover. The ceramic board having a thru-hole is disposed on the ceramic substrate. The light-emitting unit is disposed on the ceramic substrate and is arranged in the thru-hole of the ceramic board. The first and second adhesive layers are disposed on the ceramic board, and the second adhesive layer covers the first adhesive layer. The cover is fixed on the ceramic board by the first and second adhesive layers. Thus, the shearing force of the LED package structure of the instant disclosure is increased by having the first and second adhesive layers, which are connected to each other.

Abstract: A manufacturing method of an LED package structure includes the steps as follows: providing an LED package structure assembly, which has a substrate layer, an LED chip set located on the substrate layer, and an encapsulating gel layer covering the LED chip set; taking a first blade to saw the LED package structure assembly from the encapsulating gel layer to the substrate layer until a plurality of sawing grooves are formed on the substrate layer; and taking a second blade to saw the LED package structure assembly along each sawing groove until the second blade passes through the substrate layer, thereby forming a plurality of LED package structures separated from each other. Wherein a hardness of the first blade is greater than that of the second blade, and a thickness of the second blade is less than that of the first blade.

Abstract: A light emitting package structure and a method of manufacturing the light emitting package structure are provided. The method includes: a preparation process: mounting a light emitting unit on a substrate; a dispensing process: coating a sealant on a first joint area of the substrate; a cover-enclosing process: disposing a cover element having a second joint area on the substrate, the first joint area and the second joint area joined to each other by the sealant; a vacuum process: reducing an ambient pressure to a first pressure lower than the original ambient pressure; a pressure-adjusting process: adjusting the ambient pressure around the package structure to a second pressure higher than the first pressure; and a curing process: curing the sealant.

Abstract: A light-emitting unit includes a substrate, an optical lens, and a light-emitting chip. The substrate has a surrounding groove and a retaining structure located in the surrounding groove. The optical lens is disposed on the substrate and has a concavity and an auxiliary retaining member, and the auxiliary retaining member has a retaining groove. The auxiliary retaining member is engaged in the surrounding groove, and the retaining structure is engaged in the retaining groove. The light-emitting chip is disposed on the substrate and located in the concavity. A reserved space is formed between the retaining structure and the retaining groove.

Abstract: A manufacturing method of an LED package structure includes the steps as follows: providing an LED package structure assembly, which has a substrate layer, an LED chip set located on the substrate layer, and an encapsulating gel layer covering the LED chip set; taking a first blade to saw the LED package structure assembly from the encapsulating gel layer to the substrate layer until a plurality of sawing grooves are formed on the substrate layer; and taking a second blade to saw the LED package structure assembly along each sawing groove until the second blade passes through the substrate layer, thereby forming a plurality of LED package structures separated from each other. Wherein a hardness of the first blade is greater than that of the second blade, and a thickness of the second blade is less than that of the first blade.

Abstract: A light emitting structure includes a substrate, a light emitting unit disposed on the substrate, an annular wall, a first bonding layer adhering to the annular wall and the substrate, and a compound body. The light emitting unit is arranged inside of the annular wall. The annular wall, the first bonding layer, and the first surface surroundingly define a gap. The compound body is arranged in a space defined by the annular wall, and includes a reinforcing portion filled in the gap so as to connect the annular wall, the first bonding layer, and the substrate.

Abstract: A manufacturing method of an LED package structure includes the steps as follows: providing an LED package structure assembly, which has a substrate layer, an LED chip set located on the substrate layer, and an encapsulating gel layer covering the LED chip set; taking a first blade to saw the LED package structure assembly from the encapsulating gel layer to the substrate layer until a plurality of sawing grooves are formed on the substrate layer; and taking a second blade to saw the LED package structure assembly along each sawing groove until the second blade passes through the substrate layer, thereby forming a plurality of LED package structures separated from each other. Wherein a hardness of the first blade is greater than that of the second blade, and a thickness of the second blade is less than that of the first blade.

Abstract: An LED package structure includes a carrier mounted with a plurality of LED chips, a first glue-layer, a second glue-layer and an encapsulation resin filled within the first and the second glue-layers. The first glue-layer is formed on a top surface of the carrier and has a thin-film structure which is substantially flat on a top surface thereof. The second glue-layer is stacked on the first glue-layer. The second glue-layer has a height higher than that of the first glue-layer. The second glue-layer has a volume greater than that of the first glue-layer. The present invention also provides a method of LED package structure to stably produce a dam structure with uniform shape and high ratio of height/width.

Abstract: A UV light-emitting unit includes a carrier, a UV LED chip, a side lens, and a water-resistant layer. The UV LED chip is disposed on the carrier, and the UV LED chip has a top surface and a surrounding side surface arranged adjacent to the top surface. The top surface has a center region and an external region arranged around the center region and connected to the surrounding side surface. The side lens is disposed on the carrier. The surrounding side surface of the UV LED chip is covered by the side lens. The water-resistant layer covers an outer surface of the side lens and the external region of the top surface of the UV LED chip. In addition, the present disclosure also discloses a UV LED package structure and a method for manufacturing a UV light-emitting unit.

Abstract: An package structure includes a substrate, a pair of electrodes and a solder pad layer both electrically connected to each other and respectively disposed on two opposite surfaces of the substrate, a lighting diode arranged above the substrate and electrically connected to the pair of electrodes, a wall disposed on the substrate and arranged around the lighting diode, and a package compound disposed inside of the wall and covering the lighting diode. The package compound includes an attaching portion disposed on a top surface of the lighting diode, and a surrounding portion arranged around the attaching portion. The surrounding portion has an annular slot arranged on a top surface thereof. A bottom end of the annular slot is located at a position aligning with 25%˜90% of a thickness of the lighting diode along a height direction.

Abstract: A UV light-emitting unit includes a carrier, a UV LED chip, a side lens, and a water-resistant layer. The UV LED chip is disposed on the carrier, and the UV LED chip has a top surface and a surrounding side surface arranged adjacent to the top surface. The top surface has a center region and an external region arranged around the center region and connected to the surrounding side surface. The side lens is disposed on the carrier. The surrounding side surface of the UV LED chip is covered by the side lens. The water-resistant layer covers an outer surface of the side lens and the external region of the top surface of the UV LED chip. In addition, the present disclosure also discloses a UV LED package structure and a method for manufacturing a UV light-emitting unit.

Abstract: An LED package structure includes a ceramic substrate, a ceramic board, a light-emitting unit, a first adhesive layer, a second adhesive layer, and a cover. The ceramic board having a thru-hole is disposed on the ceramic substrate. The light-emitting unit is disposed on the ceramic substrate and is arranged in the thru-hole of the ceramic board. The first and second adhesive layers are disposed on the ceramic board, and the second adhesive layer covers the first adhesive layer. The cover is fixed on the ceramic board by the first and second adhesive layers. Thus, the shearing force of the LED package structure of the instant disclosure is increased by having the first and second adhesive layers, which are connected to each other.

Abstract: An LED package structure includes a ceramic substrate, a ceramic board, a light-emitting unit, a first adhesive layer, a second adhesive layer, and a cover. The ceramic board having a thru-hole is disposed on the ceramic substrate. The light-emitting unit is disposed on the ceramic substrate and is arranged in the thru-hole of the ceramic board. The first and second adhesive layers are disposed on the ceramic board, and the second adhesive layer covers the first adhesive layer. The cover is fixed on the ceramic board by the first and second adhesive layers. Thus, the shearing force of the LED package structure of the instant disclosure is increased by having the first and second adhesive layers, which are connected to each other.

Abstract: A lens of an LED package structure includes a square-shaped base layer, a first light-guiding portion integrally connected to the base layer, a second light-guiding portion taperedly extended from the first light-guiding portion. The second light-guiding portion has an apex located away from the first light-guiding portion. The lens includes four side curved surfaces and four boundary curved surfaces connected to the apex. Four first projecting regions are defined by orthogonally projecting the four boundary curved surfaces onto the base layer, and the four first projecting regions are arranged on two diagonals of the base layer. Any two adjacent boundary curved surfaces are provided with one of the side curved surfaces there-between. Each boundary curved surface has a first radius of curvature (R1), a portion of each side curved surface arranged on the second light-guiding portion has a second radius of curvature (R2), wherein R1/R2=M?{square root over (2)} and M=0.8˜1.2.

Abstract: A light-emitting display device includes a substrate, several light emitting units for emitting light with different wavelengths, and an optical lens. The substrate has at least one receiver for containing these light emitting units. A light guide structure of the light-emitting display device can be the receiver with a specific designed, a frame body with at least one corresponding through hole formed on the corresponding receiver, or at least one optical element formed on the corresponding receiver, so as the light emitted by the light emitting units can be reflected towards the preset optical axis. And the optical lens is formed on the light guide structure as medium for mixing lights of different wavelengths for achieving a uniform lighting effect.

Abstract: A lens of an LED package structure includes a square-shaped base layer, a first light-guiding portion integrally connected to the base layer, a second light-guiding portion taperedly extended from the first light-guiding portion. The second light-guiding portion has an apex located away from the first light-guiding portion. The lens includes four side curved surfaces and four boundary curved surfaces connected to the apex. Four first projecting regions are defined by orthogonally projecting the four boundary curved surfaces onto the base layer, and the four first projecting regions are arranged on two diagonals of the base layer. Any two adjacent boundary curved surfaces are provided with one of the side curved surfaces there-between. Each boundary curved surface has a first radius of curvature (R1), a portion of each side curved surface arranged on the second light-guiding portion has a second radius of curvature (R2), wherein R1/R2=M?{square root over ( )}2 and M=0.8˜1.2.