Abstract: An apparatus for transferring an electronic component is configured to transfer an electronic component on a flexible carrier to a target substrate. The apparatus includes a first frame, a second frame, an abutment module, an actuator, and a negative pressure generating device. The abutment module includes an abutting component and a guide. The guide guides a movement of the abutting component. The actuator actuates the abutment module so that the abutting component and the guide are respectively moved between a start position and an end position of an abutment path. The negative pressure generating device is pumped through the abutment module. When the abutment module abuts against the flexible carrier, a negative pressure is generated between the abutment module and the flexible carrier by the negative pressure generating device. The abutting component and the guide are moved simultaneously in at least a portion of the abutment path.

Abstract: A face mask structure and a method of manufacturing the same are provided. The face mask structure includes a main structure layer and an elastic structure layer. The elastic structure layer is disposed on a surface layer of the main structure layer so as to fully cover the surface layer. The elastic structure layer includes an elastic ear strap layer partially separatably disposed on the surface layer of the main structure layer, the elastic ear strap layer includes two elastic ear strap portions separatably connected with each other through a tear-off line. Each of the two elastic ear strap portions has two opposite ends separated from each other. After the two elastic ear strap portions are separated from each other by ripping or tearing along the tear-off line, two ears of a user can respectively wear the two elastic ear strap portions when using the face mask structure.