Abstract: A computing device obtains a media stream from a server, where the media stream obtained from the server corresponds to live streaming of an event for promoting a product. The computing device receives product information from the server and displays the media stream in a first viewing window. The media stream is monitored for at least one trigger condition, and based on monitoring of the media stream, the computing device determines at least a portion of the product information to be displayed in a second viewing window.

Abstract: A thermal module assembling structure includes a heat dissipation board and at least one heat pipe. The heat dissipation board has a receiving channel for fitting the heat pipe therethrough. Two sides of upper side of the receiving channel are respectively formed with two ribs. The ribs horizontally protrude and extend toward the middle of the receiving channel to face the heat pipe fitted in the receiving channel. At least one deformed recess is formed on an upper surface of each of the ribs, whereby the lower surfaces of the ribs and a surface of the heat pipe are deformed to form at least one deformed connection section between the lower surfaces of the ribs and the surface of the heat pipe. By means of the restriction of the deformed connection section, the heat pipe is prevented from being extracted out of the receiving channel.

Abstract: A thermal module assembling structure includes a base seat and a heat pipe. The base seat is formed with a channel and at least one hole recessed and formed on one side of the base seat in adjacency to the channel. The channel has at least one protrusion section corresponding to the hole. One end of the heat pipe is received in the channel. The heat pipe has at least one insertion recess. The protrusion section is tightly fitted and inserted in the corresponding insertion recess of the heat pipe.

Abstract: A manufacturing method of thermal module assembling structure includes a step of making a heat pipe received in a channel of a base seat tightly fitted and inserted in the channel by means of mechanical processing so as to integrally connect the base seat with the heat pipe. The manufacturing method of thermal module assembling structure is able to effectively enhance the connection strength between the base seat and the heat pipe.

Abstract: A heat sink structure and a manufacturing method thereof. The heat sink includes a main body having multiple main body connection sections and multiple radiating fins each having a connection section. The main body has a first end and a second end. The first and second ends define a longitudinal direction. The multiple radiating fins are placed in a mold. A mechanical processing measure is used to high-speed impact the main body so as to thrust the main body into the mold. Accordingly, the connection sections of the radiating fins placed in the mold are high-speed thrust into the main body connection sections and moved in the longitudinal direction to the second end of the main body to tightly integrally connect with the main body.

Abstract: A mold for molding a case of a mobile device includes a first, second, third, fourth and fifth main body, connection slide blocks, and first and second abutment slide blocks. The connection slide blocks and the second abutment slide blocks are inlaid in first and second slide channels of the first and second main bodies. The first abutment slide blocks are inlaid in channels of the connection slide blocks. The third, fourth and fifth main bodies are horizontally movable relative to the first and second main bodies. The first and second main bodies, the connection slide blocks and the first and second abutment slide blocks together define a male mold section and the third, fourth and fifth main bodies together define a female mold section. A metal thin sheet is placed on the male mold section and pressurized and molded by the female mold section to form the case.

Abstract: A heat sink structure and a manufacturing method thereof. The heat sink includes a main body and multiple radiating fins each having a folded root section. The main body has multiple connection channels formed on a circumference of the main body. The multiple radiating fins are placed in a mold. A mechanical processing measure is used to high-speed impact the main body so as to thrust the main body into the mold. Accordingly, the folded root sections of the radiating fins are relatively high-speed thrust into the connection channels of the main body to tightly integrally connect with the main body.

Abstract: A manufacturing method of thermal module assembling structure includes a step of making a heat pipe received in a channel of a base seat tightly fitted and inserted in the channel by means of mechanical processing so as to integrally connect the base seat with the heat pipe. The manufacturing method of thermal module assembling structure is able to effectively enhance the connection strength between the base seat and the heat pipe.

Abstract: A thermal module assembling structure includes a base seat and a heat pipe. The base seat is formed with a channel and at least one hole recessed and formed on one side of the base seat in adjacency to the channel. The channel has at least one protrusion section corresponding to the hole. One end of the heat pipe is received in the channel. The heat pipe has at least one insertion recess. The protrusion section is tightly fitted and inserted in the corresponding insertion recess of the heat pipe.

Abstract: A heat sink structure and a manufacturing method thereof. The heat sink includes a main body having multiple main body connection sections and multiple radiating fins each having a connection section. The main body has a first end and a second end. The first and second ends define a longitudinal direction. The multiple radiating fins are placed in a mold. A mechanical processing measure is used to high-speed impact the main body so as to thrust the main body into the mold. Accordingly, the connection sections of the radiating fins placed in the mold are high-speed thrust into the main body connection sections and moved in the longitudinal direction to the second end of the main body to tightly integrally connect with the main body.

Abstract: A thermal module with enhanced assembling structure includes a base and a heat pipe. The base is formed on a middle portion with a longitudinal receiving recess, which has two end portions forming two supporting portions and a middle portion formed into an opening. A first and a second extended arm are formed at junctions between the receiving recess and two longitudinal sides of the opening. Wall surfaces of the first and second extended arms adjacent to the longitudinal sides of the opening are formed with alternating elevated and sunken areas. The heat pipe is held down in the receiving recess by the first and second extended arms to fitly engage with the elevated and sunken areas. Therefore, there is an increased fitting tightness between the heat pipe and the base to ensure enhanced assembling strength of the thermal module and reduce the manufacturing cost thereof.

Abstract: A heat sink structure and a method of manufacturing same are disclosed. The heat sink structure includes a main body and a plurality of radiating fins. The main body has a plurality of coupling flutes circumferentially spaced along an outer surface thereof and longitudinally extended from a first end to a second thereof. The radiating fins respectively have a bent section integrally located between a first and a second heat radiating section. To quickly assemble the radiating fins to the main body, the radiating fins are disposed in a forming mold, and the main body is mechanically driven into the forming mold at a high speed, so that the bent sections of the radiating fins are longitudinally forced into the coupling flutes from the first to the second end of the main body to thereby tightly connect the radiating fins to the main body.

Abstract: A mold for molding a case of a mobile device includes a first, second, third, fourth and fifth main body, connection slide blocks, and first and second abutment slide blocks. The connection slide blocks and the second abutment slide blocks are inlaid in first and second slide channels of the first and second main bodies. The first abutment slide blocks are inlaid in channels of the connection slide blocks. The third, fourth and fifth main bodies are horizontally movable relative to the first and second main bodies. The first and second main bodies, the connection slide blocks and the first and second abutment slide blocks together define a male mold section and the third, fourth and fifth main bodies together define a female mold section. A metal thin sheet is placed on the male mold section and pressurized and molded by the female mold section to form the case.

Abstract: The present invention relates to a heat-dissipating device and a method for manufacturing the same. The heat-dissipating device includes a base and a first heat-dissipating fin. The outer periphery of the base has a trough. The first heat-dissipating fin has a first heat-dissipating portion, a first end and a second end. The first end and the second end are disposed in the trough. By a machining process, both ends of the first heat-dissipating fin are pressed into the trough of the base at a high speed, so that the base can be combined with the first heat-dissipating fin rapidly. In this way, the manufacture cost is reduced and the heat-dissipating efficiency is increased.

Abstract: A mold for molding a case of a mobile device includes a first, second, third, fourth and fifth main body, connection slide blocks, and first and second abutment slide blocks. The connection slide blocks and the second abutment slide blocks are inlaid in first and second slide channels of the first and second main bodies. The first abutment slide blocks are inlaid in channels of the connection slide blocks. The third, fourth and fifth main bodies are horizontally movable relative to the first and second main bodies. The first and second main bodies, the connection slide blocks and the first and second abutment slide blocks together define a male mold section and the third, fourth and fifth main bodies together define a female mold section. A metal thin sheet is placed on the male mold section and pressurized and molded by the female mold section to form the case.

Abstract: A mold for molding a case of a mobile device includes a first, second, third, fourth and fifth main body, connection slide blocks, and first and second abutment slide blocks. The connection slide blocks and the second abutment slide blocks are inlaid in first and second slide channels of the first and second main bodies. The first abutment slide blocks are inlaid in channels of the connection slide blocks. The third, fourth and fifth main bodies are horizontally movable relative to the first and second main bodies. The first and second main bodies, the connection slide blocks and the first and second abutment slide blocks together define a male mold section and the third, fourth and fifth main bodies together define a female mold section. A metal thin sheet is placed on the male mold section and pressurized and molded by the female mold section to form the case.

Abstract: The present invention provides a heat-dissipating device including a heat sink and a heat pipe. The heat sink has an end surface provided with a trough. The trough has an open side and a closed side. The heat pipe has a heat-absorbing surface and a heat-conducting surface corresponding to the open side and the closed side respectively. The heat-conducting surface and the heat-absorbing surface are not brought into contact with the heat sink. The heat is directly absorbed by the heat pipe and then conducted to the heat sink for dissipation. With this arrangement, heat resistance of the heat-dissipating device is reduced to improve the heat-dissipating effect thereof.

Abstract: A thermal module with enhanced assembling structure includes a base and a heat pipe. The base is formed on a middle portion with a longitudinal receiving recess, which has two end portions forming two supporting portions and a middle portion formed into an opening. A first and a second extended arm are formed at junctions between the receiving recess and two longitudinal sides of the opening. Wall surfaces of the first and second extended arms adjacent to the longitudinal sides of the opening are formed with alternating elevated and sunken areas. The heat pipe is held down in the receiving recess by the first and second extended arms to fitly engage with the elevated and sunken areas. Therefore, there is an increased fitting tightness between the heat pipe and the base to ensure enhanced assembling strength of the thermal module and reduce the manufacturing cost thereof.

Abstract: A method of assembling thermal module includes steps of providing a first heat dissipation member and a second heat dissipation member, and aiming a section of the first heat dissipation member at a section of the second heat dissipation member, which section of the first heat dissipation member is to be assembled with the section of the second heat dissipation member and driving the first heat dissipation member to connect with the second heat dissipation member by means of striking the first heat dissipation member into the second heat dissipation member. By means of the method, the thermal module can be assembled at higher efficiency. Moreover, the manufacturing process of the thermal module is simplified.

Abstract: The present invention relates to a heat-dissipating device and a method for manufacturing the same. The heat-dissipating device includes a base and a first heat-dissipating fin. The outer periphery of the base has a trough. The first heat-dissipating fin has a first heat-dissipating portion, a first end and a second end. The first end and the second end are disposed in the trough. By a machining process, both ends of the first heat-dissipating fin are pressed into the trough of the base at a high speed, so that the base can be combined with the first heat-dissipating fin rapidly. In this way, the manufacture cost is reduced and the heat-dissipating efficiency is increased.