Patents by Inventor Kuo-Sheng Lin

Kuo-Sheng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150258643
    Abstract: A thermal module with enhanced assembling structure includes a base and a heat pipe. The base is formed on a middle portion with a longitudinal receiving recess, which has two end portions forming two supporting portions and a middle portion formed into an opening. A first and a second extended arm are formed at junctions between the receiving recess and two longitudinal sides of the opening. Wall surfaces of the first and second extended arms adjacent to the longitudinal sides of the opening are formed with alternating elevated and sunken areas. The heat pipe is held down in the receiving recess by the first and second extended arms to fitly engage with the elevated and sunken areas. Therefore, there is an increased fitting tightness between the heat pipe and the base to ensure enhanced assembling strength of the thermal module and reduce the manufacturing cost thereof.
    Type: Application
    Filed: March 11, 2014
    Publication date: September 17, 2015
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sheng-Huang Lin, Kuo-Sheng Lin
  • Publication number: 20150260462
    Abstract: A thermal module with enhanced assembling structure includes a base and a heat pipe. The base is formed on a middle portion with a longitudinal receiving recess, which has two end portions forming two supporting portions and a middle portion formed into an opening. A first and a second extended arm are formed at junctions between the receiving recess and two longitudinal sides of the opening. Wall surfaces of the first and second extended arms adjacent to the longitudinal sides of the opening are formed with alternating elevated and sunken areas. The heat pipe is held down in the receiving recess by the first and second extended arms to fitly engage with the elevated and sunken areas. Therefore, there is an increased fitting tightness between the heat pipe and the base to ensure enhanced assembling strength of the thermal module and reduce the manufacturing cost thereof.
    Type: Application
    Filed: March 11, 2014
    Publication date: September 17, 2015
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sheng-Huang Lin, Kuo-Sheng Lin
  • Publication number: 20150233646
    Abstract: A thermal module assembling structure includes a heat dissipation board and at least one heat pipe. The heat dissipation board has a receiving channel for fitting the heat pipe therethrough. Two sides of upper side of the receiving channel are respectively formed with two ribs. The ribs horizontally protrude and extend toward the middle of the receiving channel to face the heat pipe fitted in the receiving channel. At least one deformed recess is formed on an upper surface of each of the ribs, whereby the lower surfaces of the ribs and a surface of the heat pipe are deformed to form at least one deformed connection section between the lower surfaces of the ribs and the surface of the heat pipe. By means of the restriction of the deformed connection section, the heat pipe is prevented from being extracted out of the receiving channel.
    Type: Application
    Filed: February 19, 2014
    Publication date: August 20, 2015
    Applicant: Asia Vital Components Co., Ltd.
    Inventors: Sheng-Huang Lin, Kuo-Sheng Lin
  • Publication number: 20150209917
    Abstract: A heat sink structure and a manufacturing method thereof. The heat sink includes a main body having multiple main body connection sections and multiple radiating fins each having a connection section. The main body has a first end and a second end. The first and second ends define a longitudinal direction. The multiple radiating fins are placed in a mold. A mechanical processing measure is used to high-speed impact the main body so as to thrust the main body into the mold. Accordingly, the connection sections of the radiating fins placed in the mold are high-speed thrust into the main body connection sections and moved in the longitudinal direction to the second end of the main body to tightly integrally connect with the main body.
    Type: Application
    Filed: April 2, 2015
    Publication date: July 30, 2015
    Inventors: Sheng-Huang Lin, Kuo-Sheng Lin
  • Publication number: 20150184948
    Abstract: A structure for holding a heat pipe to a base includes a base and a heat pipe. The base has a first side and an opposite second side, and is formed at a middle portion with a receiving recess, such that two sidewalls are raised from two lateral sides of the receiving recess. Each of the sidewalls has at least one projected section formed using a part material of the base, such that portions of the base adjacent to the projected sections respectively form an opening. The heat pipe is laid in the receiving recess and has a top and a bottom surface. The projected sections are bent to flatly press against the top surface of the heat pipe to firmly hold the heat pipe to the base. Since the projected sections are formed using a part material of the base, the holding structure is manufactured at largely reduced cost.
    Type: Application
    Filed: December 31, 2013
    Publication date: July 2, 2015
    Applicant: Asia Vital Components Co., Ltd.
    Inventors: Sheng-Huang Lin, Kuo-Sheng Lin
  • Publication number: 20150052731
    Abstract: A heat sink structure and a method of manufacturing same are disclosed. The heat sink structure includes a main body and a plurality of radiating fins. The main body has a plurality of coupling flutes circumferentially spaced along an outer surface thereof and longitudinally extended from a first end to a second thereof. The radiating fins respectively have a bent section integrally located between a first and a second heat radiating section. To quickly assemble the radiating fins to the main body, the radiating fins are disposed in a forming mold, and the main body is mechanically driven into the forming mold at a high speed, so that the bent sections of the radiating fins are longitudinally forced into the coupling flutes from the first to the second end of the main body to thereby tightly connect the radiating fins to the main body.
    Type: Application
    Filed: October 30, 2014
    Publication date: February 26, 2015
    Inventors: Sheng-Huang Lin, Kuo-Sheng Lin
  • Publication number: 20150052755
    Abstract: The present invention relates to a heat-dissipating device and a method for manufacturing the same. The heat-dissipating device includes a base and a first heat-dissipating fin. The outer periphery of the base has a trough. The first heat-dissipating fin has a first heat-dissipating portion, a first end and a second end. The first end and the second end are disposed in the trough. By a machining process, both ends of the first heat-dissipating fin are pressed into the trough of the base at a high speed, so that the base can be combined with the first heat-dissipating fin rapidly. In this way, the manufacture cost is reduced and the heat-dissipating efficiency is increased.
    Type: Application
    Filed: October 30, 2014
    Publication date: February 26, 2015
    Inventors: Sheng-Huang Lin, Kuo-Sheng Lin
  • Publication number: 20140352150
    Abstract: A heat sink structure and a manufacturing method thereof. The heat sink includes a main body and multiple radiating fins each having a folded root section. The main body has multiple connection channels formed on a circumference of the main body. The multiple radiating fins are placed in a mold. A mechanical processing measure is used to high-speed impact the main body so as to thrust the main body into the mold. Accordingly, the folded root sections of the radiating fins are relatively high-speed thrust into the connection channels of the main body to tightly integrally connect with the main body.
    Type: Application
    Filed: August 14, 2014
    Publication date: December 4, 2014
    Inventors: Sheng-Huang Lin, Kuo-Sheng Lin
  • Publication number: 20140090795
    Abstract: An LED heat sink and a manufacturing method thereof are disclosed. The LED heat sink includes a main body having a heat receiving section and an extended heat transfer section. The heat transfer section is externally provided with a plurality of receiving grooves for correspondingly connecting with a plurality of radiating fins. The LED heat sink manufacturing method includes the steps of molding a main body using a half-molten metal material and cooling the main body, so that the cooled main body is connected with a plurality of radiating fins to form an integral unit. With the LED heat sink manufacturing method, it is able to manufacture an LED heat sink having a relatively complicated radiating fin structure or being formed of two or more types of materials, and to largely reduce the time, labor and material costs of the LED heat sink.
    Type: Application
    Filed: November 26, 2013
    Publication date: April 3, 2014
    Applicant: Asia Vital Components Co., Ltd.
    Inventors: Sheng-Huang Lin, Kuo-Sheng Lin
  • Publication number: 20140059858
    Abstract: The present invention provides a heat-dissipating device and a method for manufacturing the same. The heat-dissipating device includes a heat sink and a heat pipe. The heat sink has an end surface provided with a groove. The heat pipe is received in the groove. The heat pipe has a heat-absorbing surface and a heat-conducting surface. The heat-conducting surface is adhered to the inner edge of the groove. The heat-absorbing surface is in flush with the end surface. With this arrangement, heat resistance of the heat-dissipating device is reduced to improve the heat-dissipating effect thereof.
    Type: Application
    Filed: November 5, 2013
    Publication date: March 6, 2014
    Applicant: Asia Vital Components Co., Ltd.
    Inventors: Kuo-Sheng Lin, Li-Min Sun, Ching-Hsiang Cheng
  • Publication number: 20140034277
    Abstract: A heat sink structure and a method of manufacturing same are disclosed. The heat sink structure includes a main body and a plurality of radiating fins. The main body has a plurality of coupling flutes circumferentially spaced along an outer surface thereof and longitudinally extended from a first end to a second thereof. The radiating fins respectively have a bent section integrally located between a first and a second heat radiating section. To quickly assemble the radiating fins to the main body, the radiating fins are disposed in a forming mold, and the main body is mechanically driven into the forming mold at a high speed, so that the bent sections of the radiating fins are longitudinally forced into the coupling flutes from the first to the second end of the main body to thereby tightly connect the radiating fins to the main body.
    Type: Application
    Filed: September 11, 2012
    Publication date: February 6, 2014
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sheng-Huang Lin, Kuo-Sheng Lin
  • Publication number: 20140034278
    Abstract: A heat sink structure and a manufacturing method thereof. The heat sink includes a main body having multiple main body connection sections and multiple radiating fins each having a connection section. The main body has a first end and a second end. The first and second ends define a longitudinal direction. The multiple radiating fins are placed in a mold. A mechanical processing measure is used to high-speed impact the main body so as to thrust the main body into the mold. Accordingly, the connection sections of the radiating fins placed in the mold are high-speed thrust into the main body connection sections and moved in the longitudinal direction to the second end of the main body to tightly integrally connect with the main body.
    Type: Application
    Filed: September 11, 2012
    Publication date: February 6, 2014
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sheng-Huang Lin, Kuo-Sheng Lin
  • Publication number: 20140034279
    Abstract: A heat sink structure and a manufacturing method thereof. The heat sink includes a main body and multiple radiating fins each having a folded root section. The main body has multiple connection channels formed on a circumference of the main body. The multiple radiating fins are placed in a mold. A mechanical processing measure is used to high-speed impact the main body so as to thrust the main body into the mold. Accordingly, the folded root sections of the radiating fins are relatively high-speed thrust into the connection channels of the main body to tightly integrally connect with the main body.
    Type: Application
    Filed: September 11, 2012
    Publication date: February 6, 2014
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sheng-Huang Lin, Kuo-Sheng Lin
  • Publication number: 20140034280
    Abstract: The present invention relates to a heat-dissipating device and a method for manufacturing the same. The heat-dissipating device includes a base and a first heat-dissipating fin. The outer periphery of the base has a trough. The first heat-dissipating fin has a first heat-dissipating portion, a first end and a second end. The first end and the second end are disposed in the trough. By a machining process, both ends of the first heat-dissipating fin are pressed into the trough of the base at a high speed, so that the base can be combined with the first heat-dissipating fin rapidly. In this way, the manufacture cost is reduced and the heat-dissipating efficiency is increased.
    Type: Application
    Filed: September 11, 2012
    Publication date: February 6, 2014
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sheng-Huang Lin, Kuo-Sheng Lin
  • Publication number: 20140026417
    Abstract: A method of assembling thermal module includes steps of providing a first heat dissipation member and a second heat dissipation member, and aiming a section of the first heat dissipation member at a section of the second heat dissipation member, which section of the first heat dissipation member is to be assembled with the section of the second heat dissipation member and driving the first heat dissipation member to connect with the second heat dissipation member by means of striking the first heat dissipation member into the second heat dissipation member. By means of the method, the thermal module can be assembled at higher efficiency. Moreover, the manufacturing process of the thermal module is simplified.
    Type: Application
    Filed: July 27, 2012
    Publication date: January 30, 2014
    Inventors: Sheng-Huang Lin, Kuo-Sheng Lin
  • Patent number: 8625057
    Abstract: A color filter substrate for multi-view displaying including a substrate, a light shielding-layer, and a color filter layer is provided. The substrate has a first surface, a second surface, and a plurality of concaves. The first surface is opposite to the second surface. The concaves are located at the first surface. The light-shielding layer disposed on the first surface of the substrate defines a plurality of light-transparent openings. The color filter layer has a plurality of sub-pixel areas including at least one first sub-pixel area and at least one second sub-pixel area. A first light is transmitted to a first viewer by passing through one of the light-transparent openings and one of the at least one first sub-pixel area, and simultaneously, a second light is transmitted to a second viewer by passing through the same one of the light-transparent openings and one of the at least one second sub-pixel area.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: January 7, 2014
    Assignee: Chimei Innolux Corporation
    Inventors: Chien-Chih Huang, Kuo-Sheng Lin, Cheng-Jen Chu
  • Patent number: 8607849
    Abstract: A heat radiating fin includes a flat body having a front side and a rear side, a plurality of protruded portions formed on the front side of the flat body, and a plurality of recessed portions correspondingly formed on the rear side of the flat body behind the protruded portions. The protruded portions on the flat body of a first heat radiating fin are partially extendable into corresponding recessed portions on the flat body of a second heat radiating fin located before the first one, allowing the first and the second heat radiating fins to be easily and stably stacked.
    Type: Grant
    Filed: February 2, 2012
    Date of Patent: December 17, 2013
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Kuo-Sheng Lin
  • Publication number: 20120314427
    Abstract: The present invention relates to a LED heat sink and a method for manufacturing the same. According to the inventive method, ends of heat-dissipating fins are melted and combined with heat-conducting body by point discharge, thereby forming the LED heat sink. The LED heat sink includes the heat-conducting body and the heat-dissipating fins. The heat-conducting body has a heated portion and a heat-conducting portion. The heat-conducting portion is connected to the heat-dissipating fins. By this method, a heat sink of a complicated structure can be manufactured with multiple materials. Further, the working hours and production cost are reduced greatly.
    Type: Application
    Filed: June 8, 2011
    Publication date: December 13, 2012
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sheng-Huang Lin, Kuo-Sheng Lin
  • Publication number: 20120261105
    Abstract: An LED heat sink and a manufacturing method thereof are disclosed. The LED heat sink includes a main body having a heat receiving section and an extended heat transfer section. The heat transfer section is externally provided with a plurality of receiving grooves for correspondingly connecting with a plurality of radiating fins. The LED heat sink manufacturing method includes the steps of molding a main body using a half-molten metal material and cooling the main body, so that the cooled main body is connected with a plurality of radiating fins to form an integral unit. With the LED heat sink manufacturing method, it is able to manufacture an LED heat sink having a relatively complicated radiating fin structure or being formed of two or more types of materials, and to largely reduce the time, labor and material costs of the LED heat sink.
    Type: Application
    Filed: April 12, 2011
    Publication date: October 18, 2012
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sheng-Huang Lin, Kuo-Sheng Lin
  • Publication number: 20120125591
    Abstract: A heat radiating fin includes a flat body having a front side and a rear side, a plurality of protruded portions formed on the front side of the flat body, and a plurality of recessed portions correspondingly formed on the rear side of the flat body behind the protruded portions. The protruded portions on the flat body of a first heat radiating fin are partially extendable into corresponding recessed portions on the flat body of a second heat radiating fin located before the first one, allowing the first and the second heat radiating fins to be easily and stably stacked.
    Type: Application
    Filed: February 2, 2012
    Publication date: May 24, 2012
    Applicant: Asia Vital Components Co., Ltd.
    Inventor: Kuo-Sheng Lin