Abstract: A power generation device includes a housing, chambers, and conductive fillers. The housing has a rotation axis. The chambers surround the rotation axis and located inside the housing. The conductive fillers respectively filled in the chambers. The chambers include electrodes. The electrodes are located on the chambers and in contact with the conductive fillers.

Abstract: An electrical stimulation device is provided. The electrical stimulation device includes a boost circuit, a voltage selecting circuit and a control circuit. The boost circuit generates a plurality of voltages, wherein the voltages have different voltage values. The voltage selecting circuit is coupled to the boost circuit and selects one voltage according to a reference voltage on a tissue impedance to generate an output voltage. The control circuit is coupled to the boost circuit and in response to electrical stimulation; it transmits a control signal to enable the boost circuit.

Abstract: A signal sensing module includes a substrate, a sensing electrode, a piezoresistive material layer and a sensing circuit. The substrate has a surface. The sensing electrode is disposed on the substrate and is exposed from the surface. The piezoresistive material layer is formed on the surface and covers the sensing electrode. The piezoresistive material layer has a resistance value. The sensing circuit is disposed in the substrate and adapted to sense a change of resistance value when a pressure wave passes through the piezoresistive material layer.

Abstract: A signal sensing module includes a substrate, a sensing electrode, a piezoresistive material layer and a sensing circuit. The substrate has a surface. The sensing electrode is disposed on the substrate and is exposed from the surface. The piezoresistive material layer is formed on the surface and covers the sensing electrode. The piezoresistive material layer has a resistance value. The sensing circuit is disposed in the substrate and adapted to sense a change of resistance value when a pressure wave passes through the piezoresistive material layer.

Abstract: This disclosure provides a device for heating to generate a uniform molten pool, including: a source unit for generating an energy beam; a beam expanding/reducing unit positioned in an energy path of the energy beam for adjusting the diameter of the energy beam; a flat-top conical lens set positioned in the energy path and including at least two flat-top axicons, with the beam expanding/reducing unit positioned between the source unit and the flat-top conical lens set; and a focusing lens positioned in the energy path, with the flat-top conical lens set between the beam expanding/reducing unit and the focusing lens, and the energy beam being focused by the focusing lens. This disclosure generates a uniform molten pool to prevent vaporization splash due to overheating of the material during melting.

Abstract: A light emitting device with low voltage-endurance components includes a light emitting diode string, M first control circuits, a detection unit and a current control circuit. The light emitting diode string includes M first light emitting diodes connected in series. Each first control circuit includes a first switch. One end of the light emitting string is coupled to a node of an input voltage. The first switch is connected to its related first light emitting diode in parallel and can enable a bypass current path. The detection unit detects the potential of the input voltage to produce a current detection signal. The current control circuit is coupled to the M-th one of the M first control circuits and the detection unit and controls the M-th one of the M first control circuits to selectively enable the bypass current path according to the current detection signal.

Abstract: This disclosure provides a device for heating to generate a uniform molten pool, including: a source unit for generating an energy beam; a beam expanding/reducing unit positioned in an energy path of the energy beam for adjusting the diameter of the energy beam; a flat-top conical lens set positioned in the energy path and including at least two flat-top axicons, with the beam expanding/reducing unit positioned between the source unit and the flat-top conical lens set; and a focusing lens positioned in the energy path, with the flat-top conical lens set between the beam expanding/reducing unit and the focusing lens, and the energy beam being focused by the focusing lens. This disclosure generates a uniform molten pool to prevent vaporization splash due to overheating of the material during melting.

Abstract: A light emitting device with low voltage-endurance components includes a light emitting diode string, M pieces of first control circuit, a detection unit and a current control circuit. The light emitting diode string includes M pieces of first light emitting diode connected in series. Each first control circuit includes a first switch. One end of the light emitting string is coupled to a node of an input voltage. The first switch is connected to its related first light emitting diode in parallel and can enable a bypass current path. The detection unit detects the potential of the input voltage to produce a current detection signal. The current control circuit is coupled to the M-th piece of the first control circuits and the detection unit and controls the M-th piece of the first control circuits to selectively enable the bypass current path according to the current detection signal.

Abstract: A constant current driving device includes an electronic device, a transistor, a rectifying circuit, a current limiting element, an impedance element, and a first and a second energy storage element. A first end of the electronic device is connected to a first end of a load element. A first end of the transistor is connected to a second end of the load element, a second end of the transistor is connected to a second end of the electronic device through an impedance element, and a control end of the transistor is connected to the second end of the electronic device through a first energy storage element. The rectifying circuit connected between the first end and the control end of the transistor. The current limiting element is connected in parallel with the rectifying circuit. The second energy storage element is connected between the first and second end of the electronic device.

Abstract: A constant current driving device includes an electronic device, a transistor, a rectifying circuit, a current limiting element, an impedance element, and a first and a second energy storage element. A first end of the electronic device is connected to a first end of a load element. A first end of the transistor is connected to a second end of the load element, a second end of the transistor is connected to a second end of the electronic device through an impedance element, and a control end of the transistor is connected to the second end of the electronic device through a first energy storage element. The rectifying circuit connected between the first end and the control end of the transistor. The current limiting element is connected in parallel with the rectifying circuit. The second energy storage element is connected between the first and second end of the electronic device.

Abstract: An electronic device is provided. The electronic device includes a plurality of load units, a plurality of serial-parallel switch units and a control module. The control module switches the serial-parallel switch units to a first state or a second state according to a level variation of an input voltage. Connection relations of the load units are correspondingly changed according to the level variation of the input voltage. In this way, the electronic device can be driven by an alternating-current voltage.

Abstract: A circuit substrate structure including a substrate, a dielectric stack layer, a first plating layer and a second plating layer is provided. The substrate has a pad. The dielectric stack layer is disposed on the substrate and has an opening exposing the pad, wherein the dielectric stack layer includes a first dielectric layer, a second dielectric layer and a third dielectric layer located between the first dielectric layer and the second dielectric layer, and there is a gap between the portion of the first dielectric layer surrounding the opening and the portion of the second dielectric layer surrounding the opening. The first plating layer is disposed at the dielectric stack layer. The second plating layer is disposed at the pad, wherein the gap isolates the first plating layer from the second plating layer.

Abstract: A circuit substrate structure including a substrate, a dielectric stack layer, a first plating layer and a second plating layer is provided. The substrate has a pad. The dielectric stack layer is disposed on the substrate and has an opening exposing the pad, wherein the dielectric stack layer includes a first dielectric layer, a second dielectric layer and a third dielectric layer located between the first dielectric layer and the second dielectric layer, and there is a gap between the portion of the first dielectric layer surrounding the opening and the portion of the second dielectric layer surrounding the opening. The first plating layer is disposed at the dielectric stack layer. The second plating layer is disposed at the pad, wherein the gap isolates the first plating layer from the second plating layer.

Abstract: A fabricating process of circuit substrate sequently includes: providing a substrate with a pad and a dielectric stack layer disposed at the substrate and overlaying the pad, in which the stack layer includes two dielectric layers and a third dielectric layer located between the two dielectric layers, and the etching rate of the third dielectric layer is greater than the etching rate of the two dielectric layers; forming an opening corresponding to the pad at the stack layer; performing a wet etching process on the stack layer to remove the portion of the third dielectric layer surrounding the opening to form a gap between the portions of the two dielectric layers surrounding the opening; performing a plating process on the stack layer and the pad to respectively form two plating layers at the stack layer and the pad, in which the gap isolates the two plating layers from each other.

Abstract: A light emitting unit includes a substrate, a first reflecting element, a light-emitting diode (LED), and a second reflecting element. At least one part of the substrate is light permeable. The LED is disposed between the substrate and the first reflecting element, and the first and second reflecting elements are disposed on two opposite sides of the substrate, respectively.

Abstract: A fabricating process of circuit substrate sequently includes: providing a substrate with a pad and a dielectric stack layer disposed at the substrate and overlaying the pad, in which the stack layer includes two dielectric layers and a third dielectric layer located between the two dielectric layers, and the etching rate of the third dielectric layer is greater than the etching rate of the two dielectric layers; forming an opening corresponding to the pad at the stack layer; performing a wet etching process on the stack layer to remove the portion of the third dielectric layer surrounding the opening to form a gap between the portions of the two dielectric layers surrounding the opening; performing a plating process on the stack layer and the pad to respectively form two plating layers at the stack layer and the pad, in which the gap isolates the two plating layers from each other.

Abstract: An electronic device is provided. The electronic device includes a plurality of load units, a plurality of serial-parallel switch units and a control module. The control module switches the serial-parallel switch units to a first state or a second state according to a level variation of an input voltage. Connection relations of the load units are correspondingly changed according to the level variation of the input voltage. In this way, the electronic device can be driven by an alternating-current voltage.

Abstract: A light emitting unit includes a substrate, a first reflecting element, a light-emitting diode (LED), and a second reflecting element. At least one part of the substrate is light permeable. The LED is disposed between the substrate and the first reflecting element, and the first and second reflecting elements are disposed on two opposite sides of the substrate, respectively.

Abstract: An integrated circuit package and a method of manufacturing the package. A silicon chip is attached to the surface of a substrate or attached to the bottom surface of a cavity in the substrate so that the active surface of the chip is exposed. One or more build-up circuit structures are formed over the substrate. Each build-up circuit structure has at least one insulation layer, at least one patterned circuit layer and a plurality of via openings with conductive material therein so that bonding pads on the active surface of the chip connect electrically with the patterned circuit layer through the vias. To form a ball grid array package, solder balls may also be attached to the solder ball pads on the patterned circuit layer so that the bonding pads on the chip are electrically connected to an external circuit through the build-up circuit structure and the solder balls.

Abstract: A substrate exposure apparatus, having a display apparatus and a control system. The display apparatus is used to display the pattern and to transfer the pattern to the photoresist, and includes a non-self luminescent display or a self-luminescent display. The control system is used to control the pattern displayed on the display apparatus.