Abstract: Some implementations described herein include systems and techniques for fabricating a stacked die product. The systems and techniques include using a supporting fill mixture that includes a combination of types of composite particulates in a lateral gap region of a stack of semiconductor substrates and along a perimeter region of the stack of semiconductor substrates. One type of composite particulate included in the combination may be a relatively smaller size and include a smooth surface, allowing the composite particulate to ingress deep into the lateral gap region. Properties of the supporting fill mixture including the combination of types of composite particulates may control thermally induced stresses during downstream manufacturing to reduce a likelihood of defects in the supporting fill mixture and/or the stack of semiconductor substrates.

Abstract: Techniques pertaining to adaptive transmission opportunity (TXOP) sharing for latency-sensitive traffic in wireless communications are described. An apparatus determines whether to activate an adaptive TXOP sharing mechanism with respect to a plurality of traffics having different latency requirements and pending transmission. In response to a positive determination, the apparatus utilizes the adaptive TXOP sharing mechanism in transmitting one or more traffics of the plurality of traffics associated with a plurality of stations (STAs) by performing either or both of: (i) selecting a candidate traffic from the one or more traffics of the plurality of traffics; and (ii) adjusting a transmission time of the candidate traffic in transmitting the candidate traffic during a TXOP.

Abstract: A thin film transistor includes a substrate, a semiconductor layer, a gate insulating layer, a gate, a source and a drain. The semiconductor layer is located above the substrate. The gate insulating layer is located above the semiconductor layer. The gate is located above the gate insulating layer and overlapping with the semiconductor layer. The gate includes a first portion, a second portion and a third portion. The first portion is extending along the surface of the gate insulating layer and directly in contact with the gate insulating layer. The second portion is separated from the gate insulating layer. Taking the surface of the gate insulating layer as a reference, the top surface of the second portion is higher than the top surface of the first portion. The third portion connects the first portion to the second portion. The source and the drain are electrically connected to the semiconductor layer.

Abstract: A thermally conductive board includes a first metal layer, a second metal layer, and a thermally conductive layer. The material of the first metal layer includes copper, and the first metal layer has a first top surface and a first bottom surface opposite to the first top surface. A first metal coating layer covers the first bottom surface. The material of the second metal layer includes copper, and the second metal layer has a second top surface and a second bottom surface opposite to the second top surface. A second metal coating layer covers the second top surface and faces the first metal coating layer. The thermally conductive layer is an electrically insulator laminated between the first metal coating layer and the second metal coating layer.

Abstract: An image sensor device has a first number of first pixels disposed in a substrate and a second number of second pixels disposed in the substrate. The first number is substantially equal to the second number. A light-blocking structure disposed over the first pixels and the second pixels. The light-blocking structure defines a plurality of first openings and second openings through which light can pass. The first openings are disposed over the first pixels. The second openings are disposed over the second pixels. The second openings are smaller than the first openings. A microcontroller is configured to turn on different ones of the second pixels at different points in time.

Abstract: A method for performing adaptive multi-link aggregation dispatching control in multi-link operation architecture and associated apparatus are provided.

Abstract: Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

Abstract: Techniques pertaining to an efficient pre-channel reservation mechanism for target wake time (TWT) and restricted TWT (rTWT) in overlapping basic service set (OBSS) dense networks are described. A first station (STA) transmits a frame to reserve a reservation period. The first STA then communicates with a second STA during the reservation period which aligns at least partially with a target wake time (TWT) service period (SP) or a restricted TWT (rTWT) SP of the second STA.

Abstract: A method includes forming a transistor, which includes forming a dummy gate stack over a semiconductor region, and forming an Inter-Layer Dielectric (ILD). The dummy gate stack is in the ILD, and the ILD covers a source/drain region in the semiconductor region. The method further includes removing the dummy gate stack to form a trench in the first ILD, forming a low-k gate spacer in the trench, forming a replacement gate dielectric extending into the trench, forming a metal layer to fill the trench, and performing a planarization to remove excess portions of the replacement gate dielectric and the metal layer to form a gate dielectric and a metal gate, respectively. A source region and a drain region are then formed on opposite sides of the metal gate.

Abstract: A micro light-emitting diode display, including at least one first type semiconductor base layer, a plurality of semiconductor light-emitting mesas, and a conducting layer, is provided. The plurality of semiconductor light-emitting mesas are dispersedly disposed on the at least one first type semiconductor base layer. The at least one first type semiconductor base layer has a surface exposed by the semiconductor light-emitting mesas. The conducting layer is disposed on the surface of the at least one first type semiconductor base layer and is in an interlaced distribution configuration with the semiconductor light-emitting mesas. The ratio of the area of the conducting layer in contact with the surface to the area of the surface is greater than or equal to 0.2.

Abstract: A micro light-emitting diode display, including at least one first type semiconductor base layer, a plurality of semiconductor light-emitting mesas, and a conducting layer, is provided. The plurality of semiconductor light-emitting mesas are dispersedly disposed on the at least one first type semiconductor base layer. The at least one first type semiconductor base layer has a surface exposed by the semiconductor light-emitting mesas. The conducting layer is disposed on the surface of the at least one first type semiconductor base layer and is in an interlaced distribution configuration with the semiconductor light-emitting mesas. The ratio of the area of the conducting layer in contact with the surface to the area of the surface is greater than or equal to 0.2.

Abstract: A card connector includes an insulating housing, a plurality of conductive terminals, at least one ejection mechanism, at least one reset mechanism, a shielding shell and a card tray. The reset mechanism is disposed to a front of the insulating housing with a base portion located at a front thereof elastically projecting beyond a front surface of the insulating housing. The card tray slidably disposed to the insulating housing includes a base board, and a cover portion protruded forward and then spread outward from a front end of the base board and projecting beyond the front end of the base board. The front surface of the base portion of the reset mechanism abuts against a rear surface of an enclosure of the electronic device so as to make a front surface of the cover portion be flush with an outer surface of the electronic device.

Abstract: An apparatus in one example comprises: a first manager component responsible for one or more first software components within one or more first executables of a distributed software application; and a second manager component responsible for one or more second software components within one or more second executables of the distributed software application. The first and second manager components communicate to initialize and/or shut down the one or more first software components and the one or more second software components in an ordered sequence based on one or more dependency relationships among two or more of: the one or more first software components; and/or the one or more second software components.

Abstract: A test system for testing an electronic device is disclosed. The test system includes a signal generator for generating an input signal, a signal splitter for splitting the input signal into a first splitting signal and a second splitting signal, a micro control unit for generating a first control signal and a second control signal, a first transmission interface for transmitting the first splitting signal and the first control signal, a second transmission interface for transmitting the second splitting signal and the second control signal, and a first signal adjustment unit for transforming the first splitting signal to a first test signal for test according to the first control signal.

Abstract: Techniques are provided to allow global roaming between different devices in different networks, using different protocols. A system may contain one or more protocol dependent logic servers (PDLSs), in which each PDLS is associated with a particular network/network protocol. The networks may comprise one or more wired telecommunications networks, wireless communications networks, or Internet-based networks. When a first PDLS receives an incoming, protocol-dependent message comprising a first protocol from a first network intended for a user currently registered on another network, the first PDLS converts the protocol-dependent message into an incoming, protocol-independent message and forwards it to another network element, such as a core logic server (CLS). The CLS processes the incoming, protocol-independent message, generates an appropriate outgoing protocol-independent message and forwards this message to a second PDLS.

Abstract: In one embodiment, a filter with a main signal path having one or more biquadratic filter sections is tuned using a tuning circuit based on a biquadratic filter that can be configured to oscillate at the filter's cutoff frequency. In one application, a tuning circuit outside of the main signal path is used to tune each biquadratic filter section of the main signal path. In another application, each filter section along the main signal path has a biquadratic filter that can oscillate and corresponding tuning elements that enable the filter section to tune itself. According to certain embodiments of the present invention, a biquadratic filter is made to oscillate by applying a common-mode voltage signal to the inputs of the filter's third transconductor cell to make the cell's transconductance go to zero. The invention may also be implemented in the context of filters having ladder structures in their main signal path.

Abstract: An apparatus in one example comprises: a first manager component responsible for one or more first software components within one or more first executables of a distributed software application; and a second manager component responsible for one or more second software components within one or more second executables of the distributed software application. The first and second manager components communicate to initialize and/or shut down the one or more first software components and the one or more second software components in an ordered sequence based on one or more dependency relationships among two or more of: the one or more first software components; and/or the one or more second software components.

Abstract: A capacitor cancellation method and apparatus for use in an interface circuit having a transformer blocking capacitor. The method includes sensing a voltage across the transformer blocking capacitor and generating a cancellation signal to compensate for the effect of the transformer blocking capacitor. The apparatus includes a sensor to sense a differential voltage across the transformer blocking capacitor to develop a capacitor signal and an amplifier to amplify the capacitor signal to obtain a cancellation signal.

Abstract: Techniques are provided to allow global roaming between different devices in different networks, using different protocols. A system may contain one or more protocol dependent logic servers (PDLSs), in which each PDLS is associated with a particular network/network protocol. The networks may comprise one or more wired telecommunications networks, wireless communications networks, or Internet-based networks. When a first PDLS receives an incoming, protocol-dependent message comprising a first protocol from a first network intended for a user currently registered on another network, the first PDLS converts the protocol-dependent message into an incoming, protocol-independent message and forwards it to another network element, such as a core logic server (CLS). The CLS processes the incoming, protocol-independent message, generates an appropriate outgoing protocol-independent message and forwards this message to a second PDLS.