Patents by Inventor Kuo-Yu Wu

Kuo-Yu Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150364383
    Abstract: A method of calibrating or monitoring an exposing tool including forming a substrate pattern in a substrate, wherein forming the substrate pattern includes providing a first patterned photo resist layer having an etch coating layer disposed thereon and using the first patterned photo resist layer and the etch coating layer to pattern an underlying layer. The patterned underlying layer is then used as a masking element when etching the substrate pattern into the substrate. A second photo resist pattern is formed over the substrate pattern. An overlay measurement is executed of the second photo resist pattern to the substrate pattern.
    Type: Application
    Filed: August 25, 2015
    Publication date: December 17, 2015
    Inventors: Yu Chao Lin, Chia-Hao Hsu, Kuo-Yu Wu, Chia-Jen Chen, Chao-Cheng Chen
  • Patent number: 9128384
    Abstract: An embodiment of a method of forming a substrate pattern including forming a bottom layer and an overlying middle layer on the substrate. A photo resist pattern is formed on the middle layer. An etch coating layer is deposited on the photo resist pattern. The etch coating layer and the photo resist pattern are used as a masking element to pattern at least one of the middle layer and the bottom layer. The substrate is etched to form the substrate pattern using the at least one of the patterned middle layer and the patterned bottom layer as a masking element. The substrate pattern may be used as an element of an overlay measurement process.
    Type: Grant
    Filed: November 9, 2012
    Date of Patent: September 8, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu Chao Lin, Chia-Hao Hsu, Kuo-Yu Wu, Chia-Jen Chen, Chao-Cheng Chen
  • Publication number: 20150074438
    Abstract: An adaptive universal serial bus (USB) charging method and system are disclosed. In a low-power state, a USB device is charged with a non-USB charging mode. The non-USB charging mode is retained when no variation of a data signal coupled to the USB device is detected. When the data signal possesses variation for a first period, it is switched to a third proprietary charging mode.
    Type: Application
    Filed: September 18, 2014
    Publication date: March 12, 2015
    Inventors: YI-LIN LAI, Bo-Ming Huang, Kuo-Yu Wu
  • Patent number: 8892912
    Abstract: An adaptive universal serial bus (USB) charging method and system are disclosed. In a low-power state, a USB device is charged with a non-USB charging mode. The non-USB charging mode is retained when no variation of a data signal coupled to the USB device is detected. When the data signal possesses variation for a first period, it is switched to a third proprietary charging mode.
    Type: Grant
    Filed: May 3, 2011
    Date of Patent: November 18, 2014
    Assignee: VIA Technologies, Inc.
    Inventors: Yi-Lin Lai, Bo-Ming Huang, Kuo-Yu Wu
  • Publication number: 20140134759
    Abstract: An embodiment of a method of forming a substrate pattern including forming a bottom layer and an overlying middle layer on the substrate. A photo resist pattern is formed on the middle layer. An etch coating layer is deposited on the photo resist pattern. The etch coating layer and the photo resist pattern are used as a masking element to pattern at least one of the middle layer and the bottom layer. The substrate is etched to form the substrate pattern using the at least one of the patterned middle layer and the patterned bottom layer as a masking element. The substrate pattern may be used as an element of an overlay measurement process.
    Type: Application
    Filed: November 9, 2012
    Publication date: May 15, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu Chao Lin, Chia-Hao Hsu, Kuo-Yu Wu, Chia-Jen Chen, Chao-Cheng Chen
  • Publication number: 20140019658
    Abstract: A hub device includes a first chip, a second chip and an external memory device. The first chip includes at least a first upstream port and multiple first downstream ports. The second chip includes at least a second upstream port and multiple second downstream ports. The external memory device stores firmware data corresponding to the first chip and the second chip. One of the first downstream ports of the first chip is coupled to the second upstream port of the second chip to form a tiered hub. The first chip and the second chip are sequentially enabled and the first chip and the second chip sequentially load the corresponding firmware data.
    Type: Application
    Filed: July 11, 2013
    Publication date: January 16, 2014
    Inventors: Chih-Long HO, Yi-Te CHEN, Wen-Hao CHENG, Kuo-Yu WU, Chun-Heng LIN, Po-Ming HUANG
  • Publication number: 20130320418
    Abstract: A device includes a semiconductor substrate, a well region in the semiconductor substrate, and a Metal-Oxide-Semiconductor (MOS) device. The MOS device includes a gate dielectric overlapping the well region, a gate electrode over the gate dielectric, and a source/drain region in the well region. The source/drain region and the well region are of opposite conductivity types. An edge of the first source drain region facing away from the gate electrode is in contact with the well region to form a junction isolation.
    Type: Application
    Filed: August 17, 2012
    Publication date: December 5, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chien-Hsien Tseng, Shou-Gwo Wuu, Chia-Chan Chen, Kuo-Yu Wu, Dao-Hong Yang, Ming-Hao Chung
  • Publication number: 20120210146
    Abstract: An adaptive universal serial bus (USB) charging method and system are disclosed. In a low-power state, a USB device is charged with a non-USB charging mode. The non-USB charging mode is retained when no variation of a data signal coupled to the USB device is detected. When the data signal possesses variation for a first period, it is switched to a third proprietary charging mode.
    Type: Application
    Filed: May 3, 2011
    Publication date: August 16, 2012
    Applicant: VIA TECHNOLOGIES, INC.
    Inventors: YI-LIN LAI, Bo-Ming Huang, Kuo-Yu Wu
  • Patent number: 6790032
    Abstract: A straight path carbon powder combustion machine uses carbon powders as fuel of the combustion machine. The carbon powders enter into the interior of an igniter from carbon powders inlets. Then the carbon powders further enter into a forced firing internal combustion chamber. The gas in the gas tube of the igniter is fired by an electric shock rod. Part of air input from the whirlwind combustion air inlet to mix in the forced firing internal combustion chamber. When the gas in the igniter is fired by the electric shock rod, the fire jets out from the gas combustion air inlet tube so as to fire the carbon powders. The carbon powders are intercepted by the tinder intercepter to adhere thereon. The carbon powders contact and are fired by the tinder on the tinder intercepter to form a large flame which is sprayed out from the plurality of flame outlets.
    Type: Grant
    Filed: January 6, 2003
    Date of Patent: September 14, 2004
    Inventors: Kuo-Yu Wu, Chen-Yi Lin
  • Patent number: D517559
    Type: Grant
    Filed: December 30, 2004
    Date of Patent: March 21, 2006
    Assignee: C-One Technology Corporation
    Inventors: Gordon Yu, Hung-Tse Ho, Chien-Wei Teng, I-Hua Ho, Kuo-Yu Wu
  • Patent number: D518483
    Type: Grant
    Filed: December 30, 2004
    Date of Patent: April 4, 2006
    Assignee: C-One Technology Corporation
    Inventors: Gordon Yu, Hung-Tse Ho, Chien-Wei Teng, I-Hua Ho, Kuo-Yu Wu