Abstract: A thin-type wide-angle imaging lens assembly comprises a fixing diaphragm and an optical set including five lenses. An arranging order from an object side to an image side is: a first lens; a second lens; a third lens; a fourth lens; a fifth lens; and the fixing diaphragm disposed between an object and the third lens. At least one surface of the first, second, and third lenses is aspheric. At least one surface of the fourth and fifth lenses is aspheric. By the concatenation between the lenses and the adapted curvature radius, thickness, interval, refractivity, and Abbe numbers, the assembly attains a shorter height and a better optical aberration.

Abstract: In accordance with some embodiments, a semiconductor device is provided. The semiconductor device structure includes a substrate, and the substrate has a device region and an edge region. The semiconductor device structure also includes a silicon layer formed on the substrate and a transistor formed on the silicon layer. The transistor is formed at the device region of the substrate. The semiconductor device structure further includes a metal ring formed in the silicon layer. The metal ring is formed at the edge region of the substrate, and the transistor is surrounded by the metal ring.

Abstract: Embodiments for forming a semiconductor device structure are provided. The semiconductor device structure includes a substrate and a buried oxide layer formed over the substrate. An interface layer is formed between the substrate and the buried oxide layer. The semiconductor device structure also includes a silicon layer formed over the buried oxide layer; and a polysilicon layer formed over the substrate and in a deep trench. The polysilicon layer extends through the silicon layer, the buried oxide layer and the interface layer.

Abstract: The invention discloses a five-piece lens set for capturing images. The lens set comprises an aperture stop, an image-plane, and a five-piece optical lens for capturing images. The optical lens comprises a first lens element having a convex object-side surface; a second lens element having a concave image-side surface; a third lens element with positive refractive power having a convex object-side surface, and both the object-side surface and the image-side surface of the fifth lens element are aspheric; a fourth lens element having a concave object-side surface and a convex image-side surface; both the object-side surface and the image-side surface of the fifth lens element are aspheric. Wherein, at least one of the image-side surface and object-side surface of the first lens element, the second lens element, and the fourth lens element are aspheric, and at least two of the aspheric surfaces have one inflection point.

Abstract: The invention discloses a seven-piece optical lens for capturing image and a seven-piece optical module for capturing image. In order from an object side to an image side, the optical lens along the optical axis comprises a first lens element; a second lens element; a third lens element; a fourth lens element with positive refractive power; a fifth lens element; a sixth lens element with positive refractive power having a convex image-side; and a seventh lens element with positive refractive power having a convex object-side, and the first lens element, the second lens element, the third lens element, and the fifth lens element have refractive power, and at least one of the image-side surface and object-side surface of the second lens element, the sixth lens element, and the seventh lens element are aspheric.

Abstract: A CMOS image sensor includes a pixel array including a plurality of unit pixels with individual rows of unit pixels being coupled to respective row control signal lines, and a buffer including plural row control signal drivers. Each driver is coupled to a respective one of the row control signal lines and is configured to provide a row control signal pulse to a respective row control signal line in response to an input pulse when the row control signal line is in an active state and to bias the row control signal line at a ground voltage when the respective row control signal line is in an inactive state. Each driver has a first drive capability when the row control signal line is in the active state and a second drive capability greater than the first drive capability when the row control signal line is in an inactive state.

Abstract: Embodiments of mechanisms for forming a semiconductor device structure with floating spacers are provided. The semiconductor device structure includes a silicon-on-insulator (SOI) substrate and a gate stack formed on the SOI substrate. The semiconductor device structure also includes gate spacers formed on sidewalls of the gate stack. The gate spacers include a floating spacer. The semiconductor device structure further includes a contact etch stop layer formed on the gate stack and the gate spacers. The contact etch stop layer is formed between the floating spacer and the SOI substrate.

Abstract: The invention discloses a six-piece optical lens for capturing image and a six-piece optical module for capturing image. In order from an object side to an image side, the optical lens along the optical axis comprises a first lens element having a convex object-side surface and a convex image-side surface; a second lens element having a convex object-side surface and a concave image-side surface; a third lens element with positive refractive power having a convex object-side surface and a convex image-side surface; a fourth lens element with refractive power; a fifth lens element having a convex image-side surface; and a sixth lens element having a concave image-side; and at least one of the image-side surface and object-side surface of each of the six lens elements are aspheric. The optical lens can reduce the sensitivity for use in compact cameras with camera functionalities.

Abstract: Embodiments of mechanisms for forming a semiconductor device structure with floating spacers are provided. The semiconductor device structure includes a silicon-on-insulator (SOI) substrate and a gate stack formed on the SOI substrate. The semiconductor device structure also includes gate spacers formed on sidewalls of the gate stack. The gate spacers include a floating spacer. The semiconductor device structure further includes a contact etch stop layer formed on the gate stack and the gate spacers. The contact etch stop layer is formed between the floating spacer and the SOI substrate.

Abstract: A display panel, which has a display region and a non-display region, includes an active array substrate and an opposite substrate disposed opposite to the active array substrate. The active array substrate includes a substrate, a pixel array, and a driving circuit. The pixel array and the driving circuit are disposed on the substrate, wherein the pixel array is located in the display region and the driving circuit is located in the non-display region. The driving circuit includes a first transparent electrode layer, a second transparent electrode layer, and a dielectric layer. The dielectric layer is located between the first transparent electrode layer and the second transparent electrode layer, wherein the first transparent electrode layer and the second transparent electrode layer are electrically coupled to each other to form at least one transparent capacitor.

Abstract: An embodiment radio frequency area of an integrated circuit is disclosed. The radio frequency area includes a substrate having an implant region. The substrate has a first resistance. A buried oxide layer is disposed over the substrate and an interface layer is disposed between the substrate and the buried oxide layer. The interface layer has a second resistance lower than the first resistance. A silicon layer is disposed over the buried oxide layer and an interlevel dielectric is disposed in a deep trench. The deep trench extends through the silicon layer, the buried oxide layer, and the interface layer over the implant region. The deep trench may also extend through a polysilicon layer disposed over the silicon layer.

Abstract: An imaging lens module includes first, second, third and fourth optical lens elements that are arranged sequentially from an object side to an image side along an optical axis and that respectively have positive, positive, negative and negative refractive powers, and a fixed aperture stop that is disposed between the object side and the second optical lens element. The fourth optical lens element has an object-side surface and an image-side surface that has a concave surface segment near the optical axis. At least one of the object-side surface and the image-side surface of the fourth optical lens element has at least an inflection point.

Abstract: Embodiments of mechanisms of forming a radio frequency area of an integrated circuit are provided. The radio frequency area of an integrated circuit structure includes a substrate, a buried oxide layer formed over the substrate, and an interface layer formed between the substrate and the buried oxide layer. The radio frequency area of an integrated circuit structure also includes a silicon layer formed over the buried oxide layer and an interlayer dielectric layer formed in a deep trench. The radio frequency area of an integrated circuit structure further includes the interlayer dielectric layer extending through the silicon layer, the buried oxide layer and the interface layer. The radio frequency area of an integrated circuit structure includes an implant region formed below the interlayer dielectric layer in the deep trench and a polysilicon layer formed below the implant region.

Abstract: A method for noise simulation of a CMOS image sensor comprises performing a frequency domain noise simulation for a readout circuit of the CMOS image sensor using a computer, wherein the readout circuit includes a correlated double sampling (CDS) circuit, wherein the frequency domain noise simulation includes a CDS transfer function to refer a noise introduced by the CDS circuit back to an input node of the readout circuit. The method further comprises calculating noise at the input node of the readout circuit based on the referred back noises caused by one or more components in the readout circuit and estimating noise of the CMOS imaging sensor by comparing the calculated noise at the input node of the readout circuit to an original input signal to the readout circuit of the CMOS imaging sensor.

Abstract: A refillable lipstick is provided. In one implementation, a high-quality permanent lipstick dispenser incorporates a magnetic catch that enables replacement of the lipstick within the dispenser. Lipstick refills may be installed and removed from the dispenser with a refill cap that has an extraction lever. The refill cap may be made decorative. In one implementation, the refill cap and extraction lever make and break an attachment between a magnetic cup provided with the lipstick and the magnetic catch inside the permanent decorative dispenser. In an implementation, a swivel-up dispenser extends and retracts the lipstick. At extension, the user can twist a derailer, which then provides an additional groove for further extending and raising the lipstick from the dispenser for removal by the refill cap. A working cap is provided to cap the lipstick between refills.

Abstract: An apparatus comprises a readout circuit configured to be disconnected from a pixel output, and to connect a pixel reset signal received by the readout circuit to a pixel output signal received by the readout circuit. The apparatus also comprises at least one programmable gain amplifier coupled with the readout circuit. The apparatus further comprises an analog-to-digital converter coupled with the programmable gain amplifier. The readout circuit is configured to be calibrated based on a comparison of a measured output of the readout circuit to a predetermined value, the predetermined value being equal to (2n/2)?1, where n is the number of bits of the analog-to-digital converter.

Abstract: A thin-type wide-angle imaging lens assembly comprises a fixing diaphragm and an optical set including four lenses. An arranging order from an object side to an image side is: a first lens; a second lens; a third lens; a fourth lens; and the fixing diaphragm disposed between an object and the second lens. By the concatenation between the lenses and the adapted curvature radius, thickness/interval, refractivity, and Abbe numbers, the assembly attains a big diaphragm with ultra-wide-angle, a shorter height, and a better optical aberration.

Abstract: The invention discloses an optical lens for capturing image and an image capture module. In order from an object side to an image side, the optical lens along the optical axis comprises a first lens element with positive refractive power having a convex object-side surface; a second lens element with positive refractive power having a convex image-side surface; a third lens element with negative refractive power having a convex image-side surface and a concave object-side surface; a fourth lens element with refractive power having a convex object-side surface, both the object-side surface and the image-side surface of the fourth lens element are aspheric; a fifth lens element with refractive power having a concave image-side surface, and at least one of the image-side surface and object-side surface has at least one inflection point. The optical lens can reduce the sensitivity for use in compact cameras with camera functionalities.

Abstract: An imaging lens assembly includes first, second and third optical lenses that are arranged sequentially from an object side to an image side along an optical axis, and a constant-aperture diaphragm disposed between the second optical lens and the object side. Each of the first and second optical lenses has a positive refractive power near the optical axis. The third optical lens has a negative refractive power near the optical axis and has an object-side surface and an image-side surface, at least one of which has at least an inflection point. The imaging lens assembly satisfies: 0.55<f/Dg<0.85, in which, f is a focal length of the imaging lens assembly, and Dg is a length of a diagonal line of a maximum viewing angle in an imaging plane.

Abstract: An imaging lens module includes first, second and third optical lenses that are arranged sequentially from an object side to an image side along an optical axis, and a constant-aperture diaphragm disposed between the first and second optical lenses. The first optical lens has a positive refractive power, and the second optical lens has a negative refractive power. The third optical lens has a positive refractive power and has an object-side surface and an image-side surface, At least one of which has at least an inflection point. The imaging lens module satisfies: 0.8TL/Dg1.1, in which, TL is a length from an imaging plane to the object-side surface of the first optical lens, and Dg is a length of a diagonal line of a maximum viewing angle on the imaging plane.