Patents by Inventor Kurt C. Swanson

Kurt C. Swanson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11594249
    Abstract: A system and methods for manufacturing devices such as flexures using process coupons are described are described. The method including performing a test on at least one feature of a coupon, the coupon is included on an assembly sheet used in manufacturing flexures. The at least one feature is produced by a manufacturing processing step that is used to produce a portion of a flexure. And, the physical characteristics of the feature include at least one physical characteristic that is different than physical characteristics of the portion. The method also including determining the manufacturing processing step will produce an abnormal portion of a flexure based on the performed test. Further, the method includes adjusting the manufacturing processing step and manufacturing a portion of a flexure using the adjusted manufacturing processing step.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: February 28, 2023
    Assignee: Hutchinson Technology Incorporated
    Inventors: Kurt C. Swanson, Brian D. Boudreau
  • Publication number: 20220351893
    Abstract: A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
    Type: Application
    Filed: July 11, 2022
    Publication date: November 3, 2022
    Inventors: Douglas P. Riemer, Kurt C. Swanson, Peter F. Ladwig, Matthew S. Lang, Paul V. Pesavento, Joseph D. Starkey
  • Patent number: 11387033
    Abstract: A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: July 12, 2022
    Assignee: Hutchinson Technology Incorporated
    Inventors: Douglas P. Riemer, Kurt C. Swanson, Peter F. Ladwig, Matthew S. Lang, Paul V. Pesavento, Joseph D. Starkey
  • Patent number: 11285631
    Abstract: A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: March 29, 2022
    Assignee: MOUND LASER & PHOTONICS CENTER, INC.
    Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel, Patrick R. LaLonde
  • Publication number: 20210225396
    Abstract: A system and methods for manufacturing devices such as flexures using process coupons are described are described. The method including performing a test on at least one feature of a coupon, the coupon is included on an assembly sheet used in manufacturing flexures. The at least one feature is produced by a manufacturing processing step that is used to produce a portion of a flexure. And, the physical characteristics of the feature include at least one physical characteristic that is different than physical characteristics of the portion. The method also including determining the manufacturing processing step will produce an abnormal portion of a flexure based on the performed test. Further, the method includes adjusting the manufacturing processing step and manufacturing a portion of a flexure using the adjusted manufacturing processing step.
    Type: Application
    Filed: January 29, 2021
    Publication date: July 22, 2021
    Inventors: Kurt C. Swanson, Brian D. Boudreau
  • Patent number: 11020108
    Abstract: A chemically etched needle is provided herein. The chemically etched needle includes a metal base having a first side and a second side. The chemically etched needle also includes a chemically etched blade at one end of the metal base and formed at an intersection of a distal diverging surface and a proximal diverging surface, at least one of the diverging surfaces slopes inward towards the second side.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: June 1, 2021
    Assignee: MOUND LASER & PHOTONICS CENTER, INC.
    Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel, Patrick R. LaLonde
  • Patent number: 10910003
    Abstract: A system and methods for manufacturing devices such as flexures using process coupons are described are described. The method including performing a test on at least one feature of a coupon, the coupon is included on an assembly sheet used in manufacturing flexures. The at least one feature is produced by a manufacturing processing step that is used to produce a portion of a flexure. And, the physical characteristics of the feature include at least one physical characteristic that is different than physical characteristics of the portion. The method also including determining the manufacturing processing step will produce an abnormal portion of a flexure based on the performed test. Further, the method includes adjusting the manufacturing processing step and manufacturing a portion of a flexure using the adjusted manufacturing processing step.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: February 2, 2021
    Assignee: Hutchinson Technology Incorporated
    Inventors: Kurt C. Swanson, Brian D. Boudreau
  • Publication number: 20200232112
    Abstract: Devices including high-aspect ratio electroplated structures and methods of forming high-aspect ratio electroplated structures are described. A method for manufacturing metal structures includes providing a substrate having a metal base characterized by a height to width aspect ratio A/B and electroplating a metal crown on the base to form the metal structure with a height to width aspect ratio A/S greater than the aspect ratio A/B of the base.
    Type: Application
    Filed: March 23, 2020
    Publication date: July 23, 2020
    Inventors: Douglas P. Riemer, Kurt C. Swanson, Peter F. Ladwig
  • Publication number: 20200180180
    Abstract: A chemically etched needle is provided herein. The chemically etched needle includes a metal base having a first side and a second side. The chemically etched needle also includes a chemically etched blade at one end of the metal base and formed at an intersection of a distal diverging surface and a proximal diverging surface, at least one of the diverging surfaces slopes inward towards the second side.
    Type: Application
    Filed: February 14, 2020
    Publication date: June 11, 2020
    Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel, Patrick R. LaLonde
  • Publication number: 20200181791
    Abstract: A gold electroplating solution includes a gold (III) cyanide compound, a chloride compound, and hydrochloric acid. The gold (III) cyanide compound is potassium gold (III) cyanide, ammonium gold (III) cyanide, or sodium gold (III) cyanide. The chloride compound is potassium chloride, ammonium chloride, or sodium chloride. Various structures may be made with the gold electroplating solution having a gold layer deposited directly on the stainless steel (SST) layer using a photolithography process. Such structures include a gold pattern having a discontinuous pattern, a bond pad region having one or more traces on the opposite side of the dielectric layer, a gimbal having gold bond pads, and a bonding joint having an electrical interface including a gold layer.
    Type: Application
    Filed: February 18, 2020
    Publication date: June 11, 2020
    Inventors: Kurt C. Swanson, Douglas P. Riemer, Steven A. Fank
  • Publication number: 20200139567
    Abstract: A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.
    Type: Application
    Filed: November 18, 2019
    Publication date: May 7, 2020
    Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel
  • Patent number: 10640879
    Abstract: Devices including high-aspect ratio electroplated structures and methods of forming high-aspect ratio electroplated structures are described. A method for manufacturing metal structures includes providing a substrate having a metal base characterized by a height to width aspect ratio A/B and electroplating a metal crown on the base to form the metal structure with a height to width aspect ratio A/S greater than the aspect ratio A/B of the base.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: May 5, 2020
    Assignee: Hutchinson Technology Incorporated
    Inventors: Douglas P. Riemer, Kurt C. Swanson, Peter F. Ladwig
  • Publication number: 20200090852
    Abstract: A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
    Type: Application
    Filed: November 22, 2019
    Publication date: March 19, 2020
    Inventors: Douglas P. Riemer, Kurt C. Swanson, Peter F. Ladwig, Matthew S. Lang, Paul V. Pesavento, Joseph D. Starkey
  • Patent number: 10570525
    Abstract: A gold electroplating solution includes a gold (III) cyanide compound, a chloride compound, and hydrochloric acid. The gold (III) cyanide compound is potassium gold (III) cyanide, ammonium gold (III) cyanide, or sodium gold (III) cyanide. The chloride compound is potassium chloride, ammonium chloride, or sodium chloride. Various structures may be made with the gold electroplating solution having a gold layer deposited directly on the stainless steel (SST) layer using a photolithography process. Such structures include a gold pattern having a discontinuous pattern, a bond pad region having one or more traces on the opposite side of the dielectric layer, a gimbal having gold bond pads, and a bonding joint having an electrical interface including a gold layer.
    Type: Grant
    Filed: January 15, 2016
    Date of Patent: February 25, 2020
    Assignee: Hutchinson Technology Incorporated
    Inventors: Kurt C. Swanson, Douglas P. Riemer, Steven A. Fank
  • Publication number: 20200023534
    Abstract: A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.
    Type: Application
    Filed: September 27, 2019
    Publication date: January 23, 2020
    Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel, Patrick R. LaLonde
  • Patent number: 10500748
    Abstract: A chemically etched cutting tool includes a metal base having a first side and a second side, and a chemically etched blade on at least one side of the metal base, the chemically etched blade forming a cutting edge at the intersection of the first side of the chemically etched blade and the second side of the chemically etched blade. The first side of the chemically etched blade includes one or more concave portions and one or more convex portions with at least one inflection point between the concave portions and one or more convex portions. The second side of the chemically etched blade includes one or more concave portions and one or more convex portions with at least one inflection point between the concave portions and one or more convex portions.
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: December 10, 2019
    Assignee: Hutchinson Technology Incorporated
    Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel
  • Patent number: 10478984
    Abstract: A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: November 19, 2019
    Assignee: Hutchinson Technology Incorporated
    Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel
  • Publication number: 20180142370
    Abstract: Devices including high-aspect ratio electroplated structures and methods of forming high-aspect ratio electroplated structures are described. A method for manufacturing metal structures includes providing a substrate having a metal base characterized by a height to width aspect ratio A/B and electroplating a metal crown on the base to form the metal structure with a height to width aspect ratio A/S greater than the aspect ratio A/B of the base.
    Type: Application
    Filed: November 17, 2017
    Publication date: May 24, 2018
    Inventors: Douglas P. Riemer, Kurt C. Swanson, Peter F. Ladwig
  • Publication number: 20180104837
    Abstract: A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.
    Type: Application
    Filed: December 18, 2017
    Publication date: April 19, 2018
    Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel
  • Publication number: 20180005655
    Abstract: A system and methods for manufacturing devices such as flexures using process coupons are described are described. The method including performing a test on at least one feature of a coupon, the coupon is included on an assembly sheet used in manufacturing flexures. The at least one feature is produced by a manufacturing processing step that is used to produce a portion of a flexure. And, the physical characteristics of the feature include at least one physical characteristic that is different than physical characteristics of the portion. The method also including determining the manufacturing processing step will produce an abnormal portion of a flexure based on the performed test. Further, the method includes adjusting the manufacturing processing step and manufacturing a portion of a flexure using the adjusted manufacturing processing step.
    Type: Application
    Filed: May 18, 2017
    Publication date: January 4, 2018
    Inventors: Kurt C. Swanson, Brian D. Boudreau