Patents by Inventor Kurt C. Swanson
Kurt C. Swanson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11594249Abstract: A system and methods for manufacturing devices such as flexures using process coupons are described are described. The method including performing a test on at least one feature of a coupon, the coupon is included on an assembly sheet used in manufacturing flexures. The at least one feature is produced by a manufacturing processing step that is used to produce a portion of a flexure. And, the physical characteristics of the feature include at least one physical characteristic that is different than physical characteristics of the portion. The method also including determining the manufacturing processing step will produce an abnormal portion of a flexure based on the performed test. Further, the method includes adjusting the manufacturing processing step and manufacturing a portion of a flexure using the adjusted manufacturing processing step.Type: GrantFiled: January 29, 2021Date of Patent: February 28, 2023Assignee: Hutchinson Technology IncorporatedInventors: Kurt C. Swanson, Brian D. Boudreau
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Publication number: 20220351893Abstract: A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.Type: ApplicationFiled: July 11, 2022Publication date: November 3, 2022Inventors: Douglas P. Riemer, Kurt C. Swanson, Peter F. Ladwig, Matthew S. Lang, Paul V. Pesavento, Joseph D. Starkey
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Patent number: 11387033Abstract: A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.Type: GrantFiled: November 22, 2019Date of Patent: July 12, 2022Assignee: Hutchinson Technology IncorporatedInventors: Douglas P. Riemer, Kurt C. Swanson, Peter F. Ladwig, Matthew S. Lang, Paul V. Pesavento, Joseph D. Starkey
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Patent number: 11285631Abstract: A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.Type: GrantFiled: September 27, 2019Date of Patent: March 29, 2022Assignee: MOUND LASER & PHOTONICS CENTER, INC.Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel, Patrick R. LaLonde
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Publication number: 20210225396Abstract: A system and methods for manufacturing devices such as flexures using process coupons are described are described. The method including performing a test on at least one feature of a coupon, the coupon is included on an assembly sheet used in manufacturing flexures. The at least one feature is produced by a manufacturing processing step that is used to produce a portion of a flexure. And, the physical characteristics of the feature include at least one physical characteristic that is different than physical characteristics of the portion. The method also including determining the manufacturing processing step will produce an abnormal portion of a flexure based on the performed test. Further, the method includes adjusting the manufacturing processing step and manufacturing a portion of a flexure using the adjusted manufacturing processing step.Type: ApplicationFiled: January 29, 2021Publication date: July 22, 2021Inventors: Kurt C. Swanson, Brian D. Boudreau
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Patent number: 11020108Abstract: A chemically etched needle is provided herein. The chemically etched needle includes a metal base having a first side and a second side. The chemically etched needle also includes a chemically etched blade at one end of the metal base and formed at an intersection of a distal diverging surface and a proximal diverging surface, at least one of the diverging surfaces slopes inward towards the second side.Type: GrantFiled: February 14, 2020Date of Patent: June 1, 2021Assignee: MOUND LASER & PHOTONICS CENTER, INC.Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel, Patrick R. LaLonde
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Patent number: 10910003Abstract: A system and methods for manufacturing devices such as flexures using process coupons are described are described. The method including performing a test on at least one feature of a coupon, the coupon is included on an assembly sheet used in manufacturing flexures. The at least one feature is produced by a manufacturing processing step that is used to produce a portion of a flexure. And, the physical characteristics of the feature include at least one physical characteristic that is different than physical characteristics of the portion. The method also including determining the manufacturing processing step will produce an abnormal portion of a flexure based on the performed test. Further, the method includes adjusting the manufacturing processing step and manufacturing a portion of a flexure using the adjusted manufacturing processing step.Type: GrantFiled: May 18, 2017Date of Patent: February 2, 2021Assignee: Hutchinson Technology IncorporatedInventors: Kurt C. Swanson, Brian D. Boudreau
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Publication number: 20200232112Abstract: Devices including high-aspect ratio electroplated structures and methods of forming high-aspect ratio electroplated structures are described. A method for manufacturing metal structures includes providing a substrate having a metal base characterized by a height to width aspect ratio A/B and electroplating a metal crown on the base to form the metal structure with a height to width aspect ratio A/S greater than the aspect ratio A/B of the base.Type: ApplicationFiled: March 23, 2020Publication date: July 23, 2020Inventors: Douglas P. Riemer, Kurt C. Swanson, Peter F. Ladwig
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Publication number: 20200180180Abstract: A chemically etched needle is provided herein. The chemically etched needle includes a metal base having a first side and a second side. The chemically etched needle also includes a chemically etched blade at one end of the metal base and formed at an intersection of a distal diverging surface and a proximal diverging surface, at least one of the diverging surfaces slopes inward towards the second side.Type: ApplicationFiled: February 14, 2020Publication date: June 11, 2020Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel, Patrick R. LaLonde
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Publication number: 20200181791Abstract: A gold electroplating solution includes a gold (III) cyanide compound, a chloride compound, and hydrochloric acid. The gold (III) cyanide compound is potassium gold (III) cyanide, ammonium gold (III) cyanide, or sodium gold (III) cyanide. The chloride compound is potassium chloride, ammonium chloride, or sodium chloride. Various structures may be made with the gold electroplating solution having a gold layer deposited directly on the stainless steel (SST) layer using a photolithography process. Such structures include a gold pattern having a discontinuous pattern, a bond pad region having one or more traces on the opposite side of the dielectric layer, a gimbal having gold bond pads, and a bonding joint having an electrical interface including a gold layer.Type: ApplicationFiled: February 18, 2020Publication date: June 11, 2020Inventors: Kurt C. Swanson, Douglas P. Riemer, Steven A. Fank
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Publication number: 20200139567Abstract: A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.Type: ApplicationFiled: November 18, 2019Publication date: May 7, 2020Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel
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Patent number: 10640879Abstract: Devices including high-aspect ratio electroplated structures and methods of forming high-aspect ratio electroplated structures are described. A method for manufacturing metal structures includes providing a substrate having a metal base characterized by a height to width aspect ratio A/B and electroplating a metal crown on the base to form the metal structure with a height to width aspect ratio A/S greater than the aspect ratio A/B of the base.Type: GrantFiled: November 17, 2017Date of Patent: May 5, 2020Assignee: Hutchinson Technology IncorporatedInventors: Douglas P. Riemer, Kurt C. Swanson, Peter F. Ladwig
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Publication number: 20200090852Abstract: A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.Type: ApplicationFiled: November 22, 2019Publication date: March 19, 2020Inventors: Douglas P. Riemer, Kurt C. Swanson, Peter F. Ladwig, Matthew S. Lang, Paul V. Pesavento, Joseph D. Starkey
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Patent number: 10570525Abstract: A gold electroplating solution includes a gold (III) cyanide compound, a chloride compound, and hydrochloric acid. The gold (III) cyanide compound is potassium gold (III) cyanide, ammonium gold (III) cyanide, or sodium gold (III) cyanide. The chloride compound is potassium chloride, ammonium chloride, or sodium chloride. Various structures may be made with the gold electroplating solution having a gold layer deposited directly on the stainless steel (SST) layer using a photolithography process. Such structures include a gold pattern having a discontinuous pattern, a bond pad region having one or more traces on the opposite side of the dielectric layer, a gimbal having gold bond pads, and a bonding joint having an electrical interface including a gold layer.Type: GrantFiled: January 15, 2016Date of Patent: February 25, 2020Assignee: Hutchinson Technology IncorporatedInventors: Kurt C. Swanson, Douglas P. Riemer, Steven A. Fank
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Publication number: 20200023534Abstract: A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.Type: ApplicationFiled: September 27, 2019Publication date: January 23, 2020Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel, Patrick R. LaLonde
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Patent number: 10500748Abstract: A chemically etched cutting tool includes a metal base having a first side and a second side, and a chemically etched blade on at least one side of the metal base, the chemically etched blade forming a cutting edge at the intersection of the first side of the chemically etched blade and the second side of the chemically etched blade. The first side of the chemically etched blade includes one or more concave portions and one or more convex portions with at least one inflection point between the concave portions and one or more convex portions. The second side of the chemically etched blade includes one or more concave portions and one or more convex portions with at least one inflection point between the concave portions and one or more convex portions.Type: GrantFiled: March 1, 2016Date of Patent: December 10, 2019Assignee: Hutchinson Technology IncorporatedInventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel
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Patent number: 10478984Abstract: A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.Type: GrantFiled: December 18, 2017Date of Patent: November 19, 2019Assignee: Hutchinson Technology IncorporatedInventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel
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Publication number: 20180142370Abstract: Devices including high-aspect ratio electroplated structures and methods of forming high-aspect ratio electroplated structures are described. A method for manufacturing metal structures includes providing a substrate having a metal base characterized by a height to width aspect ratio A/B and electroplating a metal crown on the base to form the metal structure with a height to width aspect ratio A/S greater than the aspect ratio A/B of the base.Type: ApplicationFiled: November 17, 2017Publication date: May 24, 2018Inventors: Douglas P. Riemer, Kurt C. Swanson, Peter F. Ladwig
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Publication number: 20180104837Abstract: A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.Type: ApplicationFiled: December 18, 2017Publication date: April 19, 2018Inventors: Paul V. Pesavento, Peter F. Ladwig, Michael W. Davis, John A. Theget, Kurt C. Swanson, Joel B. Michaletz, Philip W. Anderson, Timothy A. McDaniel
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Publication number: 20180005655Abstract: A system and methods for manufacturing devices such as flexures using process coupons are described are described. The method including performing a test on at least one feature of a coupon, the coupon is included on an assembly sheet used in manufacturing flexures. The at least one feature is produced by a manufacturing processing step that is used to produce a portion of a flexure. And, the physical characteristics of the feature include at least one physical characteristic that is different than physical characteristics of the portion. The method also including determining the manufacturing processing step will produce an abnormal portion of a flexure based on the performed test. Further, the method includes adjusting the manufacturing processing step and manufacturing a portion of a flexure using the adjusted manufacturing processing step.Type: ApplicationFiled: May 18, 2017Publication date: January 4, 2018Inventors: Kurt C. Swanson, Brian D. Boudreau