Abstract: A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.

Abstract: A method for forming a cutting tool includes masking a metal base with one or more masks, the one or more masks including at least one variable permeability mask, and chemically etching the masked metal base to form a blade of the cutting tool.

Abstract: A chemically etched cutting tool includes a metal base having a first side and a second side, and a chemically etched blade on at least one side of the metal base, the chemically etched blade forming a cutting edge at the intersection of the first side of the chemically etched blade and the second side of the chemically etched blade. The first side of the chemically etched blade includes one or more concave portions and one or more convex portions with at least one inflection point between the concave portions and one or more convex portions. The second side of the chemically etched blade includes one or more concave portions and one or more convex portions with at least one inflection point between the concave portions and one or more convex portions.

Abstract: A gold electroplating solution includes a gold (III) cyanide compound, a chloride compound, and hydrochloric acid. The gold (III) cyanide compound is potassium gold (III) cyanide, ammonium gold (III) cyanide, or sodium gold (III) cyanide. The chloride compound is potassium chloride, ammonium chloride, or sodium chloride. Various structures may be made with the gold electroplating solution having a gold layer deposited directly on the stainless steel (SST) layer using a photolithography process. Such structures include a gold pattern having a discontinuous pattern, a bond pad region having one or more traces on the opposite side of the dielectric layer, a gimbal having gold bond pads, and a bonding joint having an electrical interface including a gold layer.

Abstract: Various embodiments concern a dual stage actuation flexure having a motor contact paddle for connecting to a terminal of a piezoelectric motor. The flexure comprises a paddle having a top side and a bottom side, the paddle comprising at least one void, each void extending through the paddle from the bottom side to the top side. The paddle further comprises a stainless steel base, a conductor comprising a layer of metal, and a dielectric layer having a first section and a second section, the first section positioned between the conductor and the stainless steel base to overlap the stainless steel base and the second section extending beyond the stainless steel base to not overlap the stainless steel base. The bottom side of the paddle is configured to connect to the terminal with electrically conductive adhesive.

Abstract: Various embodiments concern a dual stage actuation flexure having a motor contact paddle for connecting to a terminal of a piezoelectric motor. The flexure comprises a paddle having a top side and a bottom side, the paddle comprising at least one void, each void extending through the paddle from the bottom side to the top side. The paddle further comprises a stainless steel base, a conductor comprising a layer of metal, and a dielectric layer having a first section and a second section, the first section positioned between the conductor and the stainless steel base to overlap the stainless steel base and the second section extending beyond the stainless steel base to not overlap the stainless steel base. The bottom side of the paddle is configured to connect to the terminal with electrically conductive adhesive.

Abstract: Multi-layer ground plane structures and methods of manufacture for integrated lead suspension flexures. A flexure in accordance with one embodiment of the invention includes an insulating layer, a plurality of traces on the insulating layer and a stainless steel base layer on the side of the insulating layer opposite the traces. The stainless steel base layer includes one or more void portions with voids in the base layer opposite the insulating layer from the traces and one or more backed portions with the base layer backing the traces. A plurality of patterned and transversely-spaced first conductive ground planes are located opposite the insulating layer from the traces at the void portions and backed portions of the stainless steel base layer. A continuous gold second conductive ground plane is located opposite the insulating layer and the first ground planes from the side of the insulating layer adjacent to the traces at the void portions and backed portions of the stainless steel base layer.

Abstract: Multi-layer ground plane structures and methods of manufacture for integrated lead suspension flexures. A flexure in accordance with one embodiment of the invention includes an insulating layer, a plurality of traces on the insulating layer and a stainless steel base layer on the side of the insulating layer opposite the traces. The stainless steel base layer includes one or more void portions with voids in the base layer opposite the insulating layer from the traces and one or more backed portions with the base layer backing the traces. A plurality of first conductive ground planes are located between the stainless steel base layer and the insulating layer opposite the insulating layer from the traces at the backed portions of the stainless steel base layer. A continuous second conductive ground plane is located opposite the insulating layer from the traces at the void portions and backed portions of the stainless steel base layer.

Abstract: Multi-layer ground plane structures and methods of manufacture for integrated lead suspension flexures. A flexure in accordance with one embodiment of the invention includes an insulating layer, a plurality of traces on the insulating layer and a stainless steel base layer on the side of the insulating layer opposite the traces. The stainless steel base layer includes one or more void portions with voids in the base layer opposite the insulating layer from the traces and one or more backed portions with the base layer backing the traces. A plurality of patterned and transversely-spaced first conductive ground planes are located opposite the insulating layer from the traces at the void portions and backed portions of the stainless steel base layer. A continuous gold second conductive ground plane is located opposite the insulating layer and the first ground planes from the side of the insulating layer adjacent to the traces at the void portions and backed portions of the stainless steel base layer.

Abstract: Multi-layer ground plane structures and methods of manufacture for integrated lead suspension flexures. A flexure in accordance with one embodiment of the invention includes an insulating layer, a plurality of traces on the insulating layer and a stainless steel base layer on the side of the insulating layer opposite the traces. The stainless steel base layer includes one or more void portions with voids in the base layer opposite the insulating layer from the traces and one or more backed portions with the base layer backing the traces. A plurality of patterned and transversely-spaced first conductive ground planes are located opposite the insulating layer from the traces at the void portions and backed portions of the stainless steel base layer. A continuous gold second conductive ground plane is located opposite the insulating layer and the first ground planes from the side of the insulating layer adjacent to the traces at the void portions and backed portions of the stainless steel base layer.

Abstract: Multi-layer ground plane structures and methods of manufacture for integrated lead suspension flexures. A flexure in accordance with one embodiment of the invention includes an insulating layer, a plurality of traces on the insulating layer and a stainless steel base layer on the side of the insulating layer opposite the traces. The stainless steel base layer includes one or more void portions with voids in the base layer opposite the insulating layer from the traces and one or more backed portions with the base layer backing the traces. A plurality of first conductive ground planes are located between the stainless steel base layer and the insulating layer opposite the insulating layer from the traces at the backed portions of the stainless steel base layer. A continuous second conductive ground plane is located opposite the insulating layer from the traces at the void portions and backed portions of the stainless steel base layer.

Abstract: A method for manufacturing an integrated lead suspension component. One or more first conductive ground planes are formed on a stainless steel base layer. One or more second conductive ground planes, including portions on the surface of the first conductive ground planes, are formed at void portions and backed portions of the stainless steel base layer. The material of the second conductive ground planes is non-reactive to a first etchant. An insulating layer is formed on the second ground planes on the side opposite the stainless steel base layer and on the stainless steel base layer. Traces are formed on the insulating layer. Voids are formed in void portions of the stainless steel base layer using the first etchant and the second conductive ground planes at the void portions as etch stops.

Abstract: A method of manufacturing an integrated lead head suspension flexure of the type having conductors on a spring metal layer capable of being etched by a first etching process. The method includes forming a patterned layer having gaps one or more flying lead regions of dielectric material on a major surface of the spring metal layer and forming one or more conductive leads on the flexure, including onto the dielectric material and over exposed spring metal at the gap at each flying lead region. At least the flying lead portion of the conductive lead is formed from conductive material resistant to the first etching process. The method also includes etching a flying lead region of the spring metal layer to remove a portion of the spring metal layer in the flying lead region and expose the flying lead portions of the conductive lead.

Abstract: A method for forming an electrical interconnect on an integrated lead suspension or suspension component of the type formed from a laminated sheet of material having a stainless steel layer, a conductive lead layer and an insulating layer separating the stainless steel and conductive lead layers. An aperture is formed through at least the insulating layer to expose the stainless steel layer at an interconnect site. An interconnect mask is applied around the interconnect site. Conductive material is electroplated onto the stainless steel layer at the interconnect site to form a plated interconnect. The mask is then removed. The method is used to form an interconnect bond pad on the same side of the stainless steel layer as the conductive lead layer in one embodiment.

Abstract: A method for fabricating a tubular article having a wall structure defined by a selected pattern. The method includes the steps of providing a tube having an outer surface and an inner surface; coating the outer surface with first photosensitive resist; exposing the selected pattern portions of the coated outer surface; developing the first photosensitive resist coated on the outer surface; coating the inner surface with second photosensitive resist; and exposing the tube to an etchant to form a tubular article having the wall structure defined by the selected pattern. The second photosensitive resist is more brittle than the first photosensitive resist when the first and second photosensitive resist are dry. An apparatus for exposing a photosensitive resist-coated tube to laser. The device includes an elongated tubular member having an aperture extending through its wall.

Abstract: A method of manufacturing an integrated lead head suspension flexure of the type having conductors on a spring metal layer capable of being etched by a first etching process. The method includes forming a patterned layer having gaps one or more flying lead regions of dielectric material on a major surface of the spring metal layer and forming one or more conductive leads on the flexure, including onto the dielectric material and over exposed spring metal at the gap at each flying lead region. At least the flying lead portion of the conductive lead is formed from conductive material resistant to the first etching process. The method also includes etching a flying lead region of the spring metal layer to remove a portion of the spring metal layer in the flying lead region and expose the flying lead portions of the conductive lead.