Abstract: A receptacle is provided for accommodating an analysis chip, which receptacle has openings in a housing having access to the analysis chip, which openings are protected from external influences by a movable protector, and for carrying out an analysis, a mechanism for moving the protector is provided such that an opening in the protector coincides with the receptacle openings.

Abstract: A force measurement element measures an introduced force by means of a double flexural beam and a displacement sensor. The double flexural beam makes possible a double spring shape that makes possible an optimization with regard to elongation distribution.

Abstract: A sensor module, in particular for measuring an acceleration or rotational speed, having a housing base body made of a plastic material, a lead frame extending through the housing base body and having leads which have connector pins for attachment to a circuit board, a sensor system having at least one sensor chip, the sensor system being in contact with the lead frame via conductor bonds, a cover, which is connected to the base body and at least one connector pin and is made of a conductive material. A simple construction having a high shielding effect is achieved due to the fact that the conductive cover is connected to the connector pin. The cover, a lid, for example, may be contacted directly via the connector pin together with the other connector pins when the components are mounted on the circuit board. The sensor module may be molded or may have a premolded housing. The edge or a contact of the cover may be welded, soldered, glued, or pressed to a ground lead of the lead frame.

Abstract: A device for passivating at least one component by a housing and a method for manufacturing the device. A cover is connected to a front side of the substrate to form an inner chamber of the housing in a connection area. The component is attached to the front side of the substrate and inside the inner chamber of the housing, at least one contact line, which is connected in an electrically conductive manner to the component, is electrically insulated in relation to the connection area and is provided in the proximity of at least a part of the connection area between the front side and a rear side of the substrate, which faces away from the front side, or on the rear side of the substrate.

Abstract: A force measurement element measures an introduced force by means of a double flexural beam and a displacement sensor. The double flexural beam makes possible a double spring shape that makes possible an optimization with regard to elongation distribution.

Abstract: A invention relates to a device for detecting incident radiation in the infrared range, including at least one chip assembly for detecting infrared radiation, at least one bonding wire, which starts out from the chip assembly and runs through metallic terminals to the exterior of the housing, as well as passivation material, which is distributed in such a manner, that the at least one bonding wire is, in essence, completely enclosed by the passivation material, and a surface region of the chip assembly facing the incident, infrared radiation is not enclosed by the passivation material.

Abstract: A method for mounting semiconductor chips includes the steps of: a) providing a semiconductor chip having a surface that has a diaphragm region and a peripheral region, the peripheral region having a mounting region; b) providing a substrate which has a surface having a recess; c) mounting the mounting region of the semiconductor chip using a flip-chip technique onto the surface of the substrate in such a way that an edge of the recess lies between the mounting region and the diaphragm region; and d) underfilling the mounting region using an underfilling component, the edge of the recess being used a demarcation region for the underfilling component, so that no underfilling component is able to get into the diaphragm region. Also provided is a corresponding semiconductor chip system.

Abstract: A method for packaging semiconductor chips and a corresponding semiconductor chip system. The method includes making available a semiconductor chip having a diaphragm region; providing a cap over the diaphragm region, while leaving the diaphragm region open; mounting the semiconductor chip on a support frame; and providing a molded housing around the semiconductor chip and at least a partial region of the support frame for packaging the semiconductor chip.

Abstract: A invention relates to a device for detecting incident radiation in the infrared range, including at least one chip assembly for detecting infrared radiation, at least one bonding wire, which starts out from the chip assembly and runs through metallic terminals to the exterior of the housing, as well as passivation material, which is distributed in such a manner, that the at least one bonding wire is, in essence, completely enclosed by the passivation material, and a surface region of the chip assembly facing the incident, infrared radiation is not enclosed by the passivation material.

Abstract: A substrate having a collar, which features a marking. The substrate, in particular a thin-layer substrate, may be processed in a process having at least one micromechanical process step. In this context, given at least one micromechanical process step the successful performance of the process step is a function of the fixation of the substrate in a first position. This first position is understood as a relative position of the substrate in space. The marking on the collar advantageously allows the substrate to be aligned with regard to the first position.

Abstract: A sensor module, in particular for measuring an acceleration or rotational speed, having a housing base body made of a plastic material, a lead frame extending through the housing base body and having leads which have connector pins for attachment to a circuit board, a sensor system having at least one sensor chip, the sensor system being in contact with the lead frame via conductor bonds, a cover, which is connected to the base body and at least one connector pin and is made of a conductive material. A simple construction having a high shielding effect is achieved due to the fact that the conductive cover is connected to the connector pin. The cover, a lid, for example, may be contacted directly via the connector pin together with the other connector pins when the components are mounted on the circuit board. The sensor module may be molded or may have a premolded housing. The edge or a contact of the cover may be welded, soldered, glued, or pressed to a ground lead of the lead frame.

Abstract: A method is proposed for welding a first component part to a second component part, the energy to melt melting regions being supplied by a laser beam. In this context, the laser beam is directed through the first component part, which is made of a nonabsorbing material, to the second component part. The second component part is made of a material which strongly absorbs laser beam. At least one stop is provided outside melting regions.

Abstract: A device and method for measuring at least one of a force component and a torque component. The device includes a deformation member, for measuring at least one of a force component and torque component, a separate measuring element, configured to measure at least one force component, and an electronics unit, connected to the measuring element configured to evaluate a measuring signal of the measuring element. The deformation member includes a base part and at least one tongue movable with respect to the base part. The base part is arranged so that a gap between the measuring element and the tongue has a gap width variable in response to the force component introduced onto the deformation member. The measuring element is configured to convert a change in the gap width into a measuring signal. The method includes the step of changing the gap width between the tongue and the measuring element by introducing the force component into the deformation member.

Abstract: A method for producing a pressure sensor, in which a semiconductor pressure pick-up is mounted on a mounting section of a lead grid, in particular a leadframe. The semiconductor pressure pick-up is electrically connected to contact sections of the lead grid. The lead grid, together with the semiconductor pressure pick-up, is inserted into an injection molding die. A die part is brought into contact at the side of the semiconductor pressure pick-up facing away from the mounting section or at side of the mounting section facing away from the semiconductor pressure pick-up. The semiconductor pressure pick-up in the injection molding die is subsequently enclosed by a housing made of mold compound. In order to prevent the mounting section from giving way, it is proposed to clamp the mounting section of the lead grid in the injection molding die when producing the housing.

Abstract: A method is proposed for welding a first component part to a second component part, the energy to melt melting regions being supplied by a laser beam. In this context, the laser beam is directed through the first component part, which is made of a nonabsorbing material, to the second component part. The second component part is made of a material which strongly absorbs laser beam. At least one stop is provided outside melting regions.

Abstract: A receptacle is described for accommodating an analysis chip (40), which has openings (12a, 12b; 12c, 25) in housing (10) having access to analysis chip (40), which are protected from external influences by a movable protector (30), and which, for carrying out an analysis, is applied in a device which has a mechanism for opening the protector (30).

Abstract: An electronic device, including a housing part having at least one closable opening and one plug-in part, the housing part accommodating a printed circuit board, which has at least one electrical and/or electronic component arranged thereon, and electrical contact elements, which are electrically connected to the plug-in part, and which have ends in the housing interior that run parallel to each other and protrude in the direction of the at least one opening, the ends being passed through contact openings of the printed circuit board and being connected conductively to the printed circuit board.

Abstract: The present invention relates to a device for measuring a force component or torque component, in particular weight, the device having a deformation member and a separate measuring element (5) for measuring at least one force component, and an electronics unit (6) connected to the measuring element (5) for evaluating a measuring signal of the measuring element (5). The present invention also relates to a method for measuring with the aid of such a device.

Abstract: A sealed housing for an electronic device has a housing bottom part which has a first contact surface; a housing top part which has a second contact surface; the housing bottom part being connectable to the housing top part; and a seal which is insertable between the housing bottom part and the housing top part so that it contacts the first contact surface and the second contact surface to form a seal when the housing bottom part and the housing top part are joined. The seal is in the form of a continuous disk.

Abstract: A micromechanical component includes a substrate and a movable structure situated on the surface of the substrate. The movable structure is movable parallel to the surface of the substrate. The structure is surrounded by a frame having a cap attached to it. In the area of the movable element, the cap has a stop limiting the movement of the movable element in a direction perpendicular to the surface of the substrate.