Patents by Inventor Kurt Weiblen
Kurt Weiblen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6661668Abstract: A housing, in particular a housing for electronic components, which includes a housing part which is made of plastic and has at least one opening, and a lid part for closing off the opening. It is proposed that the lid part is produced as a metal punched part, the punched edge of the lid part having a punch ridge on a first side of the lid part and a punch indentation on a second side opposite the first side, and the lid part being pressed into the opening of the housing part via the second side so that the lid part comes to rest against assigned sections of the inner wall of the opening via at least two edge sections that are distributed around the perimeter of the lid part and bites into the assigned sections of the inner wall in a barb-like manner via the punch ridge.Type: GrantFiled: May 31, 2002Date of Patent: December 9, 2003Assignee: Robert Bosch GmbHInventor: Kurt Weiblen
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Patent number: 6528868Abstract: A lead frame device having a lead frame made of copper, copper alloy or copper compound having a die pad area, within which a chip is to be mounted, and having a multiplicity of leads, which are arranged around the die pad area; and having a die pad made of silicon which is mounted in the die pad area on the lead frame to accommodate the chip.Type: GrantFiled: October 12, 2000Date of Patent: March 4, 2003Assignee: Robert Bosch GmbHInventors: Kurt Weiblen, Stefan Pinter, Frieder Haag
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Publication number: 20020181220Abstract: A sealed housing for an electronic device has a housing bottom part which has a first contact surface; a housing top part which has a second contact surface; the housing bottom part being connectable to the housing top part; and a seal which is insertable between the housing bottom part and the housing top part so that it contacts the first contact surface and the second contact surface to form a seal when the housing bottom part and the housing top part are joined. The seal is in the form of a continuous disk.Type: ApplicationFiled: January 8, 2002Publication date: December 5, 2002Inventors: Kurt Weiblen, Frieder Haag
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Publication number: 20020170341Abstract: A system for measuring the properties of liquids, in particular, for measuring the viscosity of a liquid, includes a piezoelectric sensor device, which is completely immersed in liquid and has electric contact points for an electric control which are resistant with regard to the liquid. The piezoelectric sensor device includes electric lead conductors, which are resistant with regard to the liquid and are connectable to an electronic control/analyzer unit outside of liquid and to contact points within the sensor device by a suitable conductive adhesive containing metal particles.Type: ApplicationFiled: March 15, 2002Publication date: November 21, 2002Inventors: Bernhard Jakoby, Kurt Weiblen, Volker Brielmann
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Publication number: 20020153155Abstract: The present invention relates to a housing, in particular a housing for electronic components, which includes a housing part (2) which is made of plastic and has at least one opening (4), and a lid part (1) for closing off the opening (4). It is proposed that the lid part (1) is produced as a metal punched part, the punched edge (14) of the lid part having a punch ridge (12) on a first side (10) of the lid part and a punch indentation (13) on a second side (11) opposite the first side, and the lid part being pressed into the opening (4) of the housing part (2) via the second side (11) so that the lid part (1) comes to rest against assigned sections (7a) of the inner wall (7) of the opening (4) via at least two edge sections (14a) that are distributed around the perimeter of the lid part and bites into the assigned sections (7a) of the inner wall (7) in a barb-like manner via the punch ridge (12).Type: ApplicationFiled: May 31, 2002Publication date: October 24, 2002Inventor: Kurt Weiblen
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Publication number: 20020149916Abstract: The proposal relates to an electronic device, including a housing part having at least one closable opening and one plug-in part, the housing part accommodating a printed circuit board, which has at least one electrical and/or electronic component arranged thereon, and electrical contact elements, which are electrically connected to the plug-in part, and which have ends in the housing interior that run parallel to each other and protrude in the direction of the at least one opening, the ends being passed through contact openings of the printed circuit board and being connected conductively to the printed circuit board.Type: ApplicationFiled: May 13, 2002Publication date: October 17, 2002Inventors: Juergen Kurle, Kurt Weiblen, Stefan Pinter, Frieder Haag
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Patent number: 6354153Abstract: A pressure sensor device has a mounting rack and a sensor casing arranged on the mounting rack and closed except for one opening. The pressure sensor includes a pressure pickup that is arranged inside the sensor casing and electrically connected to the mounting rack. Also included in the pressure sensor is a pressure connection which includes a connector and a pressure channel having an inlet and an outlet, with the pressure connection being designed as a molded part produced independently of the sensor casing and securable on the mounting rack. An outlet of the pressure channel designed on the molded part is connected at least indirectly to an opening in the sensor casing.Type: GrantFiled: June 26, 2000Date of Patent: March 12, 2002Assignee: Robert Bosch GmbHInventors: Kurt Weiblen, Tore Toennesen
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Patent number: 6300842Abstract: The arrangement for producing electrical oscillations in a Giga hertz region has a Gunn element, a housing in which the Gunn element is accommodated and which has an electrically conductive housing cover, the Gunn element being in electrical contact with the electrically conductive housing cover, and an elastic, electrical contact element clamped between a contact surface of the Gunn element and the housing cover.Type: GrantFiled: February 11, 2000Date of Patent: October 9, 2001Assignee: Robert Bosch GmbHInventors: Manfred Leiter, Kurt Weiblen, Berhard Lucas, Frank Schatz, Thomas Beez, Juergen Seiz, Helmeut Baumann, Herbert Olbrich, Heinz Eisenschmid, Eberhard Moess, Joachim Dutzi, Andreas Kugler
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Patent number: 6300169Abstract: In a method for manufacturing a pressure sensor, in which a semiconductor pressure sensing element is applied to an assembly segment of a lead grid, the semiconductor pressure sensing element is electrically connected to contact segments of the lead grid. The lead grid having the semiconductor pressure sensing element is inserted into an injection molding die, and then the semiconductor pressure sensing element, in the injection molding die, is surrounded by a housing made of injection molding compound. A structure is present in the injection molding die through which a pressure feed for the semiconductor pressure sensing element is left free from the jacket of injection molding compound. A stamp is arranged in the injection molding die so as to be separated by a gap from the side of the assembly segment that is facing away from the semiconductor pressure sensing element or from the side of the semiconductor pressure sensing element that is facing away from the assembly segment.Type: GrantFiled: June 26, 2000Date of Patent: October 9, 2001Assignee: Robert Bosch GmbHInventors: Kurt Weiblen, Anton Doering, Juergen Nieder, Frieder Haag
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Patent number: 6271471Abstract: A housing for an electronic component has a bottom part, a wall part, a cover part which together are adapted to cover the electronic component, a contact spring provided on the cover part for producing an electrical connection with a terminal of the component, the cover part and the contact spring being formed as a one-piece integral element.Type: GrantFiled: December 2, 1999Date of Patent: August 7, 2001Assignee: Robert Bosch GmbHInventors: Manfred Leiter, Kurt Weiblen, Bernhard Lucas, Frank Schatz, Thomas Beez, Juergen Seiz, Helmut Baumann, Herbert Olbrich, Heinz Eisenschmid, Eberhard Moess, Joachim Dutzi, Andreas Kugler
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Patent number: 6106735Abstract: A wafer stack with sensor elements hermetically sealed in caverns and a method of fabricating the sensors permitting a reduction in the size of the sensors formed after cutting the wafer stack and also yielding considerable savings in chip area in the manufacture of the wafer stack. The wafer stack includes bonding strips arranged between the individual sensor elements. The wafer stack is diced to form individual sensors by sawing in the middle through the bonding strips.Type: GrantFiled: January 12, 1998Date of Patent: August 22, 2000Assignee: Robert Bosch GmbHInventors: Jurgen Kurle, Kurt Weiblen, Stefan Pinter, Horst Muenzel, Helmut Baumann, Dietrich Schubert, Karl Bender, Markus Lutz
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Patent number: 6062088Abstract: A pressure sensor includes a metallic membrane and a frame. For detecting the deflection of the membrane, a silicon bridge element having piezoresistive resistor elements is arranged on the membrane and the frame.Type: GrantFiled: March 3, 1999Date of Patent: May 16, 2000Assignee: Robert Bosch GmbHInventors: Kurt Ingrisch, Kurt Weiblen, Hubert Benzel, Botho Ziegenbein, Hans-Peter Trah, Andreas Duell, Karl Bender, Jochen Franz
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Patent number: 6021674Abstract: A pressure sensor includes a housing, a support plate arranged on a mounting surface of the housing, a sensor element arranged in the housing, and at least one connector element joined in electrically conductive fashion to at least one contact surface of the support plate. A method for manufacturing a pressure sensor in such a way that the pressure sensor on the one hand can be manufactured easily and on the other hand is resistant to malfunction and is operational over a long period of time. The at least one connector element is arranged flush with the mounting surface and joined directly to the at least one contact surface. A capillary adhesive layer is arranged between the support plate and the mounting surface.Type: GrantFiled: December 1, 1997Date of Patent: February 8, 2000Assignee: Robert Bosch GmbHInventors: Walter Roethlingshoefer, Kurt Weiblen, Ulrich Goebel
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Patent number: 5723784Abstract: The invention proposes a device for measuring the mass of a flowing medium, in particular the mass of air aspirated by internal combustion engines. The device has a platelike sensor element which is accommodated in a recess of a sensor carrier, and which with a sensor region that has at least one measuring resistor is exposed to the flowing medium in order to measure its mass. The sensor element is accommodated essentially flush in the recess and is retained in the recess by being glued to a bottom face in the recess. The bottom face of the recess of the sensor carrier has a troughlike indentation, which extends at least partially along the circumference of the sensor element outside the sensor region that has the at least one measuring resistor. The device according to the invention is intended to measure the mass of a flowing medium, in particular for measuring the mass of air aspirated by internal combustion engines.Type: GrantFiled: July 8, 1996Date of Patent: March 3, 1998Assignee: Robert Bosch GmbHInventors: Manfred Lembke, Josef Kleinhans, Hans Hecht, Helmut Bassler, Gerhard Hueftle, Alexander Kromer, Kurt Weiblen, Stefan Lehenberger, Guenther Frick, Klaus Reymann, Axel-Werner Haag, Dieter Tank, Uwe Konzelmann, Waldemar Guenther, Henninge Marberg
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Patent number: 5721377Abstract: In an angular velocity sensor, an acceleration sensor is arranged on a resonator formed of a multilayer substrate and attached to a resonating bar. The multilayer substrate includes a top silicon layer, an insulating sacrificial layer arranged below the top silicon layer, and a bottom silicon layer arranged below the insulating sacrificial layer. An excitor causes the resonator to vibrate while a limit stop, configured out of the multilayer substrate, limits the movement of the resonator.Type: GrantFiled: July 22, 1996Date of Patent: February 24, 1998Assignee: Robert Bosch GmbHInventors: Juergen Kurle, Kurt Weiblen, Horst Muenzel, Helmut Baumann, Klaus Heyers, Markus Lutz
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Patent number: 5648615Abstract: A pressure sensor for connection to a circuit board includes a silicon chip arranged in a housing so that one surface of the silicon chip faces the circuit board, and pressure is applied on the silicon chip surface facing away from the circuit board. The pressure sensor configuration is easy to produce and allows simple installation of the pressure sensor on the circuit board.Type: GrantFiled: September 30, 1994Date of Patent: July 15, 1997Assignee: Robert Bosch GmbHInventors: Rainer Jeske, Kurt Weiblen, Dieter Arand
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Patent number: 5646347Abstract: A suspension or an acceleration sensor having a suspension is proposed, by means of which a micromechanical structure or the acceleration sensor is anchored on a substrate. The suspension takes place by means of lever elements on which an equalizing beam acts. The lever elements are deformed by the stresses in the equalizing beam with respect to the substrate in such a way that the stresses in the microstructure with respect to the substrate are either compensated for or, alternatively, are converted from compressive stresses to tensile stresses or from tensile stresses to compressive stresses.Type: GrantFiled: August 31, 1995Date of Patent: July 8, 1997Assignee: Robert Bosch GmbHInventors: Kurt Weiblen, Michael Offenberg, Bernhard Elsner
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Patent number: 5606117Abstract: The pressure sensor for a combustion chamber includes a housing; a membrane closing the housing on its combustion chamber side; a monocrystalline silicon chip inside the housing and including a sensor circuit device provided with a bridge circuit device including a piezoresistor producing an electrical signal in response to applied pressure and a plunger positioned between the membrane and the silicon chip to transmit a pressure in the combustion chamber to the piezoresistor. The bridge circuit device is connected to an amplifier circuit located on the silicon chip. The amplifier circuit includes amplifier resistors having resistance values determinative of the offset of the signal and sensor sensitivity. A network circuit for offset and sensitivity adjustments is provided on the silicon chip and includes four adjusting circuits for offset, sensor sensitivity, temperature compensation of offset and for temperature compensation of sensor sensitivity.Type: GrantFiled: December 16, 1994Date of Patent: February 25, 1997Assignee: Robert Bosch GmbHInventors: Manfred Vogel, Werner Herden, Jiri Marek, Kurt Weiblen
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Patent number: 5600074Abstract: A force sensor employing a silicon chip having a force application area on a top surface and attached to a support at a bottom surface. Piezoresistive elements are arranged on the silicon chip in areas of high mechanical tension and produce signals. Circuits, which receive the signals produced by the piezoresistive elements, are arranged on the silicon chip in areas of low mechanical tension. The areas of mechanical tension may be influenced by providing grooves and/or recesses in the bottom surface of the silicon chip and by providing grooves in the top surface of the silicon chip.Type: GrantFiled: May 10, 1994Date of Patent: February 4, 1997Assignee: Robert Bosch GmbHInventors: Jiri Marek, Frank Bantien, Steffen Schmidt, Kurt Weiblen, Matthias Kuesell, Werner Herden
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Patent number: 5547730Abstract: In a device and a method for passivating components, a thixotropic gel is arranged in the shape of a ring around a component. The inside space surrounded by the thixotropic gel is filled with a passivating gel until the component is completely covered with passivating gel. The gels are subsequently hardened.Type: GrantFiled: January 23, 1995Date of Patent: August 20, 1996Assignee: Robert Bosch GmbHInventors: Kurt Weiblen, Bertram Woessner