Abstract: The present disclosure provides a display device for inspecting image data that may include a data processing device configured to generate first cyclic redundancy check (CRC) data for a partial area among areas of image data included in a first frame to transmit the image data of the first frame and the first CRC data and a data driving device configured to receive the image data of the first frame and the first CRC data from the data processing device to generate second CRC data for a partial area among areas of the image data included in the first frame on the basis of the image data of the first frame and to compare the first CRC data with the second CRC data to determine whether there is an error in the partial area among areas of the image data included in the first frame.

Abstract: A scroll compressor including a housing, a motor in the housing, an orbiting scroll, and a fixed scroll. An injection valve assembly is provided between the fixed scroll and the housing and further includes a cover plate, a valve plate, a gasket retainer, and an injection valve. The compressor capable of increasing a surface pressure at a position at which the injection valve of the injection valve assembly needs to be supported, and preventing deformation of the gasket retainer by reducing a bead height of the gasket retainer.

Abstract: Provided is a deposition apparatus for an organic light emitting diode, in which maint operations with deposition material are carried out independently by including an auxiliary chamber, thereby shortening the evaluation time of a deposition material.

Abstract: A display apparatus includes: a display panel including a light emitting structure and including a main display area, a left edge display area adjacent to the main display area, and a right edge display area adjacent to the main display area; and a first pattern film attached under the display panel and overlapping with the main display area and the left and right edge display areas, the first pattern film having a stiffness higher than a stiffness of the display panel, and a stress dispersing portion is located on the first pattern film.

Abstract: A sublimation purification apparatus that includes a vacuum chamber; a tube housing positioned in the vacuum chamber; a boat in close contact with the tube housing; and heating units positioned adjacent to an outer surface of the boat and an outer surface of the tube housing, respectively, wherein a sublimation purification target material is contained in the boat, and at least one of the boat and the tube housing is formed of a metal.

Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

Abstract: A display apparatus includes: a display panel including a light emitting structure and including a main display area, a left edge display area adjacent to the main display area, and a right edge display area adjacent to the main display area; and a first pattern film attached under the display panel and overlapping with the main display area and the left and right edge display areas, the first pattern film having a stiffness higher than a stiffness of the display panel, and a stress dispersing portion is located on the first pattern film.

Abstract: A sublimation purification apparatus that includes a vacuum chamber; a tube housing positioned in the vacuum chamber; a boat in close contact with the tube housing; and heating units positioned adjacent to an outer surface of the boat and an outer surface of the tube housing, respectively, wherein a sublimation purification target material is contained in the boat, and at least one of the boat and the tube housing is formed of a metal.

Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

Abstract: A backlight assembly includes a first light guide plate, a second light guide plate, a light source part and a cover part. The second light guide plate is spaced apart from the first light guide plate. The light source part includes a first light source providing light to the first light guide plate and a second light source providing light to the second light guide plate. The cover part is disposed over the light source part. The cover part overlaps with a portion of the first light guide plate and a portion of the second light guide plate. A display apparatus having the above configuration has a narrow bezel and a thin profile.

Abstract: A backlight assembly includes a first light guide plate, a second light guide plate, a light source part and a cover part. The second light guide plate is spaced apart from the first light guide plate. The light source part includes a first light source providing light to the first light guide plate and a second light source providing light to the second light guide plate. The cover part is disposed over the light source part. The cover part overlaps with a portion of the first light guide plate and a portion of the second light guide plate. A display apparatus having the above configuration has a narrow bezel and a thin profile.

Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

Abstract: Provided is an organic light emitting diode including an organic light-emitting part including a first electrode, an organic material layer having a light-emitting layer, and a second electrode, and an encapsulating layer included on an entire top surface of the organic light-emitting part. Here, the encapsulating layer has a structure in which at least two of a water barrier film, a glass cap, a metal foil and a conductive film are stacked. Accordingly, the diode may have excellent water and oxygen barrier effects, and deterioration of the diode or running failure may be prevented.

Abstract: An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

Abstract: An adhesive film, and a product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable hot-melt adhesive layer including a curable resin and a moisture absorbent, and the curable hot-melt adhesive layer includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer.

Abstract: Provided is a backlight unit within a liquid crystal display (LCD) device where the backlight unit includes one or more light-emitting diodes (LEDs) mounted on a printed circuit board (PCB). Positioning of the PCB and its LEDs is provided by a PCB fixing member which includes a base portion and a support portion extending upward from a surface of the base portion. The PCB fixing member is structured to transfer heat energy away from the PCB and to an attached portion of the LCD device such as to a lower housing which houses the PCB and the PCB fixing member. The PCB fixing member includes a press-fit insertion groove into which at least part of the PCB can be easily inserted, thus simplifying manufacturing while assuring appropriate heat dissipation.