Abstract: A heat dissipating structure for IC chip of a plasma display module, and a plasma display module having the same with improved the heat dissipating performance of the IC chip while preventing the spread of foreign matter emanating from the heat-dissipating sheet. The structure includes a chassis including a chassis bending part and a chassis base, the IC chip contacting the chassis bending part and connected to a signal transmitting member, a cover plate arranged on the chassis bending part and facing the IC chip, a chip heat-dissipating sheet arranged between the IC chip and the cover plate, the chip-heat dissipating sheet made out of graphite and a thermally conductive member also arranged between the IC chip and the cover plate, the thermally conductive member adapted to contact and cover the chip heat-dissipating sheet.

Abstract: A plasma display module includes a plasma display panel for displaying a visible image, a chassis supporting the plasma display panel and having at least one hole therein, and at least one heat dissipating fan disposed to face the at least one hole.

Abstract: A plasma display module includes a plasma display panel displaying images using a gas discharge phenomenon, and a color temperature compensation filter in a viewing path of the plasma display panel, the color temperature compensation filter having at least one transparent region, e.g., a hole, in the viewing path.

Abstract: Provided is a display module having an improved heatsink. The display module includes a display panel adapted to display an image, a chassis adapted to support the display panel, a driver circuit unit arranged on the chassis and adapted to generate an electrical signal that drives the display panel, an integrated circuit arranged on a signal transmitting unit, the integrated circuit being adapted to control signal transmission between the driver circuit unit and the display panel and at least one heatpipe arranged on a side of the chassis opposite the display panel, the heatpipe being adapted to transfer heat generated by the IC chip to the chassis.

Abstract: A plasma display module including a plasma display panel adapted to display an image with gas discharge, a chassis adapted to support the plasma display panel, a driving unit arranged on the chassis and adapted to generate an electrical signal that drives the plasma display panel, an integrated circuit chip arranged on a signal transmitting unit, the integrated circuit chip being adapted to control electrical signal transfer between the driving unit and the plasma display panel, a cover plate arranged on the signal transmitting unit and adapted to cover the integrated circuit chip and a wave-type heat dissipating plate arranged on the cover plate

Abstract: A plasma display apparatus includes a plasma display panel including a display area where an image is displayed and an auxiliary display member surrounding the display area of the plasma display panel. The auxiliary display member causes a user to think that he/she is seeing a screen that appears larger than it really is.

Abstract: A heat dissipating apparatus for an IC chip, having a structure capable of effectively dissipating heat created by an IC chip to the outside, and a display module including the same are disclosed. In one embodiment, the display module includes a panel that forms an image, a chassis disposed at the rear of the panel to support the panel, at least one IC chip that emits heat mounted on at least one circuit board installed at the rear of the chassis, and a heat dissipating apparatus that dissipates heat emitted by the IC chip to the outside. The heat dissipating apparatus is attached to contact the IC chip, and has a heat conducting chip contact plate, and a heat conducting heat discharging plate formed in one piece with a plurality of mutually proximal joining portions joined to the chip contact plate, and a plurality of heat dissipating portions bent to protrude outward from the joining portions to connect the joining portions.

Abstract: A plasma display apparatus that includes a plasma display panel adapted to display an image, a chassis base arranged at a rear of the plasma display panel, a circuit unit arranged on the chassis base and adapted to drive the plasma display panel and a heat dissipation unit arranged between the plasma display panel and the chassis base, the heat dissipation unit comprising a first heat dissipation element comprised of a material that produces debris, a first heat dissipation element arranged parallel to both the plasma display panel and the chassis base and adapted to dissipate heat generated by the plasma display panel and a second heat dissipation element covering at least a portion of the first heat dissipation element and being adapted to prevent debris from being released from the first heat dissipation element.

Abstract: A touch screen plasma display includes: a Plasma Display Panel (PDP) adapted to display images by a gas discharge, and including a front substrate, front electrodes extending in a predetermined direction on a rear portion of the front substrate, a rear substrate facing the front substrate, rear electrodes extending in a direction crossing the front electrodes on a front portion of the rear substrate, barrier ribs arranged between the front substrate and the rear substrate to define discharge spaces where the front and rear electrodes are commonly disposed, phosphor layers arranged in the discharge spaces, and a discharge gas contained within the discharge spaces; an image displaying circuit unit adapted to supply driving control signals to the front electrodes and the rear electrodes to cause the PDP to display the images; and a position detecting circuit unit adapted to communicate with the image displaying circuit unit, to detect position information signals from the front and rear electrodes generating ind

Abstract: A plasma display panel (PDP) including a first substrate, a second substrate, a plurality of discharge cells arranged between the first substrate, a plurality of electrodes, and a plurality of phosphor portions, the second substrate arranged to at least partially overlap with the first substrate, the plurality of phosphor portions including a first group of the plurality of phosphor portions arranged on the first substrate, and a second group of phosphor portions arranged on the second substrate.

Abstract: A circuit board having a first IC chip mounted thereon, and a first heat sink having a base portion disposed to contact a surface of the first IC chip and having a plurality of heat-dissipating fins, wherein the heat-dissipating fins extend away from the base portion and are inclined at an angle other than 90° from an imaginary horizontal plane.

Abstract: A plasma display device for efficiently dissipating heat from a driver IC packaged in a form of a tape carrier package.

Abstract: A heat dissipation structure of an intelligent power module includes a chassis base, a drive circuit board arranged on the chassis base, an intelligent power module arranged at a side of the drive circuit board, the intelligent power module comprising a plurality of circuit devices, a first heat dissipater having one surface contacting a surface of the intelligent power module, the first heat dissipater being adapted to dissipate heat generated by operation of the plurality of circuit devices, and a second heat dissipater having one side arranged in contact with another surface of the first heat dissipater and another side arranged to contact a surface of the chassis base.

Abstract: A plasma display apparatus includes: a Plasma Display Panel (PDP) adapted to display images; a chassis base arranged on a rear portion of the PDP; printed circuit boards arranged on a rear portion of the chassis base and adapted to drive the PDP, the printed circuit boards including substrate connectors respectively arranged at front portions thereof; and connection cables adapted to electrically connect the PDP to the printed circuit boards and to electrically connect the printed circuit boards to each other, the connection cables including a wiring member and a cable connector having two sides. One side of the cable connector is affixed to the chassis base and the other side of the cable connector is coupled to one of the substrate connectors and to at least an end of the wiring member.

Abstract: A gap forming structure for use with water cooled nuclear reactors is invented to prevent overheating and ultimately structurally failing of the lower head of a reactor vessel in a nuclear reactor core meltdown accident by virtue of a cooling effect in the gap structure for facilitating the retention of accumulated molten core debris. Single layer or multilayer gap structures can be installed either inside or outside the vessel lower head by joining, or fastening structures or secured to the instruments/control guide tubes within the vessel. The water cooling capacity inside the gap can prevent the vessel lower head from overheating and subsequently failing and thus defend against severe accidents by preventing the lower head of the reactor vessel from rupturing.