Patents by Inventor Kwang-Jin Jung
Kwang-Jin Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136674Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on a winding axis to define a core and an outer circumference. The first electrode includes a first active material portion coated with an active material layer and a first uncoated portion not coated with an active material layer along a winding direction. At least a part of the first uncoated portion is defined as an electrode tab by itself. The first uncoated portion includes a first portion adjacent to the core of the electrode assembly, a second portion adjacent to the outer circumference of the electrode assembly, and a third portion interposed between the first portion and the second portion. The first portion or the second portion has a smaller height than the third portion in the winding axis direction.Type: ApplicationFiled: January 19, 2022Publication date: April 25, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Jong-Sik PARK, Jae-Won LIM, Yu-Sung CHOE, Hak-Kyun KIM, Je-Jun LEE, Byoung-Gu LEE, Duk-Hyun RYU, Kwan-Hee LEE, Jae-Eun LEE, Pil-Kyu PARK, Kwang-Su HWANGBO, Do-Gyun KIM, Geon-Woo MIN, Hae-Jin LIM, Min-Ki JO, Su-Ji CHOI, Bo-Hyun KANG, Jae-Woong KIM, Ji-Min JUNG, Jin-Hak KONG, Soon-O LEE, Kyu-Hyun CHOI
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Publication number: 20240136664Abstract: A battery includes an electrode assembly including a first electrode, a second electrode and a separator between the first electrode and the second electrode, the first electrode, the second electrode and the separator being wound around a winding axis to define a core and an outer peripheral surface. The first electrode and the second electrode include a first uncoated region and a second uncoated region along a winding direction, respectively, and an active material layer coating is absent in the first uncoated region and the second uncoated region. The battery further includes a housing receiving the electrode assembly through an opening formed at a bottom, a first current collector coupled to the first uncoated region and disposed within the housing, a cap covering the opening, a spacer interposed between the cap and the electrode assembly to fix the electrode assembly and seal the housing, and a terminal electrically connected to the second uncoated region.Type: ApplicationFiled: February 18, 2022Publication date: April 25, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Min-Ki JO, Bo-Hyun KANG, Do-Gyun KIM, Su-Ji CHOI, Kwang-Su HWANGBO, Hae-Jin LIM, Jae-Won LIM, Hak-Kyun KIM, Je-Jun LEE, Ji-Min JUNG, Geon-Woo MIN, Jae-Woong KIM
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Publication number: 20240128605Abstract: Provided are an electrode assembly, a battery, and a battery pack and vehicle including the same. An electrode assembly, in which a first electrode, a second electrode, and a separator interposed therebetween are wound about an axis to define a core and an outer circumferential surface. At least one of the first electrode and the second electrode includes, at a long side end portion, an uncoated portion exposed beyond the separator in a direction of the axis. At least a part of the uncoated portion is bent in a radial direction of the electrode assembly to define a bent surface region having overlapping layers of the uncoated portion. The bent surface region includes a welding target region having a number of the overlapping layers of the uncoated portion, and the welding target region extends along a radial direction of the electrode assembly.Type: ApplicationFiled: February 18, 2022Publication date: April 18, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Min-Woo KIM, Do-Gyun KIM, Kyung-Wook CHO, Geon-Woo MIN, Min-Ki JO, Jae-Woong KIM, Kwang-Su HWANGBO, Hae-Jin LIM, Su-Ji CHOI, Jae-Won LIM, Hak-Kyun KIM, Je-Jun LEE, Ji-Min JUNG
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Publication number: 20240128517Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on an axis to define a core and an outer circumference. The first electrode includes an uncoated portion at a long side end thereof and exposed out of the separator along a winding axis direction of the electrode assembly. A part of the uncoated portion is bent in a radial direction of the electrode assembly to form a bending surface region that includes overlapping layers of the uncoated portion, and in a partial region of the bending surface region, the number of stacked layers of the uncoated portion is 10 or more in the winding axis direction of the electrode assembly.Type: ApplicationFiled: January 19, 2022Publication date: April 18, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Hae-Jin LIM, Jin-Hak KONG, Soon-O LEE, Kyu-Hyun CHOI, Do-Gyun KIM, Su-Ji CHOI, Kwang-Su HWANGBO, Geon-Woo MIN, Min-Ki JO, Jae-Won LIM, Hak-Kyun KIM, Je-Jun LEE, Ji-Min JUNG, Jae-Woong KIM, Jong-Sik PARK, Yu-Sung CHOE, Byoung-Gu LEE, Duk-Hyun RYU, Kwan-Hee LEE, Jae-Eun LEE, Bo-Hyun KANG, Pil-Kyu PARK
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Publication number: 20240128590Abstract: A battery includes an electrode assembly including a first electrode, a second electrode and a separator between the first electrode and the second electrode wound around a winding axis to define a core and an outer circumferential surface, the first electrode including a first uncoated region in which an active material layer is not coated along a winding direction; a housing accommodating the electrode assembly through an open portion at a lower end thereof; a first current collector coupled to the first uncoated region and disposed in the housing; a cap to cover the open portion; and a spacer between the first current collector and the cap and having a height corresponding to a distance between the first current collector and the cap.Type: ApplicationFiled: February 18, 2022Publication date: April 18, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Geon-Woo MIN, Hae-Jin LIM, Do-Gyun KIM, Kwang-Su HWANGBO, Min-Ki JO, Bo-Hyun KANG, Su-Ji CHOI, Jae-Won LIM, Hak-Kyun KIM, Je-Jun LEE, Ji-Min JUNG
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Publication number: 20240065676Abstract: The present disclosure relates to an apparatus for controlling movement of an ultrasonic wave generating unit, the apparatus characterized by comprising: a transfer unit for moving the ultrasonic wave generating unit; and a control unit for controlling the operation of the ultrasonic wave generating unit and the transfer unit, wherein the control unit controls the ultrasonic wave generating unit such that, when the ultrasonic wave generating unit moves, ultrasonic waves are irradiated at intervals to the skin on a movement path of the ultrasonic wave generating unit.Type: ApplicationFiled: October 24, 2023Publication date: February 29, 2024Applicant: JEISYS MEDICAL INC.Inventors: Eun Ho KIM, Kwang Hyeok JUNG, Si Youn KIM, Dong Hwan KANG, Min Young KIM, Hyun Jin KIM, Kwang Ho RYU
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Patent number: 9865558Abstract: A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film having a differential scanning calorimeter onset temperature of 60° C. to 85° C., and a elastic modulus change of 30% or less, as calculated by Equation 1, below, Elastic modulus change(%)={(M1?M0)/M0}×100??[Equation 1] wherein M0 is an initial elastic modulus in kgf/cm2 of the anisotropic conductive film as measured at 25° C., and M1 is a elastic modulus in kgf/cm2 of the anisotropic conductive film as measured at 25° C. after the film is left at 25° C. for 170 hours.Type: GrantFiled: May 14, 2015Date of Patent: January 9, 2018Assignee: SAMSUNG SDI CO., LTD.Inventors: Young Ju Shin, Kyoung Ku Kang, Ji Yeon Kim, Kyoung Soo Park, Young Woo Park, Byeong Geun Son, Kyoung Hun Shin, Kwang Jin Jung, Jae Sun Han, Ja Young Hwang
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Patent number: 9657196Abstract: A semiconductor device connected by an anisotropic conductive film. The anisotropic conductive film includes a composition for an anisotropic conductive film including a first epoxy resin having an exothermic peak temperature of about 80° C. to about 110° C. and a second epoxy resin having an exothermic peak temperature of 120° C. to 200° C., as measured by differential scanning calorimetry (DSC). The first epoxy resin and the second epoxy resin are present in combined amount of about 30 wt % to about 50 wt % based on a total weight of the composition in terms of solid content. The second epoxy resin is present in an amount of about 60 to about 90 parts by weight based on 100 parts by weight of the first and second epoxy resins.Type: GrantFiled: January 26, 2015Date of Patent: May 23, 2017Assignee: Samsung SDI Co., Ltd.Inventors: Ji Yeon Kim, Kyoung Ku Kang, Kyoung Soo Park, Young Woo Park, Byeong Geun Son, Kyoung Hun Shin, Young Ju Shin, Kwang Jin Jung, Jae Sun Han, Ja Young Hwang
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Patent number: 9589696Abstract: A semiconductor device bonded by an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition having a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40, and a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less.Type: GrantFiled: November 2, 2012Date of Patent: March 7, 2017Assignee: CHEIL INDUSTRIES, INC.Inventors: Hyun Hee Namkung, Jae Sun Han, Hyun Wook Kim, Jin Young Seo, Kwang Jin Jung, Dong Seon Uh
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Patent number: 9534154Abstract: An electronic device includes an anisotropic conductive adhesive film as a connection material, wherein the anisotropic conductive adhesive film has a flowability of 50% or more after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and a connection resistance increment greater than 0% but not greater than 25%, as calculated by Expression 1: Connection resistance increment (%)=|(A?B)/A|×100??(Expression 1) where A is a connection resistance measured after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and B is a connection resistance measured after reliability evaluation at a temperature of 85° C. and a humidity of 85% for 250 hours following preliminary pressing and final pressing.Type: GrantFiled: December 21, 2012Date of Patent: January 3, 2017Assignee: Cheil Industries, Inc.Inventors: Jin Young Seo, Hyun Wook Kim, Hyun Hee Namkung, Kyung Il Sul, Dong Seon Uh, Kwang Jin Jung, Jae Sun Han
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Patent number: 9490229Abstract: Provided is a semiconductor device, including an anisotropic conductive film connecting the semiconductor device, the anisotropic conductive film having a maximum stress of 0.4 kgf/mm2 or more; and a stress-strain curve having a slope (A) of greater than 0 and less than or equal to 0.2 kgf/(mm2·%) as represented by the following equation 1: slope(A)=(½Smax?S0)/x??(1), wherein: Smax=maximum stress, x=strain (%) at half (½) of the maximum stress, and S0=stress at a strain of 0.Type: GrantFiled: October 29, 2014Date of Patent: November 8, 2016Assignee: Samsung SDI Co., Ltd.Inventors: Ji Yeon Kim, Kyoung Ku Kang, Kyoung Soo Park, Byeong Geun Son, Young Ju Shin, Kwang Jin Jung, Ja Young Hwang
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Patent number: 9389338Abstract: An optical member includes an anisotropic conductive film that has a multilayer structure having a bonding layer containing an epoxy resin as a curing part and a bonding layer containing a (meth)acrylate resin as a curing part.Type: GrantFiled: October 14, 2011Date of Patent: July 12, 2016Assignee: CHEIL INDUSTRIES, INC.Inventors: Dong Seon Uh, Hyun Hee Namkung, Kwang Jin Jung, Jin Seong Park, Jae Sun Han
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Patent number: 9331044Abstract: A semiconductor device connected by an anisotropic conductive film including a first insulation layer, a conductive layer, and a second insulation layer one above another, wherein the conductive layer has an expansion length of 20% or less in a width direction thereof, and the second insulation layer has an expansion length of 50% or more in a width direction thereof, the expansion length is calculated according to Equation 1, below, after glass substrates are placed on upper and lower sides of the anisotropic conductive film respectively, followed by compression at 110° C. to 200° C. for 3 to 7 seconds under a load of 1 MPa to 7 MPa per unit area of a sample, Increased ratio of expansion length (%)=[(length of corresponding layer in width direction after compression?length of corresponding layer in width direction before compression)/length of corresponding layer in width direction before compression]×100.Type: GrantFiled: September 29, 2014Date of Patent: May 3, 2016Assignee: SAMSUNG SDI CO., LTD.Inventors: Young Ju Shin, Kyoung Ku Kang, Ji Yeon Kim, Kyoung Soo Park, Woo Jung Shin, Kwang Jin Jung, Ja Young Hwang
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Publication number: 20160064349Abstract: A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film having a differential scanning calorimeter onset temperature of 60° C. to 85° C., and a elastic modulus change of 30% or less, as calculated by Equation 1, below, Elastic modulus change(%)={(M1?M0)/M0}×100??[Equation 1] wherein M0 is an initial elastic modulus in kgf/cm2 of the anisotropic conductive film as measured at 25° C., and M1 is a elastic modulus in kgf/cm2 of the anisotropic conductive film as measured at 25° C. after the film is left at 25° C. for 170 hours.Type: ApplicationFiled: May 14, 2015Publication date: March 3, 2016Inventors: Young Ju SHIN, Kyoung Ku KANG, Ji Yeon KIM, Kyoung Soo PARK, Young Woo PARK, Byeong Geun SON, Kyoung Hun SHIN, Kwang Jin JUNG, Jae Sun HAN, Ja Young HWANG
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Patent number: 9263372Abstract: A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a phenoxy resin including a fluorene-substituted phenoxy resin; and a radically polymerizable resin including a fluorene-substituted acrylate.Type: GrantFiled: December 20, 2012Date of Patent: February 16, 2016Assignee: CHEIL INDUSTRIES, INC.Inventors: Jae Sun Han, Hyun Wook Kim, Hyun Hee Namkung, Jin Young Seo, Kwang Jin Jung, Dong Seon Uh
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Publication number: 20150318257Abstract: A semiconductor device connected by an anisotropic conductive film. The anisotropic conductive film includes a composition for an anisotropic conductive film including a first epoxy resin having an exothermic peak temperature of about 80° C. to about 110° C. and a second epoxy resin having an exothermic peak temperature of 120° C. to 200° C., as measured by differential scanning calorimetry (DSC). The first epoxy resin and the second epoxy resin are present in combined amount of about 30 wt % to about 50 wt % based on a total weight of the composition in terms of solid content. The second epoxy resin is present in an amount of about 60 to about 90 parts by weight based on 100 parts by weight of the first and second epoxy resins.Type: ApplicationFiled: January 26, 2015Publication date: November 5, 2015Inventors: Ji Yeon KIM, Kyoung Ku KANG, Kyoung Soo PARK, Young Woo PARK, Byeong Geun SON, Kyoung Hun SHIN, Young Ju SHIN, Kwang Jin JUNG, Jae Sun HAN, Ja Young HWANG
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Patent number: 9035192Abstract: An anisotropic conductive adhesive composite and film include a binder and conductive particles dispersed in the binder. The conductive particles include a copper core particle and a metal coating layer coated on a surface of the corresponding copper core particle.Type: GrantFiled: December 21, 2010Date of Patent: May 19, 2015Assignee: CHEIL INDUSTRIES, INC.Inventors: Gyu Ho Lee, Young Woo Park, Il Rae Cho, Young Hun Kim, Kyoung Soo Park, Jin Seong Park, Dong Seon Uh, Kyung Jin Lee, Kwang Jin Jung
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Publication number: 20150123292Abstract: Provided is a semiconductor device, including an anisotropic conductive film connecting the semiconductor device, the anisotropic conductive film having a maximum stress of 0.4 kgf/mm2 or more; and a stress-strain curve having a slope (A) of greater than 0 and less than or equal to 0.2 kgf/(mm2·%) as represented by the following equation 1: slope(A)=(½Smax?S0)/x??(1), wherein: Smax=maximum stress, x=strain (%) at half (½) of the maximum stress, and S0=stress at a strain of 0.Type: ApplicationFiled: October 29, 2014Publication date: May 7, 2015Inventors: Ji Yeon KIM, Kyoung Ku KANG, Kyoung Soo PARK, Byeong Geun SON, Young Ju SHIN, Kwang Jin JUNG, Ja Young HWANG
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Publication number: 20150091192Abstract: A semiconductor device connected by an anisotropic conductive film including a first insulation layer, a conductive layer, and a second insulation layer one above another, wherein the conductive layer has an expansion length of 20% or less in a width direction thereof, and the second insulation layer has an expansion length of 50% or more in a width direction thereof, the expansion length is calculated according to Equation 1, below, after glass substrates are placed on upper and lower sides of the anisotropic conductive film respectively, followed by compression at 110° C. to 200° C. for 3 to 7 seconds under a load of 1 MPa to 7 MPa per unit area of a sample, Increased ratio of expansion length(%)=[(length of corresponding layer in width direction after compression?length of corresponding layer in width direction before compression)/length of corresponding layer in width direction before compression]×100.Type: ApplicationFiled: September 29, 2014Publication date: April 2, 2015Inventors: Young Ju SHIN, Kyoung Ku KANG, Ji Yeon KIM, Kyoung Soo PARK, Woo Jung SHIN, Kwang Jin JUNG, Ja Young HWANG
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Publication number: 20130161566Abstract: An electronic device includes an anisotropic conductive adhesive film as a connection material, wherein the anisotropic conductive adhesive film has a flowability of 50% or more after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and a connection resistance increment greater than 0% but not greater than 25%, as calculated by Expression 1: Connection resistance increment (%)=(A?B)/A×100??(Expression 1) where A is a connection resistance measured after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and B is a connection resistance measured after reliability evaluation at a temperature of 85° C. and a humidity of 85% for 250 hours following preliminary pressing and final pressing.Type: ApplicationFiled: December 21, 2012Publication date: June 27, 2013Inventors: Jin Young SEO, Hyun Wook KIM, Hyun Hee NAMKUNG, Kyung Il SUL, Dong Seon UH, Kwang Jin JUNG, Jae Sun HAN