Abstract: A MEMS device includes a substrate, a MEMS element portion disposed on a surface of the substrate, a cap having a cavity formed to oppose the MEMS element portion, and a diffusion prevention layer formed on at least a portion of the cap, wherein at least one of the cap and the substrate includes a bonding layer disposed outside of the cavity, and wherein the cap includes a spreading prevention portion disposed between the bonding layer and the cavity and having a V-shape in cross-section.

Abstract: Provided herein may be a memory device, a memory system including the memory device, and a method of operating the memory system. The memory device may include: a memory cell array including a plurality of memory blocks; a peripheral circuit configured to perform a program operation and an erase operation on any of the plurality of memory blocks; and a logic group configured to control the peripheral circuit to perform the program operation and the erase operation. The logic group may control the peripheral circuit to perform, during the program operation on a first memory block, selected as a current open block among the plurality of memory blocks, sub-operations of an erase operation on a second memory block to be selected as a subsequent open block.

Abstract: Provided herein may be a memory system and a method of operating the same. The method of operating a memory system may include receiving a first program command, and performing an operation corresponding to the first program command, receiving a second program command while performing the operation corresponding to the first program command, delaying setting of a queue status register for the second program command by a first wait time, receiving a third read command before the first wait time elapses, and setting the queue status register for the third read command before setting the queue status register for the second program command.

Abstract: An acoustic resonator package includes: a substrate; an acoustic resonator disposed on the substrate; a cap disposed on the substrate and the acoustic resonator; and a bonding portion bonding the substrate and the cap to each other, wherein the cap includes a trench formed around the bonding portion and a protective layer covering a surface of the trench in the cap, and wherein a portion of the bonding portion fills at least a portion of the trench.

Abstract: An acoustic resonator package includes a substrate, an acoustic resonator disposed on the substrate, the acoustic resonator including a first hydrophobic layer, a cap configured to accommodate the acoustic resonator, a bonding portion configured to bond the substrate to the cap, and a second hydrophobic layer disposed on the substrate at a position between the acoustic resonator and the bonding portion.

Abstract: Provided herein may be a memory system and a method of operating the same. The method of operating a memory system may include receiving a first program command, and performing an operation corresponding to the first program command, receiving a second program command while performing the operation corresponding to the first program command, delaying setting of a queue status register for the second program command by a first wait time, receiving a third read command before the first wait time elapses, and setting the queue status register for the third read command before setting the queue status register for the second program command.

Abstract: Provided herein may be a memory controller and a method of operating the same. The memory controller may control a write operation of a memory device in response to a write command received from a host. The memory controller includes a host interface, a buffer, and a first processor. The host interface is configured to receive write data corresponding to the write command from the host. The buffer is configured to store the write data. The first processor is configured to control operations of the host interface and the buffer. The first processor is configured to, when the write command is received, set an operation mode based on an operating status of the memory controller.

Abstract: A bulk acoustic filter device includes: a substrate including a through hole formed by a first recess and a second recess adjacent to the first recess; a membrane layer forming a cavity with the substrate; a filter including a lower electrode disposed on the membrane layer, a piezoelectric layer disposed to cover a portion of the lower electrode, and an upper electrode formed to cover a portion of the piezoelectric layer; and an electrode connecting member disposed in the substrate, and connected to either one of the lower electrode and the upper electrode, wherein the electrode connecting member includes an insertion electrode disposed in the first recess, and a via electrode connected to the insertion electrode, and disposed on an inner peripheral surface of the second recess and a surface of the substrate.

Abstract: Provided herein may be a memory system and a method of operating the memory system. The memory system may include a memory device configured to perform read operations and write operations, and a controller configured to control the memory device such that tasks received from a host are queued based on priorities thereof, and the read operations or the write operations corresponding to the tasks are executed according to a sequence of the queued tasks. The controller may divide the plurality of tasks into a plurality of types, assign different aging weights to the queued tasks depending on the respective types, accumulate an aging weight of an executed task of the queued tasks to a starvation state determination value of each of residual tasks of the queued tasks, and determine whether each of the residual tasks is in a starvation state using the corresponding starvation state determination value.

Abstract: Provided herein may be a memory device, a memory system including the memory device, and a method of operating the memory system. The memory device may include: a memory cell array including a plurality of memory blocks; a peripheral circuit configured to perform a program operation and an erase operation on any of the plurality of memory blocks; and a logic group configured to control the peripheral circuit to perform the program operation and the erase operation. The logic group may control the peripheral circuit to perform, during the program operation on a first memory block, selected as a current open block among the plurality of memory blocks, sub-operations of an erase operation on a second memory block to be selected as a subsequent open block.

Abstract: Provided herein may be a storage device and a method of operating the same. The method of operating a storage device including a replay protected memory block (RPMB) may include receiving a write request for the RPMB from an external host, selectively storing data in the RPMB based on an authentication operation, receiving a read request from the external host, and providing result data to the external host in response to the read request, wherein the read request includes a message indicating that a read command to be subsequently received from the external host is a command related to the result data.

Abstract: A memory system includes: a controller for selecting a pre-coding mode or a normal write mode in response to a host interface mode change command inputted from a host device; and a semiconductor memory device for storing, in an operating system (OS) storage area, OS data inputted from the host device in the pre-coding mode under the control of the controller.

Abstract: An acoustic wave filter device includes a base comprising an acoustic wave filter part formed on one surface thereof and including a bonding part formed to surround the acoustic wave filter part, and a cap including a depression groove formed therein and a bonding counterpart formed to correspond to the bonding part. The depression groove is positioned over the acoustic wave filter part. The bonding part and the bonding counterpart receive a voltage to deform and bond the bonding part and the bonding counterpart to each other.

Abstract: Provided is a method of manufacturing a carbon fiber sheet molding compound, the method including: performing sizing treatment on a carbon fiber using a sizing agent; cutting the sizing-treated carbon fiber into pieces; spraying the pieces of carbon fiber onto a first resin coated on a surface of a first carrier sheet; and uniting together a second resin coated on a second carrier sheet and a surface of the first resin, wherein the sizing agent, the first resin, and the second resin include the same compounds.

Abstract: An acoustic wave filter device includes a base having an acoustic wave filter part and a bonding part disposed thereon, the bonding part surrounding the acoustic wave filter part, and a cap having a bonding counterpart disposed thereon, the bonding counterpart being bonded to the bonding part of the base, and the bonding part includes a first bonding layer including gold, and the bonding counterpart includes a second bonding layer bonded to the first bonding layer and including tin.

Abstract: Provided herein may be a memory system and a method of operating the same. The method of operating a memory system may include receiving a first program command, and performing an operation corresponding to the first program command, receiving a second program command while performing the operation corresponding to the first program command, delaying setting of a queue status register for the second program command by a first wait time, receiving a third read command before the first wait time elapses, and setting the queue status register for the third read command before setting the queue status register for the second program command.

Abstract: A group member management support system and method are disclosed for effectively supporting group member management such as analysis of psychological states of students in a school and figuring out friend relations of students accordingly. The group member management support system includes a database storing self-expression index representing psychology or feeling of each member of a group, an interface server receiving the self-expression index through a network from the member to store the self-expression index in the database, and a member's terminal receiving the self-expression index to transmit the self-expression index to the interface server through the network; and a manager's terminal requesting and receiving the self-expression index from the interface server through the network to display or output the self-expression index.

Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate and the cap includes a protrusion engaging with the groove. A first metal layer and a second metal layer form a metallic bond with each other in a space between the groove and the protrusion.

Abstract: Disclosed is a patterning device. The patterning device may include a substrate; a patterned layer disposed on the substrate and including a first pattern formed on a surface thereof; a heat generating layer disposed on the patterned layer, including a second pattern (corresponding to the first pattern) formed on a surface thereof, and generating heat when electric power is supplied; and a first electrode and a second electrode disposed on the heat generating layer, spaced apart from each other, and electrically connected to the heat generating layer.

Abstract: An operating method of a memory system including a plurality of memory blocks may include grouping the pages of a selected memory block among the plurality of memory blocks based on a program time, sequentially performing a test read on the groups of the pages, detecting an error in the pages of the test-read groups, and reprogramming a page selected based on a result of the error detection.