Abstract: A computing system for virtualization-based resource management includes a plurality of physical machines, a plurality of virtual machines and a management virtual machine. The virtual machines are configured by virtualizing each of the plurality of physical machines. The management virtual machine is located at any one of the plurality physical machines. The management virtual machine monitors amounts of network resources utilized by the plurality of physical machines and time costs of the plurality of virtual machines, and performs a resource reallocation and a resource reclamation.

Abstract: Provided are a virtualization based high availability cluster system and a method for managing failures in a virtualization based high availability cluster system. The high availability cluster system includes a plurality of virtual nodes, and a plurality of physical nodes each including a message generator for generating a message denoting that the virtual nodes are in a normal state and transmitting the generated message to virtual nodes in a same physical node.

Abstract: A leadless semiconductor package mainly includes a semiconductor device securely attached to an upper surface of a die pad by solder paste and a plurality of leads arranged about the periphery of the die pad. The thickness of the leads and the die pad are within a range of 10 to 20 mils. The semiconductor device is electrically coupled to one of the leads. A package body is formed over the semiconductor device and the leads in a manner that the lower surfaces of the die pad and the leads are exposed through the package body. Preferably, the first semiconductor device is electrically coupled to one of the leads by at least one heavy gauge aluminum wire. The present invention further provides a method of producing the semiconductor package described above.

Abstract: A leadless semiconductor package mainly includes a semiconductor device securely attached to an upper surface of a die pad by solder paste and a plurality of leads arranged about the periphery of the die pad. The thickness of the leads and the die pad are within a range of 10 to 20 mils. The semiconductor device is electrically coupled to one of the leads. A package body is formed over the semiconductor device and the leads in a manner that the lower surfaces of the die pad and the leads are exposed through the package body. Preferably, the first semiconductor device is electrically coupled to one of the leads by at least one heavy gauge aluminum wire. The present invention further provides a method of producing the semiconductor package described above.