Abstract: An integrated circuit package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween and a semiconductor die mounted on the first surface of the substrate. A plurality of wire bonds connect the semiconductor die to ones of the conductive traces of the substrate and an encapsulant encapsulates the wirebonds and the semiconductor die. A heat spreader has a cap, at least a portion of the cap extending inwardly toward and being spaced from the semiconductor die. The encapsulant fills the space between the portion of the cap and the semiconductor die. The heat spreader further has at least one sidewall extending from the cap, the at least one sidewall disposed on the substrate. A ball grid array is disposed on the second surface of the substrate, bumps of the ball grid array being in electrical connection with ones of the conductive traces.

Abstract: A multiplexer tree operable to control an output a sequence of data stored in a plurality of storage units in accordance with a non-linear address sequence that has less bit transition counts than a linear address sequence. The non-linear address sequence is provided to the selection inputs of the multiplexer tree and causes the levels having greater numbers of multiplexers to toggle less frequently than the levels having smaller numbers of multiplexers. The non-linear address sequence may comprise a Gray code sequence where every two adjacent addresses differ by a single bit. The non-linear address sequence may be optimized to minimize transistor switching in the multiplexer tree.

Abstract: The embodiments disclosed herein describe the dynamic control of a switching power converter between different operation modes of the switching power converter. In one embodiment, the operation modes of the switching power converter include a switching mode and a linear mode. The switching power converter may be included in a LED lamp system according to one embodiment.

Abstract: A controller of a switching power converter includes a voltage protection circuit that generates a modified supply voltage that does not exceed a predetermined threshold voltage to power one or more components of the controller.

Abstract: A method is provided for merging different load forecasts for power grid centers. Area load forecasts are accepted from load forecast engines. A relational database saves load forecast engine data. A comprehensive operating plan integrates individual load forecasts into a composite load forecast to present a comprehensive, synchronized and harmonized load forecast.

Abstract: An integrated circuit package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween and a semiconductor die mounted on the first surface of the substrate. A plurality of wire bonds connect the semiconductor die to ones of the conductive traces of the substrate and an encapsulant encapsulates the wirebonds and the semiconductor die. A heat spreader has a cap, at least a portion of the cap extending inwardly toward and being spaced from the semiconductor die. The encapsulant fills the space between the portion of the cap and the semiconductor die. The heat spreader further has at least one sidewall extending from the cap, the at least one sidewall disposed on the substrate. A ball grid array is disposed on the second surface of the substrate, bumps of the ball grid array being in electrical connection with ones of the conductive traces.

Abstract: A switching power converter comprises a transformer (110), a switch (108) coupled to the transformer (110), and a switch controller (200) coupled to the switch (108) for generating a switch drive signal (207) to turn on or off the switch (108). The drive current of the switch drive signal (207) is adjusted dynamically according to line or load conditions within a switching cycle and/or over a plurality of switching cycles. The magnitude of the drive current can be dynamically adjusted within a switching cycle and/or over a plurality of switching cycles, in addition to the pulse widths or pulse frequencies of the drive current.

Abstract: The drive current of the switch in a switching power converter is adjusted dynamically according to line or load conditions within a switching cycle and/or over a plurality of switching cycles. The magnitude of the switch drive current can be dynamically adjusted within a switching cycle and/or over a plurality of switching cycles, in addition to the pulse widths or pulse frequencies of the switch drive current.

Abstract: A power converter that controls a collector current of a bipolar junction transistor (BJT) by controlling the base current to the BJT after having determined the gain of the BJT. A gain detection block determines a gain of the BJT during a first mode. A current calculation block generates a current setting for the base current based on the gain of the BJT determined by the gain detection block during a second mode distinct from the first mode. In some embodiments, the power converter may be included in a LED lamp system.

Abstract: The embodiments disclosed herein describe the dynamic control of a switching power converter between different operation modes of the switching power converter. In one embodiment, the operation modes of the switching power converter include a switching mode and a linear mode. The switching power converter may be included in a LED lamp system according to one embodiment.

Abstract: A method is provided for merging different load forecasts for power grid centers. Area load forecasts are accepted from load forecast engines. A relational database saves load forecast engine data. A comprehensive operating plan integrates individual load forecasts into a composite load forecast to present a comprehensive, synchronized and harmonized load forecast.

Abstract: The embodiments herein describe a dynamic metal-oxide-semiconductor field-effect transistor (MOSFET) gate driver system architecture and control scheme. The MOSFET gate driver system dynamically adjusts both the gate driver turn-on-resistance and the gate driver turn-off resistance within a single (i.e., one) switching cycle to reduce electromagnetic interference (EMI) in the system and to minimize the conduction loss of a power MOSFET during operation.

Abstract: Embodiments described herein provide a method of manufacturing integrated circuit (IC) devices. The method includes coupling a first surface of a first intermediate substrate to a first surface of a second intermediate substrate, forming a first plurality of patterned metal layers on a second surface of the first intermediate substrate to form a first substrate and a second plurality of patterned metal layers on a second surface of the second intermediate substrate to form a second substrate, and separating the first and second substrates. Each of the first substrate and the second substrate is configured to facilitate electrical interconnection between a respective IC die and a respective printed circuit board (PCB).

Abstract: A method of manufacturing a printed circuit board is disclosed. A conductive metal layer is formed on a first surface of a dielectric substrate. One or more vias are formed through the substrate. A conductive metal layer is formed on the first surface of the substrate and is patterned to form conductive traces on the first surface of the substrate. A plating mask is formed on the second surface of the substrate. One or more openings are formed in the plating mask to correspond to the location of the via(s). Conductive metal is deposited in the via(s) sufficient to substantially fill the via(s) and make contact with the conductive metal layer on the first surface and substantially to the level of the plating mask. The plating mask is removed from the substrate such that one or more conductive posts extend outwardly from the second surface of the substrate.

Abstract: An integrated circuit package having a selectively etched leadframe strip defining a die attach pad and a plurality of contact pads, at least one side of the die attach pad having a plurality of spaced apart pad portions; a semiconductor die mounted to the die attach pad and wires bonding the semiconductor die to respective ones of the contact pads; a first surface of the leadframe strip, including the semiconductor die and wire bonds, encapsulated in a molding material such that at least one surface of the leadframe strip is exposed, and wherein solder paste is disposed on said contact pads and said at least one side of said die attach pad.

Abstract: Various structures and fabrication methods for leadless plastic chip carrier (QFN) packages which utilize carriers in strip format, wherein the leads (or terminals) are formed to be electrically isolated from one another within each unit and in which the units are formed to be electrically isolated from one another within the strip using chemical etching techniques.

Abstract: A storage unit having a first sheet having a female connection member defining an opening, and a second sheet having a male connection member. The male connection member can have a neck portion dimensioned to be received in the opening, and can have a retaining portion that is wider than the opening and configured to couple the male and female connection members together. The retaining portion can have a concave edge opposite from the neck portion.

Abstract: A system tool that provides dispatchers in power grid control centers with a capability to manage changes. Included is a user interface and a plurality of scheduler engines. Each scheduler engine is configured to look ahead at different time frames to forecast system conditions and alter generation patterns within the different time frames. A comprehensive operating plan holds schedules generated by the plurality of scheduler engines. A relational database is coupled to the comprehensive operating plan. Input data is initially received from the relational database for each scheduling engine, and thereafter the relational database receives data from the scheduling engines relative to forecast system conditions.

Abstract: Methods are provided that enable dispatchers in power grid control centers to manage changes. A comprehensive operating plan is provided with multiple, security constrained economic dispatch engines 1, 2 and 3. The scheduler engines are security constrained unit commitments and economic dispatch sequences with different look-ahead periods. The comprehensive operation plan is configured to integrate scheduler engines into a unified scheduling system. The comprehensive operating plan includes a repository of all operating plans in a multi-stage decision process.

Abstract: A decision-support tool is provided to evaluate operational and financial performance for dispatchers in power grid control centers associated with utility systems. A scheduler engine is coupled to a comprehensive operating plan that applies after the fact analysis for performance metrics, root-cause impacts and process re-engineering. A relational database is coupled to a data archiver that captures actual system and resource conditions and then supplies the system and resource conditions to the relational database. The scheduler engine receives the actual system and resource conditions from the relational database and processes it to calculate system performance.