Abstract: A small-sized surface-mounted fuse and a method of manufacturing the same. A fusing element, separated from a winding member, is connected to lead wires by arc welding instead of soldering. Consequently, the present invention has the effect of improving fusing characteristics and productivity while reducing the defective rate and manufacturing costs.

Abstract: A polishing pad is provided. The polishing pad includes a polishing layer composed of a polymeric matrix and liquid microelements embedded in the polymeric matrix. Open pores defined by the embedded liquid microelements are distributed across a surface of the polishing layer. Due to the microstructural open pores uniformly distributed across a surface of the polishing pad, a polishing operation can be performed at high precision. The polishing pad shows constant polishing performance during the polishing operation, can be stably used, and does not cause a wafer to be scratched. In addition, a method of manufacturing the polishing pad is provided. Since all components used to manufacture the polishing pad are in a liquid phase, manufacturing can be easily performed.

Abstract: An apparatus for pre-processing a speech signal capable of improving the performance of speech signal processing by extracting the characteristics of noise that are distinguished from those of speech, and a method for extracting a speech end-point for the apparatus are provided. The apparatus includes a noise/speech determination unit for calculating noise information from at least one of an initial frame and a final frame of an input speech signal and determining if a current frame of the speech signal is a noise frame or a speech frame using the noise information, a hangover application unit for determining a predetermined number of frames transmitted after the current frame as consecutive speech frames when the current frame is the speech frame, and a speech information update unit for storing the speech frame and the consecutive speech frames.

Abstract: An apparatus and method for detecting a voice signal end point are provided, in which at least two microphones receive signals including voice and noise signals, and a voice end point detector distinguishes voice frames from noise frames in the received signals based on phase differences in respective frequencies between the received signals, and detecting the end point of the voice signal according to a time order of the voice frames and the noise frames.

Abstract: Embodiments of the invention provide a semiconductor wafer cleaning apparatus and a related method. In one embodiment, the invention provides a semiconductor wafer cleaning apparatus comprising a wafer stage adapted to support a wafer; a first cleaning unit adapted to spray a first cleaning solution onto the wafer to remove particles from the wafer, wherein the first cleaning solution prevents static electricity from being generated on the surface of the wafer; and a second cleaning unit adapted to provide a second cleaning solution onto the wafer and oscillate a quartz rod to remove particles from the wafer, wherein the second cleaning solution makes a surface of the wafer hydrophilic.

Abstract: Automatic controllable display device according to image display direction comprising: image display matter which image displayed in; slope information controller for detecting slope information of the image display matter; main controller for generating image controlling signal as a slope of the image display matter and receiving the slope information of image display matter which is detected by the image information controller; image display controller which handle image signal for displaying in the image display matter by image controlling signal; image display memory for storing the image signal, and furnishing the image display matter the image signal.

Abstract: A polishing pad is provided. The polishing pad includes a polishing layer composed of a polymeric matrix and liquid microelements embedded in the polymeric matrix. Open pores defined by the embedded liquid microelements are distributed across a surface of the polishing layer. Due to the microstructural open pores uniformly distributed across a surface of the polishing pad, a polishing operation can be performed at high precision. The polishing pad shows constant polishing performance during the polishing operation, can be stably used, and does not cause a wafer to be scratched. In addition, a method of manufacturing the polishing pad is provided. Since all components used to manufacture the polishing pad are in a liquid phase, manufacturing can be easily performed.

Abstract: An integral polishing pad includes an elastic support layer and a polishing layer, which is formed on the elastic support layer and has a higher hardness than the elastic support layer. The elastic support layer and the polishing layer are made from materials chemically compatible with each other so that a structural border between the elastic support layer and the polishing layer does not exist. In addition, the integral polishing pad also includes a transparent region, which is transparent to a light source used to detect the surface state of an object being polished and integrated with the other elements of the integral polishing pad. The integral polishing pad has high planarization efficiency and uniform properties, and thus can be reliably used for polishing. In addition, the integral polishing pad prevents a congestion of a polishing slurry and facilitates delivery of the polishing slurry.

Abstract: An integral polishing pad includes an elastic support layer and a polishing layer, which is formed on the elastic support layer and has a higher hardness than the elastic support layer. The elastic support layer and the polishing layer are made from materials chemically compatible with each other so that a structural border between the elastic support layer and the polishing layer does not exist. In addition, the integral polishing pad also includes a transparent region, which is transparent to a light source used to detect the surface state of an object being polished and integrated with the other elements of the integral polishing pad. The integral polishing pad has high planarization efficiency and uniform properties, and thus can be reliably used for polishing. In addition, the integral polishing pad prevents a congestion of a polishing slurry and facilitates delivery of the polishing slurry.

Abstract: Automatic controllable display device according to image display direction comprising: image display matter which image displayed in; slope information controller for detecting slope information of the image display matter; main controller for generating image controlling signal as a slope of the image display matter and receiving the slope information of image display matter which is detected by the image information controller; image display controller which handle image signal for displaying in the image display matter by image controlling signal; image display memory for storing the image signal, and furnishing the image display matter the image signal.

Abstract: A polishing pad is provided. The polishing pad includes a polishing layer composed of a polymeric matrix and liquid microelements embedded in the polymeric matrix. Open pores defined by the embedded liquid microelements are distributed across a surface of the polishing layer. Due to the microstructural open pores uniformly distributed across a surface of the polishing pad, a polishing operation can be performed at high precision. The polishing pad shows constant polishing performance during the polishing operation, can be stably used, and does not cause a wafer to be scratched. In addition, a method of manufacturing the polishing pad is provided. Since all components used to manufacture the polishing pad are in a liquid phase, manufacturing can be easily performed.

Abstract: The invention relates to a method of forming wiring in a semiconductor device. In order to prevent a lift or a crack generated when nitride films having different physical properties come in contact, the invention uses a nitride film having a similar stress characteristic; a nitride film that can be deposited by a low pressure chemical vapor deposition (LPCVD) method in a single type chamber capable of processing wafers one by one, and a nitride film that can be deposited by a low pressure chemical vapor deposition (LPCVD) method in a batch type chamber capable of processing several sheet of wafers.

Abstract: A view port of chemical vapor deposition apparatus for manufacturing semiconductor devices prevents heat loss in a chamber during a plasma deposition process. The view port includes a bracket protruding at the circumference of an opening in an electrode serving as a wall of a chamber of the apparatus, a transparent window pressed by the bracket against the wall via an O-ring, a pivoting cap for capping an opening in the bracket aligned with the window, and heat-insulative material and/or a heating element integral with the cap so as to be positioned close to the window when the cap is closed. The heating element can be a resistive heating wire or a warm air duct formed by a hose or the like. During the deposition process, the temperature of the window is maintained, thereby minimizing the tendency of polymer to adhere to the window.

Abstract: A view port of chemical vapor deposition apparatus for manufacturing semiconductor devices prevents heat loss in a chamber during a plasma deposition process. The view port includes a bracket protruding at the circumference of an opening in an electrode serving as a wall of a chamber of the apparatus, a transparent window pressed by the bracket against the wall via an O-ring, a pivoting cap for capping an opening in the bracket aligned with the window, and heat-insulative material and/or a heating element integral with the cap so as to be positioned close to the window when the cap is closed. The heating element can be a resistive heating wire or a warm air duct formed by a hose or the like. During the deposition process, the temperature of the window is maintained, thereby minimizing the tendency of polymer to adhere to the window.

Abstract: A plasma processing apparatus includes a plasma generating electrode containing at least one protrusion for improving the plasma density and uniformity. The apparatus may be a plasma dry etching apparatus, a plasma enhanced CVD deposition apparatus or a sputtering apparatus.

Abstract: A wafer sensing apparatus for sensing whether a wafer is inserted in a wafer cassette. The wafer sensing apparatus includes a light emitting device for emitting light of a predetermined wavelength toward the inside of a wafer cassette, a light sensing device, positioned opposite to the light emitting device, for sensing the emitted light, and an optical filter device for passing light corresponding only to the predetermined wavelength of light emitted from the light emitting device. The light sensing device is not affected by interference light from outside sources that can cause a faulty wafer sensing function, since the interfering light is reflected or absorbed by the optical filter device. Equipment malfunctions caused by faulty sensing from the light sensing device are prevented, thereby improving the equipment operating efficiency.