Abstract: A memory system including a controller that generates a processor clock, and a plurality of memory devices each including an internal clock generator that generates an internal clock in synchronization with the processor clock, and a memory that performs a peak current generation operation in synchronization with the internal clock, wherein at least two of the memory devices generate their respective internal clocks at different times such that the corresponding peak current generation operations are performed at different times.

Abstract: A memory system including a controller that generates a processor clock, and a plurality of memory devices each including an internal clock generator that generates an internal clock in synchronization with the processor clock, and a memory that performs a peak current generation operation in synchronization with the internal clock, wherein at least two of the memory devices generate their respective internal clocks at different times such that the corresponding peak current generation operations are performed at different times.

Abstract: A memory system includes a controller that generates a processor clock, and a plurality of memory devices each including an internal clock generator that generates an internal clock in synchronization with the processor clock, and a memory that performs a peak current generation operation in synchronization with the internal clock, wherein at least two of the memory devices generate their respective internal clocks at different times such that the corresponding peak current generation operations are performed at different times.

Abstract: A semiconductor memory device has a memory cell region and a peripheral region. The device includes low voltage transistors at the peripheral region having gate insulation films with different thicknesses. For example, a gate insulation film of a low voltage transistor used in an input/output circuit of the memory device may be thinner than the gate insulation film of a low voltage transistor used in a core circuit for the memory device. Since low voltage transistors used at an input/output circuit are formed to be different from low voltage transistors used at a core circuit or a high voltage pump circuit, high speed operation and low power consumption characteristics of a non-volatile memory device may be.

Abstract: A semiconductor memory device includes a plurality of memory areas. Each of the memory areas includes a normal cell array and a redundancy cell array for repairing defective cells generated in the normal cell array such that the semiconductor memory device is usable even when memory arrays include defective cells. A size of a redundancy cell array of a first memory area is greater than a size of the redundancy cell arrays of the other memory areas.

Abstract: A memory system comprises a controller that generates a processor clock, and a plurality of memory devices each comprising an internal clock generator that generates an internal clock in synchronization with the processor clock, and a memory that performs a peak current generation operation in synchronization with the internal clock, wherein at least two of the memory devices generate their respective internal clocks at different times such that the corresponding peak current generation operations are performed at different times.

Abstract: A semiconductor memory device has a memory cell region and a peripheral region. The device includes low voltage transistors at the peripheral region having gate insulation films with different thicknesses. For example, a gate insulation film of a low voltage transistor used in an input/output circuit of the memory device may be thinner than the gate insulation film of a low voltage transistor used in a core circuit for the memory device. Since low voltage transistors used at an input/output circuit are formed to be different from low voltage transistors used at a core circuit or a high voltage pump circuit, high speed operation and low power consumption characteristics of a non-volatile memory device may be.

Abstract: Example embodiments relate to a line defect detection circuit, including a first driver disposed at one end of a line and configured to drive the line using a first voltage or a second voltage in response to a control signal, and a second driver disposed at the other end of the line and configured to drive the line using the second voltage in response to a stress signal.

Abstract: Example embodiments relate to a semiconductor memory device and a system in which a plurality of semiconductor layers are stacked on each other. A 3-dimensional (3D) semiconductor memory device may include a plurality of semiconductor layers that are stacked on each other. The plurality of semiconductor layers may have the same memory cell structure. The 3D semiconductor memory device may include a first memory region including at least one semiconductor layer for storing system data and a second memory region including at least one semiconductor layer for storing data aside from the system data. The system data may include at least one piece of data selected from the group consisting of a booting code, a system code, and application software.

Abstract: A synchronous semiconductor memory device having an on-die termination (ODT) circuit, and an ODT method, satisfy ODT DC and AC parameter specifications and perform an adaptive impedance matching through an external or internal control, by executing an ODT operation synchronized to an external clock. The synchronous semiconductor memory device having a data output circuit for performing a data output operation synchronously to the external clock includes the ODT circuit for generating ODT up and down signals having the same timing as data output up and down signals for the data output operation, to perform the ODT operation.

Abstract: A delay locked loop adapted to delay an external clock signal and to output an internal clock signal, the delay locked loop including a renewal signal generator that outputs a renewal signal that is selectively activated and inactivated, a replica path that is active when the renewal signal is activated and is inactive when the renewal signal is inactivated, the replica path delaying the internal clock signal by a delay time of a normal path of a semiconductor device to output a replica internal clock signal when the renewal signal is activated, a control signal generator adapted to vary and to output a delay control signal according to a phase difference between the external and the replica internal clock signals, and a variable delay circuit adapted to delay the external clock signal by a time corresponding to the delay control signal and to output the internal clock signal.

Abstract: A synchronous semiconductor memory device having an on-die termination (ODT) circuit, and an ODT method, satisfy ODT DC and AC parameter specifications and perform an adaptive impedance matching through an external or internal control, by executing an ODT operation synchronized to an external clock. The synchronous semiconductor memory device having a data output circuit for performing a data output operation synchronously to the external clock includes the ODT circuit for generating ODT up and down signals having the same timing as data output up and down signals for the data output operation, to perform the ODT operation.

Abstract: An integrated circuit memory device may include a memory cell array and a plurality of data input/output pins. The plurality of data input/output pins may be configured to receive data from a memory controller to be written to the memory cell array during a data write operation, and the data input/output pins may be further configured to provide data to the memory controller from the memory cell array during a data read operation. A mode register may be configured to store information defining an operational characteristic of the memory device, and the mode register may be configured to be set using the data input/output bus. Related methods, systems, and additional devices are also discussed.

Abstract: A termination resistor is mounted on a memory circuit and provides a termination resistance for the memory circuit. The termination resistor includes a node, a plurality of first termination resistors responsive to a corresponding control signal and connected between a power voltage and the node, and a plurality of second termination resistors responsive to a corresponding control signal and connected between a ground voltage and the node.

Abstract: Example embodiments of the present invention include a memory device testable without using data and a dataless test method. The memory device includes a plurality of registers to store test patterns, the registers being coupled to input/output DQ pads. The test patterns are stored in the registers when a mode register of the memory device is set. The memory device transfers the test patterns to a DQ pad responsive to a write test signal, and transfers the test patterns from the DQ pad to a data input buffer responsive to a read test signal. The memory device writes the test patterns transferred to the data input buffer to memory cells. The memory device reads data stored in the memory cells responsive to the write test signal and transfers the memory cell data from the DQ pad to a comparator responsive to the read test signal. The memory device compares the test patterns to the memory cell data transferred to the comparator and generates an indicator signal to indicate the comparison result.

Abstract: A delay locked loop adapted to delay an external clock signal and to output an internal clock signal, the delay locked loop including a renewal signal generator that outputs a renewal signal that is selectively activated and inactivated, a replica path that is active when the renewal signal is activated and is inactive when the renewal signal is inactivated, the replica path delaying the internal clock signal by a delay time of a normal path of a semiconductor device to output a replica internal clock signal when the renewal signal is activated, a control signal generator adapted to vary and to output a delay control signal according to a phase difference between the external and the replica internal clock signals, and a variable delay circuit adapted to delay the external clock signal by a time corresponding to the delay control signal and to output the internal clock signal.

Abstract: The present invention relates to a synchronous semiconductor memory device with double data rate, and more particularly, to a synchronous semiconductor memory device for inputting and outputting data using a free-running clock and inserting a preamble indicative of start of data into the outputted data. A semiconductor memory device of the present invention receives a data read command from the exterior of the memory device in response to a predetermined clock signal inputted from the exterior, and outputting data including a preamble in response to the clock signal.

Abstract: A termination resistor is mounted on a memory circuit and provides a termination resistance for the memory circuit. The termination resistor includes a node, a plurality of first termination resistors responsive to a corresponding control signal and connected between a power voltage and the node, and a plurality of second termination resistors responsive to a corresponding control signal and connected between a ground voltage and the node.

Abstract: The present invention relates to a synchronous semiconductor memory device with double data rate, and more particularly, to a synchronous semiconductor memory device for inputting and outputting data using a free-running clock and inserting a preamble indicative of start of data into the outputted data. A semiconductor memory device of the present invention receives a data read command from the exterior of the memory device in response to a predetermined clock signal inputted from the exterior, and outputting data including a preamble in response to the clock signal.

Abstract: The present invention relates to a synchronous semiconductor memory device with double data rate, and more particularly, to a synchronous semiconductor memory device for inputting and outputting data using a free-running clock and inserting a preamble indicative of start of data into the outputted data. A semiconductor memory device of the present invention receives a data read command from the exterior of the memory device in response to a predetermined clock signal inputted from the exterior, and outputting data including a preamble in response to the clock signal.